Wu Hanming

From Wikipedia, the free encyclopedia
Wu Hanming
BornJune 1952 (age 69)
China
Alma materUniversity of Science and Technology of China
Scientific career
FieldsMicroelectronic technology
InstitutionsSemiconductor Manufacturing International Corporation
Chinese name
Traditional Chinese
Simplified Chinese

Wu Hanming (Chinese: 吴汉明; born June 1952) is a Chinese microelectronics engineer and the current vice-president of the Technology R & D department of Semiconductor Manufacturing International Corporation.[1]

Biography[]

Wu was born in June 1952. During the Down to the Countryside Movement, he became a sent-down youth in his hometown and forced to work in the fields instead of going to middle school. After the resumption of National College Entrance Examination, he obtained a doctor's degree from the University of Science and Technology of China. After graduation, he was a postdoctoral fellow at the University of Texas at Austin and University of California, Berkeley. He was a senior R & D engineer at Novellus Systems and Intel before returning to China.[2] In 1993 he was offered a position at the Institute of Mechanics, Chinese Academy of Sciences. He joined a company in Alabama in 1995. In 1995 he was haired as a chief engineer at Intel. He returned to China in 2001 and became chief technology officer of Semiconductor Manufacturing International Corporation.[2]

Honours and awards[]

  • 2008 State Science and Technology Progress Award (Second Class)
  • 2013 State Science and Technology Progress Award (Second Class)
  • November 22, 2019 Member of the Chinese Academy of Engineering (CAE)[3]

References[]

  1. ^ Wang Chenting (王晨婷) (22 November 2019). 中国工程院新增75位院士 阿里云王坚、芯创智吴汉明入选. bbtnews.com.cn (in Chinese). Retrieved 28 January 2020.
  2. ^ Jump up to: a b Liu Xia (柳霞) (25 September 2014). 吴汉明:只为中国芯的腾飞. gmw.cn (in Chinese). Retrieved 28 January 2020.
  3. ^ 中国工程院2019年当选院士名单 [List of Members of the Chinese Academy of Engineering in 2019]. CAE (in Chinese). 22 November 2019. Retrieved 15 January 2020.
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