Dicing tape

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Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.

A semiconductor wafer on a dicing (blue) tape. Few chips (dies) from the wafer have already been picked up (removed) for further manufacturing.

Tape types[]

Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafer.[1] It is available in a variety of thicknesses, from 75 to 150 micrometers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.[2]

  • UV tapes are dicing tapes in which the adhesive bond is broken by exposure to UV light after dicing, allowing the adhesive to be stronger during cutting while still allowing clean and easy removal.[3] UV equipment can range from low power (a few mW/cm2) to high power (more than 200 mW/cm2). Higher power results in a more complete cure, lower adhesion and reduced adhesive residue.[4]
  • Thermal release tapes (typically PET material) have been developed for specific cases when etching or material printing is needed after the tape is installed. These tapes can also handle heavy substrates such as ceramic substrates or printed circuit boards (PCBs/PWBs) if needed. Their adhesion disappears when heat (typically 90 to 170 °C (194 to 338 °F)) is applied.[5]
  • In August 2017, Furukawa Electric started mass production of expand separation dicing tape to provide a higher grade separation of integrated circuit chips from wafers after the stealth dicing process. This new version of dicing tape provides uniform expansion of chips without any external stretching, separating the wafers in a near perfect condition.[6]

References[]

  1. ^ "Products: Dicing Tape". Lintec of America. Accessed 11 June 2012.
  2. ^ "Standard Dicing Tape". Semiconductor Equipment Corp. Accessed 9/27/2016.
  3. ^ "UV Tape vs Non-UV Tape Archived 2011-06-20 at the Wayback Machine". Semiconductor Tapes and Materials. Accessed 23 July 2010.
  4. ^ "UV Irradiation Systems". Lintec of America. Accessed 12 June 2012.
  5. ^ Heat release tape
  6. ^ Furukawa, Writer (2017-08-16). "Furukawa starts stealth dicing tape production". EET Asia. Furukawa Electric. Retrieved 2021-09-05.

External links[]


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