List of Qualcomm Snapdragon processors

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Qualcomm Snapdragon
General information
Launched2007; 14 years ago (2007)
Designed byQualcomm
Architecture and classification
ApplicationMobile SoC and 2-in-1 PC
MicroarchitectureARM11, Cortex-A5, Cortex-A7, Cortex-A53, Cortex-A55, Cortex-A57, Cortex-A72, Cortex-A75, Cortex-A76, Cortex-A77, Cortex-A78, Cortex-X1, Scorpion, Krait, Kryo
Instruction setARMv6, ARMv7-A, ARMv8-A
Physical specifications
Cores
  • 1, 2, 4, 6, or 8

This is a list of Qualcomm Snapdragon processors. Snapdragon is a family of mobile system on a chip (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.

Before Snapdragon[]

SOC was made by Qualcomm before it was renamed to Snapdragon.[1]

Model number Fab CPU GPU (or Gfx Core) Connectivity Sampling availability
QSC1xxx
QSC1100 Q4 2007
QSC6xxx
QSC6010 ARMv5TEJ ARM926EJ-S[citation needed] No 3D and ARM 2D None 2006
QSC6020
QSC6030
QSC6240 HSDPA Q3 2007
QSC6245-1 HSDPA Q3 2007
QSC6055 Q1 2007
QSC6065 HSDPA Q2 2007
QSC6260-1 Q3 2007
QSC6270 HSDPA
QSC6075 Q2 2007
QSC6085 DOrA Q4 2007
MSM6xxx
MSM6000 None 2006
MSM6025
MSM6050
MSM6100 ARM-DSP 3D and ARM 2D
MSM6125
MSM6150 Defender2 3D and ARM 2D
MSM6175
MSM6225 No 3D and ARM 2D HSDPA
MSM6250 ARM-DSP 3D and ARM 2D WCDMA 2006
MSM6250A No 3D and ARM 2D WCDMA
MSM6245 WEDGE
MSM6255A
MSM6260 ARMv5TEJ ARM926EJ-S @ 225 Mhz[2] ARM-DSP 3D and ARM 2D HSUPA
MSM6275 Defender2 3D and ARM 2D
MSM6280
MSM6280A Stargate 3D and ARM 2D 2007
MSM6800A Defender3 3D and ARM 2D DOrA 2006
MSM6575 DOr0
MSM6550 ARMv5TEJ ARM926EJ-S @ 225 Mhz[3] Defender2 3D and ARM 2D
MSM6550A
MSM6800 DOrA
MSM6500 ARMv5TEJ ARM926EJ-S @ 150 Mhz[4] ARM-DSP 3D and ARM 2D DOr0
MSM7xxx
MSM7200 Imageon 3D

Imageon 2D

HSUPA 2006
MSM7200A ARM11 @ 528 Mhz Q1 2007
MSM7201[5][6] 2008
MSM7500 DOrA 2006
MSM7500A Q4 2007
MSM7600 65 nm ARM1136J-S @ 528Mhz[5][6] HSUPA and DOrA Q1 2007
MSM7850 LT 3D and LT 2D DOrB 2008

Snapdragon S1[]

Snapdragon S1 notable features over its predecessor (MSM7xxx):

Model number Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7225[8] 65 nm 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache Software rendered 2D support (HVGA) Hexagon QDSP5 320 MHz Up to 5 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 2007
MSM7625[8] CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM
MSM7227[8] 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache Adreno 200 226 MHz (FWVGA) Up to 8 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s) UMTS; GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008
MSM7627[8] CDMA/UMTS; GSM
MSM7225A[8] 45 nm 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 245 MHz (HVGA) Hexagon QDSP5 350 MHz Up to 5 MP camera LPDDR Single-channel 200 MHz (1.6 GB/s) UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 Q4 2011
MSM7625A[8] CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A[8] 1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 245 MHz (FWVGA) Up to 8 MP camera UMTS, MBMS; GSM
MSM7627A[8] CDMA2000/UMTS, MBMS; GSM
MSM7225AB[8][9][10] UMTS: up to 7.2 Mbit/s, MBMS; GSM
QSD8250[8] 65 nm 1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache Adreno 200 226 MHz (WXGA) Hexagon QDSP6 600 MHz Up to 12 MP camera LPDDR Single-channel 400 MHz UMTS, MBMS; GSM Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 Q4 2008
QSD8650[8] CDMA2000/UMTS, MBMS; GSM

Snapdragon S2[]

Snapdragon S2 notable features over its predecessor (Snapdragon S1):

  • CPU feature
    • 1 core up to 1.5 GHz Scorpion
    • ARMv7 (From ARMv6 on some model)
    • Up to 384K L2
  • GPU features
    • Adreno 205 (From Software rendered or Adreno 200)
      • Up to 266 MHz
      • Up to 2 times faster than Adreno 200[11]
      • Up to x2 relative performance on OpenGL ES 2.0 from Adreno 200[12]
      • Up to XGA
      • OpenGL ES 2.0
      • SVGT 1.2[13]
      • OpenVG 1.1
      • Direct Draw
      • GDI
      • Concurrent CPU, DSP, graphics and MDP[13]
  • Memory features
    • Up to LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)
  • ISP features
    • Up to 12 MP camera
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM7230[8] 45 nm 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 Adreno 205 266 MHz (XGA) Hexagon QDSP5 256 MHz Up to 12 MP camera LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)[15] UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 Q2 2010
MSM7630[8] CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055[8] 1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2 -
MSM8255[8] 1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655[8] CDMA2000/UMTS, MBMS; GSM
MSM8255T[8] 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 UMTS, MBMS; GSM
MSM8655T[8] CDMA2000/UMTS, MBMS; GSM

Snapdragon S3[]

Snapdragon S3 notable features over its predecessor (Snapdragon S2):

  • CPU feature
    • 2 cores up to 1.7 GHz Scorpion
    • 512KB L2
  • GPU features
    • Adreno 220
      • Up to 4 time faster than Adreno 200[17]
      • Up to x5 relative performance on OpenGL ES 2.0 from Adreno 200[12]
      • EGL 1.3 (From 1.2)[13]
      • 2x Larger L2 cache (512 KB from 256 KB)
      • Up to WXGA+
  • DSP features
  • ISP features
    • Up to 16 MP camera (From 12 MP)
  • 45 nm manufacturing technology
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8060[8] 45 nm 2 cores up to 1.7 GHz Scorpion: 512KB L2 Adreno 220 266 MHz (WXGA+) Hexagon QDSP6 400 MHz Up to 16 MP camera LPDDR2 Single-channel 333 MHz (2.67 GB/s)[18] - Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 2011
MSM8260[8] UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) Q3 2010
MSM8660[8] CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM

Snapdragon S4 series[]

Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.[19] It was launched in 2012.

The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)

Snapdragon S4 Play[]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225[19] 45 nm 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 Adreno 203 320 MHz (FWVGA) Hexagon Up to 8 MP camera LPDDR2 Single-channel 300 MHz UMTS (HSPA); GSM (GPRS, EDGE) Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 1H 2012
MSM8625[19] CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM

Snapdragon S4 Plus[]

Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):

  • CPU features
    • 2 cores up to 1.7 GHz Krait 200
    • 4+4 KB L0, 16+16 KB L1, 1 MB L2
    • Out of Order Execution (From Partial Out of Order Execution on Scorpion)
  • GPU features
  • DSP features
    • Up to 20 MP or 13.5 MP camera
  • ISP features
  • Modem and Wireless features
  • 28 nm manufacturing technology
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8227[19] 28 nm 2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 320 MHz (FWVGA / 720p) Hexagon QDSP6 LPDDR2 Single-channel 400 MHz UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 2H 2012
MSM8627[19] CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM
APQ8030[19] 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 400 MHz (qHD / 1080p) Up to 13.5 MP camera LPDDR2 Single-channel 533 MHz - 3Q 2012
MSM8230[19] UMTS; GSM
MSM8630[19] CDMA/UMTS; GSM
MSM8930[19] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A[19] 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 225 400 MHz (WUXGA / 1080p) Up to 20 MP camera LPDDR2 Dual-channel 500 MHz - 2H 2012
MSM8260A[19] UMTS; GSM Q1 2012
MSM8660A[19] CDMA/UMTS; GSM
MSM8960[19][22] World Mode (LTE Cat 3)

Snapdragon S4 Pro and Snapdragon S4 Prime (2012)[]

Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):

  • CPU features
    • up to 2 cores up to 1.7 GHz Krait 300 on to Snapdragon S4 Pro
    • up to 4 cores up to 1.5 GHz Krait 300 on to Snapdragon S4 Prime
    • 4+4 KB L0, 16+16 KB L1, 1 MB L2
  • GPU features
    • Adreno 320
      • Support OpenGL ES 3.0
      • Up to 1080p screen
      • Up to 64 ALU (From 32 on S4 plus)
      • Up to x23 relative performance on OpenGL ES 2.0 from Adreno 200[12]
  • DSP features
  • ISP features
    • Up to 20 MP camera
  • Modem and Wireless features
    • LTE FDD/TDD Cat 3 or external on some models
  • 28 nm LP manufacturing technology
  • 4 watt TDP[23]
  • Up to eMMC 4.4/4.4.1
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8260A Pro[19] 28 nm LP 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 320 400 MHz (WUXGA / 1080p) Hexagon QDSP6 Up to 20 MP camera LPDDR2 Dual-channel 500 MHz UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T[19] World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) Q2 2012
MSM8960T Pro (MSM8960AB[24])[19]
MSM8960DT[19][25] 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor Q3 2013
APQ8064[19][22] 4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) LPDDR2 Dual-channel 533 MHz[26] External 2012

Snapdragon 2 Series[]

The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.

Snapdragon 200 (2013)[]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Sampling availability
MSM8225Q[27] 45 nm LP 4 cores up to 1.4 GHz Cortex-A5 Adreno 203 400 MHz (up to 540p) Hexagon QDSP5 Up to 8 MP camera LPDDR2 Single-channel 333 MHz Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 2013
MSM8625Q[27] Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210[27][28] 28 nm LP 2 cores up to 1.2 GHz Cortex-A7 Adreno 302 400 MHz (up to 720p) Hexagon QDSP6 Gobi 3G (UMTS; GSM) 2013
MSM8610[27][28] Gobi 3G (CDMA/UMTS; GSM)
MSM8212[27][28] 4 cores up to 1.2 GHz Cortex-A7 Gobi 3G (UMTS; GSM)
MSM8612[27][28] Gobi 3G (CDMA/UMTS; GSM)

Qualcomm 205, Snapdragon 208, 210 and 212 (2014–17)[]

The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.[29]
The Snapdragon 212 was announced on July 28, 2015.[30]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.[31]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8905 (205)[32] 28 nm LP 2 cores up to 1.1 GHz Cortex-A7 Adreno 304 (WXGA / 720p) Hexagon 536 Up to 3 MP camera LPDDR2/3 Single-channel 384 MHz X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) 2017
MSM8208 (208)[33] Up to 5 MP camera LPDDR2/3 Single-channel 400 MHz Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) 2.0 2014
MSM8909 (210)[34] 4 cores up to 1.1 GHz Cortex-A7 Up to 8 MP camera LPDDR2/3 Single-channel 533 MHz X5 LTE
MSM8909AA (212)[35] 4 cores up to 1.3 GHz Cortex-A7 2015

Qualcomm 215 (2019)[]

The Qualcomm 215 was announced on July 9, 2019.[36] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
QM215[37] 28 nm LP 4 cores up to 1.3 GHz Cortex-A53 Adreno 308 (HD+) Hexagon Up to 13 MP camera / 8 MP dual LPDDR3 Single-channel 672 MHz 3 GB X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 1.0 Q3 2019

Snapdragon 4 Series[]

The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.

Snapdragon 400 (2013)[]

Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8026[38] 28 nm LP 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 Adreno 305 400 MHz Hexagon QDSP6 Up to 13.5 MP camera LPDDR2/3 Single-channel 533 MHz - Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS 1.0 Q4 2013
MSM8226[38] Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626[38] Gobi 3G (CDMA/UMTS)
MSM8926[38] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
APQ8028[38] 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 -
MSM8228[38] Gobi 3G (UMTS)
MSM8628[38] Gobi 3G (CDMA/UMTS)
MSM8928[38] Gobi 4G (LTE Cat 4)
MSM8230[38] 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 LPDDR2 Single-channel 533 MHz Gobi 3G (UMTS)
MSM8630[38] Gobi 3G (CDMA/UMTS)
MSM8930[38] Gobi 4G (LTE Cat 4)
MSM8930AA[38] 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4)
APQ8030AB[38] 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 -
MSM8230AB[38] Gobi 3G (UMTS)
MSM8630AB[38] Gobi 3G (CDMA/UMTS)
MSM8930AB[38] Gobi 4G (LTE Cat 4)

Snapdragon 410, 412 and 415 (2014/15)[]

The Snapdragon 410 was announced on December 9, 2013.[39] It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.[40]
The Snapdragon 412 was announced on July 28, 2015.[30]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.[41]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8016 (410) 28 nm (SMIC) 4 cores up to 1.2 GHz Cortex-A53 Adreno 306 450 MHz (WUXGA / 1920×1200 + 720p external display) Hexagon QDSP6 V5 Up to 13.5 MP camera LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) - Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 1H 2014
MSM8916 (410)[42] X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8916 v2 (412)[43] 4 cores up to 1.4 GHz Cortex-A53 LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) 2H 2015
MSM8929 (415)[44] 28 nm LP 8 cores up to 1.4 GHz Cortex-A53 Adreno 405 (HD @60fps) Hexagon V50 Up to 13 MP camera LPDDR3 Single-channel 667 MHz Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS

Snapdragon 425, 427, 430 and 435 (2015/16)[]

Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.[45]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.[46]
The Snapdragon 427 was announced on October 18, 2016.[47][48]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8917 (425)[49] 28 nm LP 4 cores up to 1.4 GHz Cortex-A53 Adreno 308 (HD @60fps) Hexagon 536 Up to 16 MP camera LPDDR3 Single-channel 667 MHz X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C 2.0 Q3 2016
MSM8920 (427)[50] X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 Q1 2017
MSM8937 (430)[51] 8 cores up to 1.4 GHz Cortex-A53 Adreno 505 (FHD / 1080p) Up to 21 MP camera LPDDR3 Single-channel 800 MHz X6 LTE Q2 2016
MSM8940 (435)[52] X9 LTE Q4 2016

Snapdragon 429, 439 and 450 (2017/18)[]

The Snapdragon 450 was announced on June 28, 2017.[53] Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.[54] Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM429 [55] 12 nm FinFET 4 cores up to 1.95 GHz Cortex-A53 Adreno 504 (HD / HD+) Hexagon 536 Up to 16 MP camera / 8 MP dual LPDDR3 X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 364 Mbit/s, USB 2.0 3.0 Q3 2018
SDM439 [56] 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53)[57] Adreno 505 (Full HD / Full HD+) Up to 21 MP camera / 8 MP dual
SDM450 [58] 14 nm LPP 8 cores up to 1.8 GHz Cortex-A53 Adreno 506 600 MHz (WUXGA / Full HD / Full HD+) Hexagon 546 Up to 21 MP camera / 13 MP dual LPDDR3 Single-channel 933 MHz X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 Q3 2017

Snapdragon 460 (2020)[]

The Snapdragon 460 was announced on January 20, 2020 with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.[59]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4250-AA (460)[60] 11 nm 4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 240 Silver – Cortex-A53 derivative) Adreno 610 (up to Full HD+) Hexagon 683 Spectra 340 (48 MP camera / 16 MP dual with MFNR/ZSL) LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB C 3.0 Q1 2020

Snapdragon 480 5G (2021)[]

The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.[61]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM4350 (480)[62] 8 nm LPP 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 460 Silver – Cortex-A55 derivative) Adreno 619 (Full HD+@120Hz) Hexagon 686 (3.3 TOPS) Spectra 345 (64 MP single camera / 25 MP at 30fps Dual Camera with ZSL) / Triple camera: 3x 13 MP at 30 fps with MFNR/ZSL LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) Bluetooth 5.1, NFC, Wi-Fi 6 ready (802.11ax/ac wave 2/n/g/b/a) 4+ H1 2021

Snapdragon 6 Series[]

The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.

Snapdragon 600 (2013)[]

The Snapdragon 600 was announced on January 8, 2013.[63] Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.

  • Display Controller: MDP 4. 2 RGB planes, 2 VIG planes, 1080p
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro 28 nm LP 4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p) Hexagon QDSP6 V4 500 MHz Up to 21 MP camera DDR3L-1600 (12.8 GB/sec) External Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A 1.0 Q1 2013
APQ8064M [64] 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 LPDDR3 Dual-channel 32-bit 533 MHz
APQ8064T [64] LPDDR3 Dual-channel 32-bit 600 MHz
APQ8064AB [64] 4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 450 MHz (QXGA / 1080p)

Snapdragon 610, 615 and 616 (2014/15)[]

The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.[65] The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.

  • Hardware HEVC/H.265 decode acceleration[66]

The Snapdragon 616 was announced on July 31, 2015.[67]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8936 (610)[68] 28 nm LP 4 cores 1.7 GHz Cortex-A53 Adreno 405 550 MHz (2560×1600 / Quad HD / WQXGA) Hexagon V50 700 MHz Up to 21 MP camera LPDDR3 Single-Channel 800 MHz (6.4 GB/s) X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou 2.0 Q3 2014
MSM8939 (615)[69] 4 + 4 cores (1.5 GHz + 1.0 GHz Cortex-A53) Q3 2014
MSM8939 v2 (616)[70] 4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53) Q3 2015

Snapdragon 617, 625 and 626 (2015/16)[]

The Snapdragon 617 was announced on September 15, 2015.[45]
The Snapdragon 625 was announced on February 11, 2016.[71]
The Snapdragon 626 was announced on October 18, 2016.[72] Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8952 (617)[73] 28 nm LP 4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53) Adreno 405 550 MHz (FHD / 1080p) Hexagon 546 Up to 21 MP camera LPDDR3 Single-channel 933 MHz (7.5 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0 3.0 Q4 2015
MSM8953 (625)[74] 14 nm LPP 8 cores up to 2.0 GHz Cortex-A53 Adreno 506 650 MHz (FHD / 1080p) Up to 24 MP camera / 13 MP dual X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 3.0 Q2 2016
MSM8953 Pro (626)[75] 8 cores up to 2.2 GHz Cortex-A53 Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0 Q4 2016

Snapdragon 650 (618), 652 (620) and 653 (2015/16)[]

The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.[41] They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.[76]
The Snapdragon 653 was announced on October 18, 2016.[47][48]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8956 (650)[77] 28 nm HPm 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) Adreno 510 600 MHz (Quad HD / 2560x1600) Hexagon V56 Up to 21 MP camera / 13 MP dual LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 3.0 Q1 2016
MSM8976 (652)[78] 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53)
MSM8976 Pro (653)[79] 4 + 4 cores (1.95 GHz Cortex-A72 +
1.44 GHz Cortex-A53) 		X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Q4 2016

Snapdragon 630, 636 and 660 (2017)[]

Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017. [80]
The Snapdragon 636 was announced on October 17, 2017.[81]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM630 [82] 14 nm LPP 4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)[83][84] Adreno 508 (QXGA / Full HD / 1920x1200) Hexagon 642 Spectra 160 (Up to 24 MP camera / 13 MP dual) LPDDR4 Dual-channel 1333 MHz X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 4.0 Q2 2017
SDM636 [85] 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.6 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 509 (FHD+) Hexagon 680 Spectra 160 (Up to 24 MP camera / 16 MP dual) Q4 2017
SDM660 [86] 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.84 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 512 (WQXGA / Quad HD / 2560x1600) Spectra 160

(48 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4 Dual-channel 1866 MHz Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 Q2 2017
SDA660 [87] Internal: no Q2 2017

Snapdragon 632 and 670 (2018)[]

The Snapdragon 632 was announced on June 26, 2018.[54] Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.[88] Pin and software compatible with Snapdragon 710.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM632 [89] 14 nm LPP 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 250 Silver – Cortex-A53 derivative)[57] Adreno 506 (Full HD / Full HD+ / 1920x1200) Hexagon 546 Up to 40 MP camera / 13 MP at 30fps Dual Camera with MFNR/ZSL LPDDR3 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 364 Mbit/s, USB 3.0 3.0 Q3 2018
SDM670 [90] 10 nm LPP 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative)[91] Adreno 615 (FHD+ / 2560x1600, External up to 4K) Hexagon 685 (3 TOPS) Spectra 250 (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Dual-channel 1866 MHz X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4+ Q3 2018

Snapdragon 662, 665, 675 and 678 (2019/20)[]

The Snapdragon 675 was announced on October 22, 2018.[92]
The Snapdragon 665 was announced on April 9, 2019.[93][94]
The Snapdragon 662 was announced on January 20, 2020 with NavIC Support.[59]
The Snapdragon 678 was announced on December 15, 2020.[95]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6115 (662)[96] 11 nm LPP 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 derivative + 1.8 GHz Kryo 260 Silver – Cortex-A53 derivative) Adreno 610 (Full HD+ / 2520x1080) Hexagon 683 Spectra 340T (192 MP camera / 16 MP dual with MFNR/ZSL) LPDDR3 up to 933 MHz / LPDDR4X up to 1866 MHz X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ax-ready, 802.11ac Wave 2, NavIC, USB 3.1 3.0 Q1 2020
SM6125 (665)[97] Hexagon 686 (3.3 TOPS) Spectra 165 (48 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR3/LPDDR4X
Dual‑channel
up to 1866 MHz 		X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1 Q2 2019
SM6150 (675)[98] 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative)[99] Adreno 612 (FHD+ / 2520x1080, External up to 4K) Hexagon 685 (3 TOPS) Spectra 250L (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Dual-channel 1866 MHz Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 4+ Q1 2019
SM6150-AC (678)[100] 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 derivative + 1.7 GHz Kryo 460 Silver – Cortex-A55 derivative) Q4 2020

Snapdragon 690 5G (2020)[]

The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G Connectivity.[101]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM6350 (690)[102] 8 nm LPP 2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 derivative + 1.7 GHz Kryo 560 Silver – Cortex-A55 derivative) Adreno 619L (Full HD+@120Hz; HDR10, HLG) Hexagon 692 Spectra 355L (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording

LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) Internal X51 5G/LTE (5G NR Sub-6: download up to 2.5 Gbit/s, upload: up to 900 Mbit/s; LTE: download Cat 18, up to 1200 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) 4+ H2 2020

Snapdragon 7 Series[]

On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.[103]

Snapdragon 710 and 712 (2018/19)[]

The Snapdragon 710 was announced on May 23, 2018.[104] Pin and software compatible with Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.[105]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM710 [106] 10 nm LPP 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) Adreno 616 (Quad HD+; HDR) Hexagon 685 (3 TOPS) Spectra 250 (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4 Q2 2018
SDM712 [107] 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 derivative + 1.7 GHz Kryo 360 Silver – Cortex-A55 derivative) 4+[108] Q1 2019

Snapdragon 720G/730/730G/732G (2019/20)[]

The Snapdragon 730 and 730G were announced on April 9, 2019.[93][109]
The Snapdragon 720G was announced on January 20, 2020.[59]
The Snapdragon 732G was announced on August 31, 2020.[110]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7125 (720G)[111] 8 nm LPP (Samsung) 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 465 Silver – Cortex-A55 derivative) Adreno 618 (Full HD+; HDR10, HLG) Hexagon 692 Spectra 350L (192 MP single camera /

16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X up to 8 GB, Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC, NavIC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ Q1 2020
SM7150-AA (730)[112],
SM7150-AB (730G)[113] 		2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative) Adreno 618 (Quad HD+ / 3360x1440; HDR10, HLG) Hexagon 688 Spectra 350 with CV accelerator (192 MP single camera /

22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording

Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q2 2019
SM7150-AC (732G) [114] 2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 470 Silver – Cortex-A55 derivative) Hexagon 688 (3.6 TOPS) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q3 2020

Snapdragon 750G and 765/765G/768G 5G (2020)[]

The Snapdragon 765 and 765G were announced on December 4, 2019[115] as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the Play Store.[116]
The Snapdragon 768G was announced on May 10, 2020.[117]
The Snapdragon 750G was announced on September 22, 2020.[118]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7225 (750G)[119] 8 nm LPP (Samsung) 2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 derivative + 1.8 GHz Kryo 570 Silver – Cortex-A55 derivative) Adreno 619 (Full HD+@120Hz; HDR10, HLG) Hexagon 694 (4.7 TOPS) Spectra 355L (192 MP single camera /

16/32 MP at 30fps dual camera with MFNR/ZSL); HDR10, HLG video recording

LPDDR4X, Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) Internal X52 5G/LTE (5G: download up to 3.7 Gbit/s, upload: up to 1.6 Gbit/s; LTE: download Cat 18, up to 1200 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200; Bluetooth 5.1; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), NFC, NavIC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ Q4 2020
SM7250-AA (765)[120]

SM7250-AB (765G)[121]

7 nm LPP EUV (Samsung) 1 + 1 + 6 cores (2.4 GHz {765G} or 2.3 GHz {765} Kryo 475 Prime – Cortex-A76 derivative + 2.2 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) Adreno 620 (Quad HD+, 700 GFLOPS; HDR10, HLG) Hexagon 696 (5.4 TOPS) Spectra 355 (192 MP single camera /

22 MP at 30fps Dual Camera with MFNR/ZSL); HDR10, HLG video recording

Bluetooth 5.0, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q1 2020
SM7250-AC (768G)[122] 1 + 1 + 6 cores (2.8 GHz Kryo 475 Prime – Cortex-A76 derivative + 2.4 GHz Kryo 475 Gold – Cortex-A76 derivative + 1.8 GHz Kryo 475 Silver – Cortex-A55 derivative) Bluetooth 5.2, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 Q2 2020

Snapdragon 778G and 780G 5G (2021)[]

The Snapdragon 780G was announced on March 25, 2021.[123]
The Snapdragon 778G was announced on May 19, 2021. [124]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM7325 (778G) 6 nm N6 (TSMC) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78 based) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 based) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 based) Adreno 642L (Full HD+@144Hz; HDR10, HLG, HDR10+) Hexagon 770

(12 TOPs)

Spectra 570L triple-ISP

(1x 192MP, 1x 64MP ZSL, 2x 36+22MP ZSL, 3x 22MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) Internal: X53 5G/LTE (5G: download up to 3.3 Gbit/s, upload up to ?; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4+ Q2 2021
SM7350 (780G) 5 nm 5LPE (Samsung) Adreno 642 (Full HD+@144Hz; HDR10, HLG, HDR10+) Spectra 570 triple-ISP

(1x 192MP, 1x 84MP ZSL, 2x 64+20MP ZSL, 3x 25MP ZSL); HDR10, HLG, HDR10+ video recording; 10-bit HDR photo

FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q1 2021

Snapdragon 8 Series[]

The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.

Snapdragon 800, 801 and 805 (2013/14)[]

The Snapdragon 800 was announced on January 8, 2013.[63]

  • CPU features
    • 4 cores up to 2.36 GHz Krait 400
    • 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache
  • GPU features
  • DSP features
    • H.264, VP8 UHD/30fps encoding/decoding (From 1080p60)
  • ISP features
    • Up to 21 megapixel, stereoscopic 3D dual image signal processor (HDRI Support)
    • Throughput: 0.64 GP/sec
    • Up to 320MHz
  • Modem and Wireless features
    • Wi-Fi 802.11ac wave 1 support
    • Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s), on some models
  • SOC features

The Snapdragon 801 was announced on February 24, 2014.[128]
Notable features:[129]

  • CPU features
    • 4 cores up to 2.45 GHz Krait 400
  • DSP features
    • H.265 HD/30fps software decoding
  • ISP features
    • Throughput: 1.0 GP/sec (From 0.64 GP/sec on S800)[130]
    • Up to 465MHz (From 320MHz on S800)[130]
  • eMMC 5.0 support (Up to 400MB/s) [125]
  • DSDA[125]

The Snapdragon 805 was announced on November 20, 2013.[131]

  • CPU features
    • 4 cores up to 2.7 GHz Krait 450
    • Up to 128-bit wide LPDDR3 memory interface
  • GPU features
    • Adreno 420 GPU
      • Up to 128 ALU
      • Hardware dynamic tessellation support
      • Support for hull, domain and geometry shaders[132]
      • Update with new dedicated connection to the memory controller(From shared bus with the video decoder and ISP)[132]
      • Up to 40% increase performance in shader hardware[132]
      • 1.5x Larger L2 cache (1536 KB from 1024 KB)
      • Better support Anisotropic filtering
      • Larger texture cache[133]
      • Full support Direct3D Feature Level 11_2 and OpenCL 1.2
  • DSP features
    • Improve H.265 support : UHD/30fps hardware decoding[134]
    • 1080p 120fps encoding and decoding
  • ISP features
    • Up to 55 megapixel
    • Throughput: 1.0 GP/sec(From 0.64 GP/sec on SD800)[135]
  • Modem and Wireless features
    • External modem
Model number Fab CPU (ARMv7) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
APQ8074AA (800)[136] 28 nm HPm 4 cores up to 2.26 GHz Krait 400 Adreno 330 450 MHz (2160p) Hexagon QDSP6 V5 600 MHz Up to 21 MP camera LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) - Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B 2.0 Q2 2013[63]
MSM8274AA (800)[136] Gobi 3G (UMTS)
MSM8674AA (800)[136] Gobi 3G (CDMA/UMTS)
MSM8974AA (800)[136] Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s)
MSM8974AA v3 (801)[129] Gobi 4G (LTE Cat 4) Q3 2014
APQ8074AB v3 (801)[129] 4 cores up to 2.36 GHz Krait 400 Adreno 330 578 MHz[137] (2160p) LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) - Q4 2013
MSM8274AB (800)[136] Gobi 3G (UMTS) Q4 2013[138]
MSM8674AB v3 (801)[129] Gobi 3G (CDMA/UMTS) Q2 2013[63]
MSM8974AB v3 (801)[129][139] Gobi 4G (LTE Cat 4) Q4 2013
MSM8274AC v3 (801)[129] 4 cores up to 2.45 GHz[140] Krait 400[141] Gobi 3G (UMTS) Q2 2014[63]
MSM8974AC v3 (801)[129] Gobi 4G (LTE Cat 4) Q1 2014[63]
APQ8084 (805)[142] 4 cores up to 2.7 GHz Krait 450 Adreno 420 600 MHz (2160p) Hexagon V50 800 MHz Up to 55 MP camera LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s) External Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B Q1 2014

Snapdragon 808 and 810 (2015)[]

The Snapdragon 808 and 810 were announced on April 7, 2014.[143]

Snapdragon 808 notable features over its predecessor (805):[144]

Snapdragon 810 notable features over its lower end (808):[148]

  • CPU features
  • GPU features
  • ISP features
    • 14-bit dual-ISP up to 55 MP
    • Throughput: 1.2 GP/sec (From 1.0 GP/sec on SD805)
    • ISP is clocked at 600 MHz
  • DSP features
  • Modem and Wireless features
    • Snapdragon X10 LTE modem
      • Cat 9: download up to 450 Mbit/s
      • Upload up to 50 Mbit/s
    • Bluetooth 4.1[150]
  • SOC features
    • 20 nm manufacturing technology
    • 2.5 billion transistor[127]
Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8992 (808)[144][151] 20 nm (TSMC) 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)[152] Adreno 418 600 MHz[153] Hexagon V56 800 MHz Up to 21 MP camera LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)[154] Bluetooth 4.1; 802.11ac; IZat Gen8C 2.0 Q3 2014[155]
MSM8994 (810)[148][151] 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)[156] Adreno 430 600 MHz Up to 55 MP camera LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)
MSM8994v2[157] Adreno 430 630 MHz[157] 2015[157]
MSM8994v2.1[158] Q2 2015

Snapdragon 820 and 821 (2016)[]

The Snapdragon 820 was announced at the Mobile World Congress in March 2015,[159] with the first phones featuring the SoC released in early 2016.[160][161] The Snapdragon 821 was announced in July 2016.[162] The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.[162]

Notable features over its predecessor (Snapdragon 808 and 810):[159]

  • CPU features
    • Custom Kryo quad-core CPU
    • Per Core : L1: 32+32 KB, L2: 2 MB + 1 MB[160]
    • L3 cache shared between CPU cluster[163]
  • GPU features
  • DSP features
    • Hexagon 680 DSP 1st generation "AI engine"[164]
      • Down to 2-3 time power consumption (From SD808)
      • New low power island (LPI) for sensor aware apps
      • Hexagon Vector eXtensions
    • All-Ways Aware Hub low power island
    • Neural Processing Engine (NPE)
    • Halide and TensorFlow support
    • H.264, H.265 UHD/30fps encoding
    • H.264, H.265 10-bit, VP9 UHD/60fps decoding
  • ISP features
    • Qualcomm Spectra ISP with Dual 14-bit ISPs
    • 28 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 13 MP Dual Camera with ZSL
    • Video Capture: Up to 4K Ultra HD HEVC video capture @ 30FPS
    • Video Playback: Up to 4K Ultra HD 10-bit HEVC video playback @ 60FPS, 1080p@ 240 FPS
    • Throughput: 1.2GP/sec (Same as 810)
  • Modem and Wireless features
    • Snapdragon X12 LTE modem
      • Download: Cat 12 (up to 600 Mbit/s), 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C
      • Upload: Cat 13 (up to 150 Mbit/s), 2x20 MHz CA; 64-QAM
      • Support MIMO 4×4
    • 802.11a/b/g/n/ac Wi-Fi connectivity
    • Wi-Fi ad support with external chip
  • SOC features
    • 14 nm FinFET process
    • eMMC 5.1/UFS 2.0
    • Quick Charge 3.0[165]
    • 2.0 billion transistors[166]
    • Max 8 Go LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)
    • 11 W TDP

The Snapdragon 821 was announced on August 16, 2016.[167]

Notable features over its predecessor (Snapdragon 820):

  • CPU features
    • Faster CPU (+10%)
  • GPU features
    • Faster GPU 650Mhz from 624 (+5%)
    • Snapdragon VR-SDK.[167]
  • ISP features
    • Support Dual PD (PDAF).[167]
    • Extended laser Auto-focus.[167]
Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8996 Lite (820)[168] 14 nm FinFET LPP (Samsung) 2 + 2 cores (1.804 GHz + 1.363 GHz Kryo) Adreno 530 510 MHz (407.4 GFLOPS) Hexagon 680 1 GHz Spectra (Up to 28 MP camera / 13 MP dual) LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s) X12 LTE (download: Cat 12,

up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)

Bluetooth 4.1; 802.11ac/ad; IZat Gen8C 3.0 Q1 2016
MSM8996 (820)[168] 2 + 2 cores (2.15 GHz + 1.593 GHz Kryo) Adreno 530 624 MHz (498.5 GFLOPS) LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Q4 2015
MSM8996 Pro-AB[169][170] (821) Q3 2016
MSM8996 Pro-AC[169][170][171] (821) 2 + 2 cores (2.342 GHz + 1.6/2.188 GHz Kryo) Adreno 530 653 MHz (519.2 GFLOPS)

Snapdragon 835 (2017)[]

The Snapdragon 835 was announced on November 17, 2016.[172]

Notable features over its predecessor (821).

  • CPU features
    • Samsung 10nm FinFET Low-Power Early fabrication, 3 billion transistors[134]
    • 4 Kryo 280 Gold (ARM Cortex-A73 based)
      • L1 cache: 64 kB + 64 kB
      • L2 cache: 2 MB
    • 4 Kryo 280 Silver (ARM Cortex-A53 based)
    • LPDDR4X in dual-channel mode, up to 1866MHz
  • GPU features
  • DSP features
  • ISP features:
    • Qualcomm Spectra 180 ISP with Dual 14-bit ISPs
    • Single Camera, 30fps: Up to 32 MP
    • 32 MP at 30fps single camera; 25 MP at 30fps single camera with ZSL; 16 MP Dual Camera with ZSL
    • Video Capture: Up to 4K Ultra HD video capture @ 30FPS
    • Video Playback: Up to 4K Ultra HD video playback
    • Codec Support: H.265 (HEVC), H.264 (AVC), VP9
  • Modem and Wireless features
    • Snapdragon X16 LTE modem
      • Downlink: LTE Cat 16 up to 1 Gbit/s, 4x20 MHz carrier aggregation, up to 256-QAM
      • Uplink: LTE Cat 13 up to 150 Mbit/s, Qualcomm® Snapdragon Upload+ (2x20 MHz carrier aggregation, up to 64-QAM, uplink data compression)
    • 802.11a/b/g/n/ac/ad Wi-Fi connectivity
    • Bluetooth 5.0 (From Bluetooth 4.1)
  • SOC features
Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8998 (835)[177] 10 nm FinFET LPE (Samsung) 4 + 4 cores (2.45 GHz + 1.9 GHz Kryo 280) Adreno 540 710/670 MHz (737/686 GFLOPS) Hexagon 682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4.0 Q2 2017[178]

Snapdragon 845 (2018)[]

The Snapdragon 845 was announced on December 7, 2017.[179][180]

Snapdragon 845's notable features:[181][182][183]

  • CPU features
    • Samsung 10nm FinFET Low-Power Plus fabrication
    • 4 Kryo 385 Gold (ARM Cortex-A75 based)
      • L1 cache: 64 KB + 64 KB
      • L2 cache: 256 KB
    • 4 Kryo 385 Silver (ARM Cortex-A55 based)
    • DynamIQ with 2 MiB L3 cache
  • 3 MiB system-level cache for CPU, GPU, DSP... [184]
  • DSP features
    • Hexagon 685 3rd generation "AI engine" with greater than 3 trillion operations per second (TOPS)
    • Hexagon Vector eXtensions
    • All-Ways Aware Hub low power island
    • Neural Processing Engine (NPE)
    • Caffe, Caffe2, Halide and TensorFlow support
    • Up to 4K Ultra HD @ 60 FPS (From 4K30 Encode), 2x 2400x2400 @ 120 FPS (VR)
    • Can record 240 FPS in 1080p and 480 FPS in 720p (Slow motion)
    • 10-bit color depth (encoding and decoding) on H.264, H.265 and VP9
    • BT.2020 support on DSP and GPU[181]
  • ISP features:
    • Qualcomm Spectra 280 ISP with Dual 14-bit ISPs
    • 192 MP single camera; 48 MP single camera with MFNR; 32 MP at 30fps single camera with MFNR/ZSL; 16 MP at 60fps single camera with MFNR/ZSL; 16 MP at 30fps Dual Camera with MFNR/ZSL
  • Modem and Wireless features
    • Downlink: 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers[183]
    • Uplink: 2x20 MHz carrier aggregation, up to 64-QAM
    • Bluetooth enhancements
    • Ultra-low power wireless earbuds
    • Direct audio and aptX HD quality stereo broadcast to multiple wireless speakers
    • Wi-Fi ad 60 GHz with external Module[183]
    • Improve GPS support : Glonass, Beidou, Galileo, QZSS and SBAS[183]
  • System on a chip features
Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SDM845 [181] 10 nm
FinFET LPP
(Samsung) 		4 + 4 cores (2.8 GHz Kryo 385 Gold+ 1.8 GHz Kryo 385 Silver) Adreno 630 710 MHz (737 GFLOPS) Hexagon 685

(3 TOPs)

Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4+ Q1 2018

Snapdragon 855/855+ (2019) and 860 (2021)[]

The Snapdragon 855 was announced on December 5, 2018.[189][190] The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.

Notable features over its predecessor (845):

  • 7 nm (N7 TSMC) process
  • Die size: 73 mm²(8.48 mm × 8.64 mm)[191][192]
  • 6.7 billion Transistors[192]
  • Support up to 16 GB LPDDR4X 2133 MHz support
  • 4x 16-bit memory bus, (34.13 GB/s) up to 16 GB[193]
  • NVM Express 2x 3.0 (1x for external 5G modem)
  • 10 W TDP
  • CPU features[194]
    • 1 Kryo 485 Prime (Cortex-A76-based), up to 2.84 GHz. Prime core with 512 KB pL2
    • 3 Kryo 485 Gold (Cortex-A76-based), up 2.42 GHz. Performance cores with 256 KB pL2 each
    • 4 Kryo 485 Silver (Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
    • DynamIQ with 2 MB sL3 cache
  • 3 MB system-level cache
  • GPU features
    • Adreno 640 GPU with support for Vulkan 1.1
    • Up to 768 ALU (From 512 on Adreno 630)
    • Tri-core GPU @ 585 MHz with 768 ALUs, 36 TMUs and 28 ROPs (up from 512 ALUs, 24 TMUs and 16 ROPs)[173]
    • 954.7 FP32 GFLOPs, 1853.3 FP16 GFLOPs, 28.1 bilinear GTexels/s, 9.4 GPixels/s and 300 GB/s effective memory bandwidth[195]
    • HDR gaming (10-bit color depth, Rec. 2020)
    • 120 fps gaming
    • Improvement on hardware-accelerated H.265 and VP9 decoder
    • HDR playback codec support for HDR10+, HDR10, HLG and Dolby Vision
    • Volumetric VR video playback
    • 8K 360 VR video playback
    • Quarterly GPU driver updates via Google Play Store
    • Android GPU Inspector Tool[196]
  • DSP features[197]
    • Hexagon 690 4th generation "AI engine" with greater than 7 trillion operations per second (TOPS)
    • Qualcomm Hexagon Vector Accelerator with Hexagon Vector eXtensions
    • Qualcomm Hexagon Tensor Accelerator (HTA)
    • Qualcomm Hexagon Voice Assistant
    • All-Ways Aware Hub
    • Caffe, Caffe2, Halide and TensorFlow support
    • Vector/Scalar performance compared with Hexagon 680: doubled the HVX vector units and 20% increase in scalar performance
  • ISP features:
    • Qualcomm Spectra 380 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
    • Multi-frame noise reduction[198]
    • Hybrid AF
    • 192 MP single camera; 48 MP at 30 fps single camera with MFNR/ZSL; 22 MP at 30 fps dual camera with MFNR/ZSL
    • HEIF photo capture support
    • Tri-core hardware CV functions including object detection & tracking, and stereo depth processing
    • Advanced HDR solution including improved zzHDR and 3-exposure Quad Color Filter Array (QCFA) HDR
    • 4K 60 FPS HDR video with real-time object segmentation (portrait mode, background swap) features HDR10, HDR10+ and HLG with Portrait Mode (bokeh), 10-bit color depth and Rec. 2020 color gamut
    • Up to 1.32 Gpixel/s[199]
    • Video Capture Formats: HDR10, HLG
    • Video Codec Support: H.265 (HEVC), H.264 (AVC), HLG, HDR10, HDR10+, VP8, VP9
  • Modem and Wireless features:[200]
    • Internal X24 LTE Modem
    • Download: 2000 Mbit/s DL (Cat. 20), 7x20 MHz CA, 256-QAM, 4x4 MIMO
    • Upload: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM
    • External Snapdragon X50 (5G Modem): 5000 Mbit/s DL
    • Qualcomm Wi-Fi 6-ready mobile platform:
      • Wi-Fi Standards: 802.11ax-ready, 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi Spectral Bands: 2.4 GHz, 5 GHz• Channel Utilization: 20/40/80 MHz
      • MIMO Configuration: 2x2 (2-stream) • MU-MIMO• Dual-band simultaneous (DBS)
      • Key Features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
    • Qualcomm 60 GHz Wi-Fi mobile platform
      • Wi-Fi Standards: 802.11ad, 802.11ay
      • Wi-Fi Spectral Band: 60 GHz
      • Peak speed: 10 Gbit/s

The Snapdragon 855+ was announced on July 15, 2019.[201]

The Snapdragon 860 was announced on March 22, 2021.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8150 (855)[202] 7 nm N7 (TSMC) Kryo 485

1 + 3 + 4 cores (2.84 GHz + 2.42 GHz + 1.80 GHz)

Adreno 640

585 MHz (954.7 GFLOPS)

Hexagon 690

(7 TOPs)

Spectra 380

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit)

2133 MHz

(34.13 GB/s)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X50 5G[203] (5G only: download up to 5 Gbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1, UFS 3.0 4+ Q1 2019
SM8150-AC (855+)[204] Kryo 485

1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz)

Adreno 640

~675 MHz (1037 GFLOPS)

Q3 2019
SM8150P (855+) Internal: no

+

External: X55 (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s)

Q3 2019
SM8150-AC (860)[204] Adreno 640

~? MHz (? GFLOPS)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X50 5G[203] (5G only: download up to 5 Gbit/s)

Q1 2021

Snapdragon 865/865+ 5G (2020) and 870 5G (2021)[]

The Snapdragon 865 was announced on December 4, 2019.[205]

Notable features over its predecessor (855):[206]

  • 2nd generation 7 nm (N7P TSMC) process[207]
  • 10.3 billion transistors[208]
  • 83.54 mm2 (8.49 mm x 9.84 mm)[209]
  • Support up to 16 GB LPDDR5 2750 MHz or LPDDR4X 2133 MHz support
  • 4x 16-bit memory bus, (or 34.13 GB/s) up to 16 GB[210]
  • NVM Express 2x 3.0 (1x for external 5G modem)
  • Support Quick charge 4+
  • 10 W TDP[211]
  • CPU features
    • 1 Kryo 585 Prime (Cortex-A77-based), 2.84 GHz (3.1 GHz for 865+, 3.2 GHz for 870). Prime core with 512 KB pL2
    • 3 Kryo 585 Gold (Cortex-A77-based), 2.42 GHz. Performance cores with 256 KB pL2 each
    • 4 Kryo 585 Silver (Cortex-A55-based), 1.8 GHz. Efficiency cores with 128 KB pL2 each
    • DynamIQ with 4 MB sL3,
    • 25% performance uplift and 25% power efficiency improvement
  • 3 MB system-level cache
  • GPU features[210]
    • Adreno 650 GPU with support for Vulkan 1.1
    • 50% more ALUs and ROPs
    • 25% faster graphics rendering and 35% more power efficient
    • Quarterly GPU driver updates via Google Play Store
    • Android GPU Inspector Tool[196]
    • Desktop Forward Rendering
    • Up to 1372.1 GFLOPs FP32 (From 898.5 GFLOPs on SD855)
  • DSP features
    • Hexagon 698 5th generation "AI engine" capable of 15 trillion operations per second (TOPS)
    • Quad-core Qualcomm Hexagon Tensor Accelerator (HTA)
    • Deep learning bandwidth compression
  • ISP features:
    • Qualcomm Spectra 480 with dual 14-bit CV-ISPs and hardware accelerator for computer vision
    • Multi-frame noise reduction[198]
    • Hybrid AF
    • 200 MP single camera; 64 MP at 30 fps single camera with MFNR/ZSL; 25 MP at 30 fps dual camera with MFNR/ZSL
    • 8K 30 FPS and 4K 120 FPS HDR video
    • Up to 2 Gpixel/s
    • Video capture formats: Dolby Vision, HDR10, HDR10+, HEVC
    • Video codec support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9
    • New functionalities to improve noise reduction and local contrast enhancements
  • Modem and wireless features:
    • External X55 LTE Modem
    • Modes: NSA, SA, TDD, FDD
    • 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
    • 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
    • 5G NR Sub-6 + mmWave download: 7000 Mbit/s DL
    • 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
    • LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
    • LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Dynamic Spectrum Sharing (DSS)
    • Qualcomm Wi-Fi 6-ready mobile platform:
      • Qualcomm FastConnect 6800 (for 865 and 870), 6900 (for 865+)
      • Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E for 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz (for 865 and 870), 2.4 GHz, 5 GHz, 6 GHz (for 865+) • channel utilization: 20/40/80 MHz (for 865 & 870), 20/40/80/160 MHz (for 865+)
      • MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS)
      • Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
    • Qualcomm 60 GHz Wi-Fi mobile platform
      • Wi-Fi Standards: 802.11ad, 802.11ay
      • Wi-Fi spectral band: 60 GHz
      • Peak speed: 10 Gbit/s
  • Other features:
    • Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support

The Snapdragon 865+ was announced on July 8, 2020.[212]

The Snapdragon 870 was announced on January 19, 2021.[213]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8250 (865)[214] 7 nm N7P (TSMC) Kryo 585

1 + 3 + 4 cores (2.84 GHz + 2.42 GHz + 1.80 GHz)

Adreno 650 587MHz (1202.1 GFLOPs in FP32) Hexagon 698

(15 TOPs)

Spectra 480 LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or
LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (33.4 GB/s) 		Internal: no(865), yes(870)
External (865): X55 5G/LTE[215] (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) 		FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4+ Q1 2020
SM8250-AB (865+) [216] Kryo 585

1 + 3 + 4 cores (3.1 GHz + 2.42 GHz + 1.80 GHz)

Adreno 650 670MHz (1372.1 GFLOPs in FP32) FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q3 2020
SM8250-AC (870) [217] Kryo 585

1 + 3 + 4 cores (3.2 GHz + 2.42 GHz + 1.80 GHz)

FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 Q1 2021

Snapdragon 888/888+ 5G (2021)[]

The Snapdragon 888 was announced on December 1, 2020.[218][219][220][221][222]

Notable features over its predecessor (865):

  • 5 nm (5LPE) Samsung process
  • ~10 billion transistors
  • Support up to 16 GB LPDDR5 3200 MHz (51.2  GB/s)[223]
  • 4x 16-bit memory bus
  • Quick Charge 5 (100W+)
  • Support UFS 3.1
  • 10 W[224]
  • CPU features
    • 1 Kryo 680 Prime (ARM Cortex-X1-based), up to 2.84 GHz. Prime core with 1 MB pL2 and 64 KB pL1
    • 3 Kryo 680 Gold (ARM Cortex-A78-based), up 2.42 GHz. Performance cores with 512 KB pL2 each
    • 4 Kryo 680 Silver (ARM Cortex-A55-based), up 1.8 GHz. Efficiency cores with 128 KB pL2 each
    • Move to instruction set ARMv8.4-A (From ARMv8.2-A)
    • DynamIQ with 4 MB sL3,
    • 25% performance uplift and 25% power efficiency improvement
  • 3 MB system-level cache
  • GPU features
    • Adreno 660 GPU with API Support: OpenGL ES 3.2, OpenCLTM 2.0 FP, Vulkan 1.1
    • Up to 840 MHz (From 670 MHz on 865+ and 870)
    • 35% faster graphics rendering and 20% more power efficient
    • 73% AI performance boost (From 15 TOPS to 26 TOPS)
    • (VRS)[225]
    • Demura and subpixel rendering for OLED uniformity
    • Up to 1720.3 GFLOPs FP32 (From 1202.1 GFLOPs on SD865)
    • HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
    • HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
    • On-device display: 4K@60Hz, QHD+@144Hz
    • External display: 4K@60Hz, 10-bit, Rec. 2020, HDR10, HDR10+
  • DSP features
    • Hexagon 780 with Fused AI Accelerator architecture 6th generation "AI engine" capable of 26 trillion operations per second (TOPS), From 15 TOPS on 865.
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
    • Qualcomm Sensing Hub (2nd generation)
      • New dedicated AI processor
      • 80% task reduction offload from Hexagon DSP
      • 5X more processing power
    • 16X larger shared memory
    • 1000X hand off time improvement in certain use cases[226]
    • 50% faster scalar accelerator, 2x faster tensor accelerator
    • Video codec playback support: H.264 (AVC), H.265 (HEVC), VP8, VP9
  • ISP features:
    • Qualcomm Spectra 580 with triple 14-bit CV-ISPs and hardware accelerator for computer vision
    • Single camera: 1x 200 MP or 84 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
    • Dual camera: 64+25 MP at 30 fps with MFNR/ZSL
    • Triple camera: 3x 28 MP at 30 fps with MFNR/ZSL
    • 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
    • Slow-mo video capture at 720p @ 960 FPS, 1080p @ 480 FPS
    • HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
    • HDR photo capture: 10-bit HDR HEIF
    • Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
    • Real-time object classification, segmentation, and replacement
    • AI-based auto-focus, auto-exposure and auto-white-balance
    • Advanced HW-based face detection with deep learning filter
    • New low-light architecture (capture photos in 0.1 lux)
    • 2.7 Gigapixel per second ISP (+35% speed increase over S865)
    • 120 photos at 12MP/s
  • Modem and wireless features:
    • Internal X60 LTE Modem
    • Modes: NSA, SA, TDD, FDD
    • 5G mmWave: 800 MHz bandwidth, 8 carriers, 2×2 MIMO
    • 5G sub-6 GHz: 200 MHz bandwidth, 4×4 MIMO
    • 5G NR Sub-6 + mmWave download: 7500 Mbit/s DL
    • 5G NR Sub-6 + mmWave upload: 3000 Mbit/s UL
    • LTE download: 2500 Mbit/s DL (Cat. 24), 7x20 MHz CA, 1024-QAM, 4x4 MIMO
    • LTE upload: 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Dynamic Spectrum Sharing (DSS)
    • Bluetooth 5.2
      • Dual antennas[227]
      • Premium audio
    • Qualcomm Wi-Fi 6-ready mobile platform:
      • Qualcomm FastConnect 6900
      • Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
      • MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
      • Key features: 8x8 sounding (up to 2x improvement over 4x4 sounding devices), Target Wakeup Time for up to 67% better power efficiency, latest security with WPA3
    • Qualcomm 60 GHz Wi-Fi mobile platform
      • Wi-Fi Standards: 802.11ad, 802.11ay
      • Wi-Fi spectral band: 60 GHz
      • Peak speed: 10 Gbit/s
  • Other features:
    • Secure Processing Unit (SPU) with integrated dual-SIM dual-standby support
    • Adds compatibility with [228]

The Snapdragon 888+ was announced on June 28, 2021.[229]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
SM8350 (888)[230] 5 nm 5LPE (Samsung) 1x 2.84 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based) Adreno 660 840MHz (1720.3 GFLOPs in FP32) Hexagon 780

(26 TOPs)

Spectra 580 LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X60 5G/LTE (5G: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to .316 Gbit/s) FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 5 Q1 2021
SM8350-AC (888+)[231] 1x 3.0 GHz Kryo 680 Prime (Cortex-X1 based) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 based) + 4x 1.80 GHz Kryo 680 Silver (Cortex-A55 based) Hexagon 780

(32 TOPs)

Q3 2021

Compute Platforms for Windows 10 PCs[]

Snapdragon 835, 850, 7c, 7c Gen 2, 8c, 8cx and 8cx Gen 2 5G[]

The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.[179]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.[232] It is essentially an over-clocked version of the Snapdragon 845.
The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.[233][234]

Notable features over the 855:

  • 10 MB L3 cache
  • 8x 16-bit memory bus, (68.26 GB/s)
  • NVM Express 4x

The Snapdragon 7c Compute Platform and Snapdragon 8c Compute Platform for Windows 10 PCs were announced on December 5, 2019.[235]
The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.[236]
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021. [237]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
MSM8998 (835)[238] 10 nm FinFET LPE (Samsung) Kryo 280 4 + 4 cores

(2.6 GHz + 1.9 GHz)

Adreno 540 710/670 MHz (737/686 GFLOPS) Hexagon 682 Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4 Q2 2018
SDM850 [239] 10 nm
FinFET LPP
(Samsung) 		Kryo 385 4 + 4 cores

(2.95 GHz + 1.8 GHz)

Adreno 630 710 MHz (737 GFLOPS) Hexagon 685

(3 TOPs)

Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ Q3 2018
SC7180 (7c)[240] 8 nm LPP (Samsung) Kryo 468 2 + 6 cores

(up to 2.4 GHz)

Adreno 618 Hexagon 692 (5 TOPS) Spectra 255 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 16-bit (32-bit)

2133 MHz

X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11a/b/g/n/ac/ad/ax; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 2020
SC7180P
(7c Gen 2)[241] 		Kryo 468 2 + 6 cores

(up to 2.55 GHz)

Q2 2021
SC8180 (8c) [242] 7 nm (TSMC N7) Kryo 490 4 + 4 cores

(2.45 GHz + 1.80 GHz)

Adreno 675 Hexagon 690

(9 TOPs)

Spectra 390

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit)

2133 MHz

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM)

+

External: X55 5G/LTE[215] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2,5 Gbit/s, upload up to 316 Mbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4+ 2020
SC8180X (8cx)[243] Kryo 495 4 + 4 cores

(2.84 GHz + 1.80 GHz)

Adreno 680 (1842.5 GFLOPS) LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.26 GB/s)

Q3 2019
SC8180XP (8cx Gen 2)[244] Kryo 495 4 + 4 cores

(3.15 GHz + ?.? GHz)

Adreno 690 Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO), NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD Q3 2020

Microsoft SQ1 and SQ2[]

The Microsoft SQ1 was announced on October 2, 2019.[245][246] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.[247]

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
Microsoft SQ1 7 nm

(TSMC N7)

Kryo 495 4 + 4 cores

(3 GHz + 1.80 GHz)

Adreno 685 (2100 GFLOPs) Hexagon 690 Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.26 GB/s)

Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20MHz CA, 256-QAM) Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD 4+ Q3 2019
Microsoft SQ2 Kryo 495 4 + 4 cores

(3.15 GHz + 2.42 GHz)

Adreno 690 Q3 2020

Hardware codec supported[]

See : Qualcomm Hexagon

Wearable platforms[]

Snapdragon Wear series[]

The Qualcomm Snapdragon Wear 2100 processor is designed for smartwatches. It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions. The LG Watch Style uses this processor.[248]
The Snapdragon Wear 2500[249] was announced on June 26, 2018.
The Snapdragon Wear 3100[250] was announced on September 10, 2018.

The Snapdragon Wear 4100 and 4100+[251] were announced on June 30, 2020. The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

Model number Fab CPU GPU DSP Memory technology Modem Connectivity Sampling availability
Wear 1100[252] 28 nm LP 1 core up to 1.2 GHz Cortex-A7 (ARMv7) Fixed Function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2016[253]
Wear 1200[254] 1 core up to 1.3 GHz Cortex-A7 (ARMv7) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou Q2 2017[255]
MSM8909w[256] (Wear 2100,[257] 2500[258] and 3100[259]) 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) Adreno 304 Hexagon LPDDR3 400 MHz (800 MT/s) X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou Q1 2016[260]
SDM429w (Wear 4100 and 4100+[261]) 12 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) Adreno 504 Hexagon QDSP6 V56 LPDDR3

750 MHZ

X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou Q2 2020[262]

Automotive platforms[]

Snapdragon 602A, 820A and 855A[]

The Snapdragon 602A,[263] for application in the motor industry,[264] was announced on January 6, 2014.
The Snapdragon 820A[265] was announced on January 6, 2016.

Model number Fab CPU GPU DSP Memory technology Modem Connectivity Sampling availability
8064-AU (602A)[266] 28 nm LP 4 cores up to 1.5 GHz Krait 300 (ARMv7) Adreno 320 (2048x1536 + 1080p external display) Hexagon V40 600 MHz LPDDR3 Dual-channel 32-bit 533 MHz External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS) Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 2-stream 802.11n/ac Q1 2014
MSM8996AU (820A)[267] 14 nm FinFET LPP (Samsung) 4 cores up to 2.1 GHz Kryo (ARMv8) Adreno 530
 Hexagon 680 1 GHz LPDDR4 X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1; 802.11ac/ad; IZat Gen8C
SA8155P (855A) 7 nm (TSMC N7) Kryo 485 1 + 3 + 4 cores (2.96 GHz + 2.42 GHz + 1.80 GHz) Adreno 640
 Hexagon 690 LPDDR4X Internal: no Bluetooth 5; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS

Embedded platforms[]

Snapdragon 410E, 600E, 800, 810 and 820E[]

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[268][269]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[270]

Model number Fab CPU GPU DSP ISP Memory technology Modem Connectivity Sampling availability
APQ8016E (410E)[271] 28 nm LP 4 cores up to 1.2 GHz Cortex-A53 (ARMv8) Adreno 306 Hexagon QDSP6 V5 691 MHz Up to 13 MP camera LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) none Bluetooth 4.0, 802.11n, GPS
APQ8064E (600E)[272] 4 cores up to 1.5 GHz Krait 300 (ARMv7) Adreno 320 400 MHz Hexagon QDSP6 V4 500 MHz Up to 21 MP camera DDR3/DDR3L Dual-channel 533 MHz Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074 (800)[273] 28 nm HPm 4 cores up to 2.3 GHz Krait 400 (ARMv7) Adreno 330
 Hexagon QDSP6 V5 Up to 55 MP camera LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094 (810)[274] 20 nm (TSMC) 4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8) Adreno 430 650 MHz Hexagon V56 800 MHz Up to 55 MP camera LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096 (820E)[275] 14 nm FinFET LPP (Samsung) 2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8) Adreno 530 Hexagon 680 825 MHz Up to 28 MP camera LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform[]

The Qualcomm Vision Intelligence Platform[276] was announced on April 11, 2018.[277][278] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability
QCS603 [279] 10 nm LPP 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display) Hexagon 685 Spectra 270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHz none Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+
QCS605 [280] 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms[]

Qualcomm 212, 624 and Smart Audio[]

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[281] was announced on June 14, 2017.[282]
The Qualcomm 212 Home Hub (APQ8009)[283] and Qualcomm 624 Home Hub (APQ8053)[284] were announced on January 9, 2018.[285]

The QCS400 Series was announced March 19, 2019.[286]

Model number Fab CPU GPU DSP ISP Audio Memory technology Modem Connectivity Sampling availability
APQ8009[287][281] (SDA212)[288] 28 nm LP 4 cores up to 1.3 GHz Cortex-A7 (ARMv7) Adreno 304 (HD) Hexagon 536 Up to 16 MP camera LPDDR2/3 Single-Channel 533 MHz none Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017[281] 4 cores up to 1.4 GHz Cortex-A53 (ARMv8) Adreno 308 (Full HD) LPDDR3 Single-channel 667 MHz
APQ8053[289] (SDA624)[290] 14 nm LPP 8 cores up to 1.8 GHz Cortex-A53 (ARMv8) Adreno 506 (Full HD+) Hexagon 546 Up to 24 MP camera / 13 MP dual LPDDR3
QCS403[291] Dual-core CPU none 2x Hexagon V66 12x Audio Channels Supported Bluetooth 5.1;

802.11ax-ready, 802.11ac, 4x4 (MIMO);

Zigbee/15.4

Q1 2019
QCS404[292] Quad-core CPU
QCS405[293] Adreno 506 (Full HD+)
QCS407[294] 32x Audio Channels Supported

eXtended Reality (XR) platforms[]

Snapdragon XR1 and XR2[]

In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.[295]
The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865.[296][failed verification][297] and is used in the Oculus Quest 2 VR headset, released in October 2020.

Model number Fab CPU (ARMv8) GPU DSP ISP Memory technology Tracking Connectivity Sampling availability
XR1[298] ? Kryo Adreno Hexagon Spectra LPDDR4X? 3DoF and 6DoF head and controller tracking ? Q1 2019
XR2[299] ? Kryo Hexagon Spectra - input from up to 7 cameras LPDDR4X? Full 6DoF head and controller tracking, as well as hand and finger tracking ? Q1 2020

Bluetooth SoC platforms[]

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.[300][301] Qualcomm announced the QCC5100 Series at CES 2018.[302]

On January 28 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[303][304] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[305] On March 25 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.[306][307]

Qualcomm QCC300x Series Bluetooth audio SoCs[]

Model number Fab CPU DSP Bluetooth Technologies Support Power Consumption DAC output / Digital Microphone Input Sampling availability
QCC3001[308] RISC application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP (Up to 80 MHz) Bluetooth 5.0

Dual-mode Bluetooth

TrueWireless Stereo

cVc audio

Mono / 2-mic
QCC3002[309] TrueWireless Stereo

aptX Classic/HD/LL

cVc audio

QCC3003[310] cVc audio Stereo / 1-mic
QCC3004[311] Stereo / 2-mic
QCC3005[312] aptX Classic/HD/LL

cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs[]

Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital Assistant activation Sampling availability
QCC3020[313] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

~6mA (2DP streaming) Mono / 2-mic Button press H1 2017
QCC3021[314] Stereo / 1-mic
QCC3024[315] cVc audio

Google Fast Pair

Stereo / 2-mic
QCC3026[316] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Mono / 2-mic
QCC3031[317] aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Stereo / 1-mic
QCC3034[318] aptX Classic/HD/LL

cVc audio

Google Fast Pair

Mono / 2-mic
QCC3040[319] Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[303][304]BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

<5 mA Stereo / 2-mic Button press H1 2020
QCC3046[320] <5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs[]

Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital Assistant activation Sampling availability
QCC5120[321] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

Button press

Qualcomm® Voice Activation

H1 2018
QCC5121[322]
QCC5124[323]
QCC5125[324] Single core Qualcomm® Kalimba DSP

(Up to 120 MHz)

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

Button press
QCC5141[325] Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm® Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[303][304]BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~5mA A2DP stream Button press

Qualcomm® Voice Activation

H1 2020
QCC5144[326]

Related pages[]

See also[]

Similar platforms[]

References[]

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