This article has multiple issues. Please help or discuss these issues on the talk page. (Learn how and when to remove these template messages)
The topic of this article may not meet Wikipedia's general notability guideline. Please help to demonstrate the notability of the topic by citing reliable secondary sources that are independent of the topic and provide significant coverage of it beyond a mere trivial mention. If notability cannot be shown, the article is likely to be merged, redirected, or deleted. Find sources: – ···scholar·JSTOR(March 2015) (Learn how and when to remove this template message)
This article does not cite any sources. Please help by adding citations to reliable sources. Unsourced material may be challenged and removed. Find sources: – ···scholar·JSTOR(March 2015) (Learn how and when to remove this template message)
(Learn how and when to remove this template message)
Wedge bonding is a kind of wire bonding which relies on the application of and force to form bonds. It is a popular method and is commonly used in the semiconductor industry.
This industry-related article is a stub. You can help Wikipedia by .
