Silicon–germanium

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SiGe (/ˈsɪɡiː/ or /ˈsaɪdʒiː/), or silicon–germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si1−xGex. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. IBM introduced the technology into mainstream manufacturing in 1989.[1] This relatively new technology offers opportunities in mixed-signal circuit and analog circuit IC design and manufacture. SiGe is also used as a thermoelectric material for high=temperature applications (>700 K).

Production[]

The use of silicon–germanium as a semiconductor was championed by Bernie Meyerson.[2] SiGe is manufactured on silicon wafers using conventional silicon processing toolsets. SiGe processes achieve costs similar to those of silicon CMOS manufacturing and are lower than those of other heterojunction technologies such as gallium arsenide. Recently, organogermanium precursors (e.g. isobutylgermane, alkylgermanium trichlorides, and dimethylaminogermanium trichloride) have been examined as less hazardous liquid alternatives to germane for MOVPE deposition of Ge-containing films such as high purity Ge, SiGe, and strained silicon.[3][4]

SiGe foundry services are offered by several semiconductor technology companies. AMD disclosed a joint development with IBM for a SiGe stressed-silicon technology,[5] targeting the 65 nm process. TSMC also sells SiGe manufacturing capacity.

In July 2015, IBM announced that it had created working samples of transistors using a 7 nm silicon–germanium process, promising a quadrupling in the amount of transistors compared to a contemporary process.[6]

SiGe transistors[]

SiGe allows CMOS logic to be integrated with heterojunction bipolar transistors, making it suitable for mixed-signal circuits.[7] Heterojunction bipolar transistors have higher forward gain and lower reverse gain than traditional homojunction bipolar transistors. This translates into better low-current and high-frequency performance. Being a heterojunction technology with an adjustable band gap, the SiGe offers the opportunity for more flexible bandgap tuning than silicon-only technology.

Silicon–germanium on insulator (SGOI) is a technology analogous to the silicon on insulator (SOI) technology currently employed in computer chips. SGOI increases the speed of the transistors inside microchips by straining the crystal lattice under the MOS transistor gate, resulting in improved electron mobility and higher drive currents. SiGe MOSFETs can also provide lower junction leakage due to the lower bandgap value of SiGe.[citation needed] However, a major issue with SGOI MOSFETs is the inability to form stable oxides with silicon–germanium using standard silicon oxidation processing.

Thermoelectric application[]

A silicon–germanium thermoelectric device MHW-RTG3 was used in the Voyager 1 and 2 spacecraft.[8] Silicon–germanium thermoelectric devices were also used in other MHW-RTGs and GPHS-RTGs aboard Cassini, Galileo, Ulysses.[9]

Light emission[]

By controlling the composition of a hexagonal SiGe alloy, researchers from Eindhoven University of Technology developed a material that can emit light.[10] In combination with its electronic properties, this opens up the possibility of producing a laser integrated into a single chip to enable data transfer using light instead of electric current, speeding up data transfer while reducing energy consumption and need for cooling systems. The international team, with lead authors Elham Fadaly, Alain Dijkstra and Erik Bakkers at Eindhoven University of Technology in the Netherlands and Jens Renè Suckert at Friedrich-Schiller-Universität Jena in Germany, were awarded the 2020 Breakthrough of the Year award by the magazine Physics World. [11]

See also[]

References[]

  1. ^ Ouellette, Jennifer (June/July 2002). "Silicon–Germanium Gives Semiconductors the Edge". Archived 2008-05-17 at the Wayback Machine, The Industrial Physicist.
  2. ^ Meyerson, Bernard S. (March 1994). "High-Speed Silicon-Germanium Electronics". Scientific American. 270 (3): 62–67. Bibcode:1994SciAm.270c..62M. doi:10.1038/scientificamerican0394-62.
  3. ^ Woelk, Egbert; Shenai-Khatkhate, Deodatta V.; DiCarlo, Ronald L.; Amamchyan, Artashes; Power, Michael B.; Lamare, Bruno; Beaudoin, Grégoire; Sagnes, Isabelle (January 2006). "Designing novel organogermanium OMVPE precursors for high-purity germanium films". Journal of Crystal Growth. 287 (2): 684–687. Bibcode:2006JCrGr.287..684W. doi:10.1016/j.jcrysgro.2005.10.094.
  4. ^ Shenai, Deo V.; DiCarlo, Ronald L.; Power, Michael B.; Amamchyan, Artashes; Goyette, Randall J.; Woelk, Egbert (January 2007). "Safer alternative liquid germanium precursors for relaxed graded SiGe layers and strained silicon by MOVPE". Journal of Crystal Growth. 298: 172–175. Bibcode:2007JCrGr.298..172S. doi:10.1016/j.jcrysgro.2006.10.194.
  5. ^ AMD And IBM Unveil New, Higher Performance, More Power Efficient 65nm Process Technologies At Gathering Of Industry’s Top R&D Firms, retrieved at March 16, 2007.
  6. ^ Markoff, John (9 July 2015). "IBM Discloses Working Version of a Much Higher-Capacity Chip". The New York Times.
  7. ^ Cressler, J. D.; Niu, G. (2003). Silicon-Germanium Heterojunction Bipolar Transistors. Artech House. p. 13.
  8. ^ "Thermoelectrics History Timeline". Alphabet Energy. Archived from the original on 2019-08-17.
  9. ^ G. L. Bennett, J. J. Lombardo, R. J. Hemler, G. Silverman, C. W. Whitmore, W. R. Amos, E. W. Johnson, A. Schock, R. W. Zocher, T. K. Keenan, J. C. Hagan, R. W. Englehart (26–29 June 2006). Mission of Daring: The General-Purpose Heat Source Radioisotope Thermoelectric Generator (PDF). 4th International Energy Conversion Engineering Conference and Exhibit (IECEC). San Diego, California.CS1 maint: uses authors parameter (link)
  10. ^ Fadaly, Elham M. T.; Dijkstra, Alain; Suckert, Jens Renè; Ziss, Dorian; van Tilburg, Marvin A. J.; Mao, Chenyang; Ren, Yizhen; van Lange, Victor T.; Korzun, Ksenia; Kölling, Sebastian; Verheijen, Marcel A.; Busse, David; Rödl, Claudia; Furthmüller, Jürgen; Bechstedt, Friedhelm; Stangl, Julian; Finley, Jonathan J.; Botti, Silvana; Haverkort, Jos E. M.; Bakkers, Erik P. A. M. (April 2020). "Direct-bandgap emission from hexagonal Ge and SiGe alloys". Nature. 580 (7802): 205–209. arXiv:1911.00726. Bibcode:2020Natur.580..205F. doi:10.1038/s41586-020-2150-y. PMID 32269353. S2CID 207870211.
  11. ^ Hamish Johnston (10 Dec 2020). "Physics World announces its Breakthrough of the Year finalists for 2020". Physics World.

Further reading[]

  • Raminderpal Singh; Modest M. Oprysko; David Harame (2004). Silicon Germanium: Technology, Modeling, and Design. IEEE Press / John Wiley & Sons. ISBN 978-0-471-66091-0.
  • John D. Cressler (2007). Circuits and Applications Using Silicon Heterostructure Devices. CRC Press. ISBN 978-1-4200-6695-1.

External links[]

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