Exynos

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An Exynos 4 Quad (4412), on the circuit board of a Samsung Galaxy S III smartphone

Exynos, formerly Hummingbird (Korean: 엑시노스), is a series of ARM-based system-on-chips developed by Samsung Electronics' System LSI division and manufactured by Samsung Foundry. It is a continuation of Samsung's earlier S3C, S5L and S5P line of SoCs.

Exynos is mostly based on the ARM Cortex core with the exception of some high end SoC's which featured Samsung's proprietary "M" series core design.[1]

History[]

See also: List of Samsung system on chips

In 2010, Samsung launched the Hummingbird S5PC110 (now Exynos 3 Single) in its Samsung Galaxy S smartphone, which featured a licensed ARM Cortex-A8 CPU.[2] This ARM Cortex-A8 was code-named Hummingbird. It was developed in partnership with Intrinsity using their FastCore and Fast14 technology.[3]

In early 2011, Samsung first launched the Exynos 4210 SoC in its Samsung Galaxy S II mobile smartphone. The driver code for the Exynos 4210 was made available in the Linux kernel[4] and support was added in version 3.2 in November 2011.[5][6]

On 29 September 2011, Samsung introduced Exynos 4212[7] as a successor to the 4210; it features a higher clock frequency and "50 percent higher 3D graphics performance over the previous processor generation".[8] Built with a 32 nm high-κ metal gate (HKMG) low-power process; it promises a "30 percent lower power-level over the previous process generation".

On 30 November 2011, Samsung released information about their upcoming SoC with a dual-core ARM Cortex-A15 CPU, which was initially named "Exynos 5250" and was later renamed to Exynos 5 Dual. This SoC has a memory interface providing 12.8 GB/s of memory bandwidth, support for USB 3.0 and SATA 3, can decode full 1080p video at 60 fps along with simultaneously displaying WQXGA-resolution (2560 × 1600) on a mobile display as well as 1080p over HDMI.[9] Samsung Exynos 5 Dual has been used in a 2015 prototype supercomputer,[10] while the end-product will use a chip meant for servers from another vendor.

On 26 April 2012, Samsung released the Exynos 4 Quad, which powers the Samsung Galaxy S III and Samsung Galaxy Note II.[11] The Exynos 4 Quad SoC uses 20% less power than the SoC in Samsung Galaxy S II. Samsung also changed the name of several SoCs, Exynos 3110 to Exynos 3 Single, Exynos 4210 and 4212 to Exynos 4 Dual 45 nm,[12] and Exynos 4 Dual 32 nm[13] and Exynos 5250 to Exynos 5 Dual.

On 2010 Samsung founded a design center in Austin called Samsung's Austin R&D Center (SARC). Samsung has hired many ex-AMD, ex-Intel, ex-ARM and various other industry veterans.[14] The SARC develop high-performance, low-power, complex CPU and System IP (Coherent Interconnect and memory controller) architectures and designs.[15] In 2012, Samsung began development of GPU IP called "S-GPU".[16] After a three-year design cycle, SARC's first custom CPU core called the M1 was released in the Exynos 8890 in 2016.[17] In 2017 the San Jose Advanced Computing Lab (ACL) was opened to continue custom GPU IP development.[14] Samsung's custom CPU cores were named Mongoose for four generations, named M1 through M4, and Exynos SoCs with such cores were never on par in power efficiency or performance with their Qualcomm Snapdragon equivalents.[18][19]

On 3 June 2019, AMD and Samsung announced a multi-year strategic partnership in mobile graphics IP based on AMD Radeon GPU IP.[20][16] NotebookCheck reported that Samsung are targeting 2021 for their first SoC with AMD Radeon GPU IP.[21] However, AnandTech reported 2022.[22] In August 2019, during AMD's Q2 2019 earnings call, AMD stated that Samsung plans to launch SoCs with AMD graphics IP in roughly two years.[23]

On 1 October 2019, rumors emerged that Samsung had laid off their custom CPU core teams at SARC.[24][25][26] On 1 November 2019, Samsung filed a WARN letter with the Texas Workforce Commission, notifying of upcoming layoffs of their SARC CPU team and termination of their custom CPU core development.[27] SARC and ACL will still continue development of custom SoC, AI, and GPU.[28]

In June 2021, there was news that Samsung could hire engineers from AMD and Apple to form a new custom architecture team.[29]

List of ARMv7 Exynos SoCs[]

SoC CPU (ARMv7) GPU Memory technology Released Devices using
Model number Fab. Die size
(mm2) 		Microarchitecture Cores Frequency
(GHz) 		µarch Frequency
(MHz) 		Performance
(GFLOPS)
Exynos 3 Single 3110[30]
(previously Hummingbird S5PC110) 		45 nm "Hummingbird" FastCore Cortex-A8 1 1.0–1.2 PowerVR SGX540 200 3.2[31] 32-bit Dual-channel 200 MHz LPDDR, LPDDR2, or DDR2 Q2 2010
List
Exynos 2 Dual 3250 28 nm HKMG Cortex-A7 2 1.0 Mali-400 MP2 400 7.2 ? Q2 2014
List
Exynos 3 Quad 3470[32] 28 nm 4 1.4 Mali-400 MP4 450 16.2 64-bit (2×32-bit) Dual-channel LPDDR3 Q3 2014
List
Exynos 3 Quad 3475 28 nm HKMG 1.3 Mali-T720 600 10.2 LPDDR3 Q3 2015
List
Exynos 4 Dual 4210[33][12] 45 nm Cortex-A9 2 1.2–1.4 Mali-400 MP4 266 9.6 LPDDR2, DDR2 or DDR3 (6.4 GB/s)[34][35] Q2 2011
List
Exynos 4 Dual 4212[33][13] 32 nm HKMG 1.5 400[37] 14.4 Q1 2012
List
Exynos 4 Quad 4412[39][40] 4 1.4–1.6 400–533[41] 15.84 64-bit (2×32-bit) Dual-channel 400 MHz LPDDR, LPDDR2, DDR2 or DDR3 (6.4 GB/s)[40][42] Q2 2012
List
Exynos 4 Quad 4415[39][40] 28 nm HKMG 1.5 533[55] 19.2 Q3 2014[55]
List
Exynos 5 Dual 5250[56][57] 32 nm HKMG Cortex-A15 2 1.7 Mali-T604 MP4[58] 533 68.224[citation needed] 64-bit (2×32-bit) Dual-channel 800 MHz LPDDR3/DDR3 (12.8 GB/s) or 533 MHz LPDDR2 (8.5 GB/s) Q3 2012[56]
List
Exynos 5 Hexa 5260[63][64] 28 nm HKMG Cortex-A15+
Cortex-A7
(big.LITTLE with GTS) 		2+4 1.7
1.3 		Mali-T624 MP4 600 76.8 (FP32) 64-bit (2×32-bit) Dual-channel 800 MHz LPDDR3 (12.8 GB/s) Q2 2014
List
Exynos 5 Octa 5410[65][66][67][68] Cortex-A15+
Cortex-A7[69]
big.LITTLE[70] 		4+4 1.6
1.2 		PowerVR SGX544 MP3 480–532[71] 49 Q2 2013
List
Exynos 5 Octa 5420[75] 136.96 Cortex-A15+
Cortex-A7
(big.LITTLE with GTS) 		1.9
1.3 		Mali-T628 MP6 533 102.4 (FP32) 64-bit (2×32-bit) Dual-channel 933 MHz LPDDR3e (14.9 GB/s) Q3 2013
List
Exynos 5 Octa 5422[78][79] 2.1 max.
1.5 		Q2 2014
List
Exynos 5 Octa 5430[81][82] 20 nm HKMG 110.18 1.8
1.3 		600 115.2 (FP32) 64-bit (2×32-bit) Dual-channel 1066 MHz LPDDR3e/DDR3 (17.0 GB/s) Q3 2014
List
Exynos 5 Octa 5800[84] 28 nm HKMG 2.0
1.3 		? ? 64-bit (2×32-bit) Dual-channel 933 MHz LPDDR3/DDR3 (14.9 GB/s) Q2 2014
List

List of entry-level and mid-range ARMv8 Exynos SoCs[]

Exynos 7500 series, 7870 and 7880 (2015-17)[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 7 Quad 7570[86][87][88] 14 nm LPC 4 cores 1.4 GHz Cortex-A53 Mali-T720 MP1[89] 830 19.1 LPDDR3 32-bit Single-channel 1066 MHz (4.2 GB/sec) LTE Cat.4 2CA 150Mbit/s (DL) /

50Mbit/s (UL)

Bluetooth 4.2, Wi-Fi 802.11a/b/g/n Q3 2016
List
Exynos 7 Quad 7578 28 nm HKMG 4 cores 1.5 GHz Cortex-A53 Mali-T720 MP2 668 22.7 Bluetooth, Wi-Fi Q2 2015
List
Exynos 7 Octa 7580[90][91] 8 cores 1.6 GHz Cortex-A53 64-bit (2×32-bit) Dual-channel 933 MHz (14.9 GB/sec) LTE Cat.6 2CA 300Mbit/s (DL) /

50Mbit/s (UL)

List
Exynos 7 Octa 7870[93][94] 14 nm LPP Mali-T830 MP1[95] 700 23.8 32-bit Single-channel[96] 933 MHz Bluetooth, Wi-Fi Q1 2016
List
Exynos 7880[101][102][103] 8 cores 1.9 GHz Cortex-A53 Mali-T830 MP3 950 71.4 LPDDR4 64-bit (2×32-bit) Dual-channel 1600 MHz (12.8 GB/sec) LTE Cat.7 3CA 300Mbit/s (DL) /

2CA 100Mbit/s (UL)

Bluetooth, Wi-Fi Q1 2017
List

Exynos 7872, 7884 series, 7885 and 7904 (2018/19)[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 7872[104] 14 nm LPP 2 + 4 cores (2.0 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS Mali-G71 MP1 1200 41 LPDDR3 32-bit Single-channel 933 MHz (3.7 GB/sec) LTE Cat.7 2CA 300Mbit/s (DL) /

Cat.13 2CA 150Mbit/s (UL)

Bluetooth 4.2, Wi-Fi 802.11a/b/g/n Q1 2018 Meizu M6s
Exynos 7884A[105] 2 + 6 cores (1.35 GHz Cortex-A73 + 1.35 GHz Cortex-A53) GTS Mali-G71 MP2 Un­known 64-bit (2×32-bit) Dual-channel LTE Cat.4 2CA 150Mbit/s (DL) /

2CA 50Mbit/s (UL)

Q3 2018
List
Exynos 7884[106] 2 + 6 cores (1.6 GHz Cortex-A73 + 1.35 GHz Cortex-A53) GTS 770 53 LPDDR4 Shannon 327 LTE Cat.12 3CA 600Mbit/s (DL) /

Cat.13 2CA 150Mbit/s (UL)

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac Q2 2018
List
Exynos 7885[107][108] 2 + 6 cores (2.2 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS 1100 76 32bit (2×16-bit) Dual-channel 1866 MHz (7.5 GB/sec) Q1 2018
List
Exynos 7904[109] 2 + 6 cores (1.8 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS 770 53 64-bit (2×32-bit) Dual-channel Q1 2019
List

Exynos 9600 series (2019)[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 9609[110] 10 nm LPE[111] 4 + 4 cores (2.2 GHz Cortex-A73 + 1.6 GHz Cortex-A53) Mali-G72 MP3 LPDDR4X 64-bit (2×32-bit) Dual-channel 1600 MHz (11.9 GB/sec) Shannon 337 LTE Cat.12 3CA 600Mbit/s (DL) /

Cat.13 2CA 150Mbit/s (UL)

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac Q2 2019
List
Exynos 9610[112] 4 + 4 cores (2.3 GHz Cortex-A73 + 1.7 GHz Cortex-A53) Q4 2018 Samsung Galaxy A50
Exynos 9611[113] Q3 2019
List

Exynos 800 series (2020)[]

SoC CPU (ARMv8.2-A) GPU Memory technology AI accelerator Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 850 (S5E3830)[114] 8 nm LPP 8 cores 2.0 GHz Cortex-A55 Mali-G52 MP1 LPDDR4X - Shannon 318 LTE Cat.7 2CA 300Mbit/s (DL) /

Cat.13 2CA 150Mbit/s (UL)

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac Q2 2020
List
Exynos 880[115] 2 + 6 cores (2.0 GHz Cortex-A77 + 1.8 GHz Cortex-A55) Mali-G76 MP5 NPU Shannon 5G

LTE DL: Cat.16 1000 Mbit/s, 5CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM

5G NR Sub-6 GHz DL: 2.55Gbit/s UL: 1.28Gbit/s

List

List of high-end ARMv8 Exynos SoCs[]

Exynos 5433 and 7420 (2014/15)[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 7 Octa 5433[116][117][118] 20 nm HKMG 113.42[119] 4 + 4 cores (1.9 GHz Cortex-A57 + 1.3 GHz Cortex-A53) GTS Mali-T760 MP6 700 142 LPDDR3 64-bit (2×32-bit) Dual-channel 825 MHz (13.2 GB/s)[116] Paired with Samsung M303/Intel XMM 7260 LTE Cat 6 (300Mbit/s) or Ericsson M7450 LTE Cat 4[120] Bluetooth, Wi-Fi Q4 2014
List
Exynos 7 Octa 7420[121][122][123] 14 nm LPE 78.23[119] 4 + 4 cores (2.1 GHz Cortex-A57 + 1.5 GHz Cortex-A53) GTS Mali-T760 MP8 772 210 LPDDR4 1553 MHz (24.88 GB/s)[124] Paired with Shannon 333

LTE Cat 9 (450Mbit/s)

Bluetooth, Wi-Fi Q2 2015
List

Exynos 8800 series (2016/17)[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 8 Octa 8890

[127]

14 nm LPP 4 + 4 cores (2.3 GHz, up to 2.6 GHz in dual-core load, Exynos M1 "Mongoose" + 1.6 GHz Cortex-A53) GTS Mali-T880 MP12 650 265.2 LPDDR4 64-bit (2×32-bit) Dual-channel Shannon 335 LTE

DL: LTE Cat 12 600Mbit/s, 3CA
UL: LTE Cat 13 150Mbit/s, 2CA

Bluetooth 4.2, Wi-Fi 802.11a/b/g/n/ac Q1 2016
List
4 + 4 cores (2.0 GHz Exynos M1 "Mongoose" + 1.5 GHz Cortex-A53) GTS Mali-T880 MP10 (Lite) 650 221
List
Exynos 8895

[129][130][131]

10 nm LPE 103.64[132] 4 + 4 cores (2.314 GHz Exynos M2 "Mongoose" + 1.69 GHz Cortex-A53) GTS Mali-G71 MP20 546[133] 375 LPDDR4X 1794 MHz (28.7 GB/s)[134][135] Shannon 355 LTE

DL: LTE Cat 16 1050Mbit/s, 5CA, 256-QAM)
UL: LTE Cat 13 150Mbit/s, 2CA, 64-QAM

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac Q2 2017
List

Exynos 9800 series (2018/19)[]

SoC CPU (ARMv8.2-A) GPU Memory technology AI accelerator Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 9810 (S5E9810)[136][137] 10 nm LPP 118.94[138] 4 + 4 cores (2.9 GHz Exynos M3 "Meerkat"[132] + 1.9 GHz Cortex-A55) Mali-G72 MP18 572 370[139] LPDDR4X 64-bit (4×16-bit) Quad-channel 1794 MHz (28.7 GB/s)[134] NA Shannon 360 LTE

DL: LTE Cat 18 1200 Mbit/s, 6CA, 256-QAM
UL: LTE Cat 13 200 Mbit/s, 2CA, 256-QAM

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac Q1 2018
List
Exynos 9820 (S5E9820)[140] 8 nm LPP 127[141] 2 + 2 + 4 cores (2.73 GHz Exynos M4 "Cheetah" + 2.31 GHz Cortex-A75 + 1.95 GHz Cortex-A55) Mali G76 MP12 702 607 2093 MHz (33.488GB/s)

[141]

Dual-core NPU

1024 MAC units @ 933 MHz[141] (1.86 TOPs)

Shannon 5000 LTE

DL: Cat.20 2000 Mbit/s, 8CA, 256-QAM UL: Cat.13 316 Mbit/s, 3CA, 256-QAM

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax Q1 2019
List
Exynos 9825 (S5E9825)[142] 7 nm LPP (EUV) 2 + 2 + 4 cores (2.73 GHz Exynos M4 "Cheetah" + 2.4 GHz Cortex-A75 + 1.95 GHz Cortex-A55) 754 652 Q3 2019
List

Exynos 900 series (2020)[]

SoC CPU (ARMv8.2-A) GPU Memory technology AI accelerator Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 980 (S5E9630)[143] 8 nm LPP 2 + 6 cores (2.2 GHz Cortex-A77 + 1.8 GHz Cortex-A55) Mali G76 MP5 728 262 LPDDR4X Single core NPU and DSP

? MAC units @ ?

Shannon 5188 5G

LTE DL: Cat.16 1000 Mbit/s, 5CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM

5G NR Sub-6 GHz DL: 2.55Gbit/s UL: 1.28Gbit/s

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax Q4 2019
List
Exynos 990 (S5E9830)[144] 7 nm LPP (EUV) 91.83[145] 2 + 2 + 4 cores (2.73 GHz Exynos M5 "Lion" + 2.5 GHz Cortex-A76 + 2.0 GHz Cortex-A55)

2MB System Cache

Mali G77 MP11 800 1,126 LPDDR5 64-bit (4×16-bit) Quad-channel 2750 MHz (44GB/s) Dual-core NPU

? MAC units @ ?

DSP

(15 TOPs)

Paired with Exynos Modem 5123

LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 2CA, 256-QAM

5G NR Sub-6 GHz DL: 5.1Gbit/s UL: ?Gbps

5G NR mmWave DL: 7.35Gbit/s UL: ?Gbps

Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax Q1 2020
List

Exynos 1000/2000 series (2021)[]

Exynos 1080

  • 5nm (5LPE) Samsung process
  • CPU features
  • GPU features
  • DSP features
    • Add support of AV1 in 8K60 (decode only)
    • H.265/HEVC, H.264, VP9
    • HDR10+
  • ISP features
    • -
  • Modem and wireless features
    • Bluetooth 5.2 (from 5.0 on Exynos 990)
    • Exynos Modem Integrated[146]
    • LTE Category 24/18
    • 6CA, 256-QAM
    • 5G NR Sub-6 (DL = 5100 Mbit/s and UL = 1920 Mbit/s)
    • 5G NR mmWave (DL = 7350 Mbit/s and UL = 3670 Mbit/s)

Exynos 2100

  • 5nm (5LPE) Samsung process[147]
  • 6MB System Cache
  • CPU features
  • GPU features
  • DSP features
    • 8K30 & 4K120 encode & 8K60 decode
    • Add support of AV1 in 8K60 (decode only)[151]
    • H.265/HEVC, H.264, VP9[152]
    • HDR10+
  • ISP features
    • Single: 200MP or Dual: 32MP+32MP[153]
    • Up to quad simultaneous camera[154]
  • Modem and wireless features
    • Bluetooth 5.2 (from 5.0 on Exynos 990)
    • Exynos Modem Integrated[146]
    • LTE Category 24/18
    • 6CA, 256-QAM
    • 5G NR Sub-6 (DL = 5100 Mbit/s and UL = 1920 Mbit/s)
    • 5G NR mmWave (DL = 7350 Mbit/s and UL = 3670 Mbit/s)
SoC CPU (ARMv8.2-A) GPU Memory technology AI accelerator Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 1080 (S5E9815)[155] 5 nm LPE (EUV) 1 + 3 + 4 cores (2.8 GHz Cortex-A78 + 2.6 GHz Cortex-A78 + 2.0 GHz Cortex-A55) Mali G78 MP10 LPDDR4X
LPDDR5 		NPU + DSP

(5.7 TOPs)

LTE DL: Cat.18 1200 Mbit/s, 6CA, 256-QAM

UL: Cat.18 200 Mbit/s, 2CA, 256-QAM

5G NR Sub-6 GHz DL: 5.1Gbit/s UL: 1.28Gbit/s

5G NR mmWave DL: 3.67Gbit/s UL: 3.67Gbit/s

Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax Q4 2020
List
Exynos 2100 (S5E9840)[156] 1 + 3 + 4 cores (2.91 GHz Cortex-X1 + 2.81 GHz Cortex-A78 + 2.2 GHz Cortex-A55) Mali G78 MP14 854 1,530 LPDDR5 64-bit (4×16-bit) Quad-channel 3200 MHz (51.2GB/s) Triple NPU + DSP

(26 TOPs)

LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM

UL: Cat.18 422 Mbit/s, 4CA, 256-QAM

5G NR Sub-6 GHz DL: 5.1Gbit/s UL: 1.92Gbit/s

5G NR mmWave DL: 7.35Gbit/s UL: 3.67Gbit/s

Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax Q1 2021
List

List of ARMv8 Exynos Wearable SoCs[]

SoC CPU (ARMv8-A) GPU Memory technology Modem Connectivity Released Devices using
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 7 Dual 7270[157] 14 nm LPP 2 cores 1.0 GHz Cortex-A53 Mali-T720 MP1 667 MHz 15.3 LPDDR3 64-bit (2×32-bit) Dual-channel 25.6 LTE Cat.4 2CA 150Mbit/s (DL) /

50Mbit/s (UL)

Bluetooth 4.2, Wi-Fi 802.11b/g/n Q3 2016
List
Exynos 9110[158] 10 nm LPP 2 cores 1.15 GHz Cortex-A53 LPDDR4/LPDDR4X Un­known Un­known LTE Cat.4 2CA 150Mbit/s (DL) / Cat.5

75Mbit/s (UL)

Q3 2018
List
Exynos W920[159] 5 nm LPE (EUV) 2 cores 1.18 GHz Cortex-A55 Mali-G68 MP2 Un­known Un­known LPDDR4 Un­known Un­known Bluetooth 5.0, Wi-Fi 802.11b/g/n Q3 2021
List

List of Exynos modems[]

Exynos Modem 303

  • Supported modes LTE FDD, LTE TDD, WCDMA and GSM/EDGE
  • LTE Cat. 6
  • Downlink: 2CA 300Mbit/s 64-QAM
  • Uplink: 100Mbit/s 16-QAM
  • 28 nm HKMG Process
  • Paired with: Exynos 5 Octa 5430 and Exynos 7 Octa 5433
  • Devices using: Samsung Galaxy Note 4, Samsung Galaxy Note Edge and Samsung Galaxy Alpha[160]

Exynos Modem 333

Exynos Modem 5100

  • Supported Modes: 5G NR Sub-6 GHz, 5G NR mmWave, LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE[162]
  • Downlink Features:
    • 8CA (Carrier Aggregation) in 5G NR
    • 8CA 1.6Gbit/s in LTE Cat. 19
    • 4x4 MIMO
    • FD-MIMO
    • Up to 256-QAM in sub-6 GHz, 2Gbit/s
    • Up to 64-QAM in mmWave, 6Gbit/s
  • Uplink Features:
    • 2CA (Carrier Aggregation) in 5G NR
    • 2CA in LTE
    • Up to 256-QAM in sub-6 GHz
    • Up to 64-QAM in mmWave
  • Process: 10 nm FinFET Process
  • Paired with: Exynos 9820 and Exynos 9825

Exynos Modem 5123

  • Downlink Features:
    • 8CA 3.0Gbit/s in LTE Cat. 24
    • Up to ?-QAM in sub-6 GHz, 5.1Gbit/s
    • Up to ?-QAM in mmWave, 7.35Gbit/s
  • Uplink Features:
    • 2CA 422 Mbit/s in LTE Cat. 22
    • Up to ?-QAM in sub-6 GHz
    • Up to ?-QAM in mmWave
  • Process: 7 nm FinFET Process
  • Paired with: Exynos 990[144]

List of Exynos IoT SoCs[]

Exynos i T200[163]

  • CPU: Cortex-M4 @ 320 MHz, Cortex-M0+ @ 320 MHz
  • WiFi: 802.11b/g/n Single band (2.4 GHz)
  • On-chip Memory: SRAM 1.4MB
  • Interface: SDIO/ I2C/ SPI/ UART/ PWM/ I2S
  • Front-end Module: Integrated T/R switch, Power Amplifier, Low Noise Amplifier
  • Security: WEP 64/128, WPA, WPA2, AES, TKIP, WAPI, PUF (Physically Unclonable Function)

Exynos i S111[164]

  • CPU: Cortex-M7 200 MHz
  • Modem: LTE Release 14 NB-IoT
    • Downlink: 127 kbit/s
    • Uplink: 158 kbit/s
  • On-chip Memory: SRAM 512KB
  • Interface: USI, UART, I2C, GPIO, eSIM I/F, SDIO(Host), QSPI(Single/Dual/Quad IO mode), SMC
  • Security: eFuse, AES, SHA-2, PKA, Secure Storage, Security Sub-System, PUF
  • GNSS: GPS, Galileo, GLONASS, BeiDou

List of Exynos Auto SoCs[]

Exynos Auto series[]

SoC CPU GPU Memory technology AI accelerator Modem Connectivity Released Vehicles
Model number Fab. Die size (mm2) µarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos Auto 8890[165] 14 nm LPP 4 + 4 cores (2.3 GHz, up to 2.6 GHz in single-core load, Exynos M1 "Mongoose" + 1.6 GHz Cortex-A53) GTS (ARMv8-A) Mali-T880 MP12 650 265.2 LPDDR4 64-bit (2×32-bit) Dual-channel N/A Shannon LTE

DL: LTE Cat 12 600 Mbit/s, 3CA
UL: LTE Cat 13 150 Mbit/s, 2CA

Bluetooth 4.2, Wi-Fi 802.11a/b/g/n/ac Q1 2017 Audi A4
Exynos Auto V9[166] 8 nm

LPP

8 cores 2.1 GHz Cortex-A76 (ARMv8.2-A) 3× Mali G76 (MP12 + MP3 + MP3) LPDDR4X

LPDDR5

NPU Bluetooth 5.0, Wi-Fi 6 Q1 2019

The Exynos Auto V9 comes with additional features such as:-

See also[]

Similar platforms[]

  • A-Series by Allwinner
  • Apple silicon (A/S/T/W/H/U series) by Apple Inc.
  • Kirin by HiSilicon (Huawei)
  • i.MX by NXP
  • Jaguar and Puma by AMD
  • MT by MediaTek
  • NovaThor by ST-Ericsson
  • OMAP by Texas Instruments
  • RK by Rockchip Electronics
  • Snapdragon by Qualcomm
  • Tegra by Nvidia

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External links[]

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