List of AMD accelerated processing units

This is a list of microprocessors designed by Advanced Micro Devices, under the AMD Accelerated Processing Unit product series.

Features overview[]

The following table shows features of AMD's APUs

Platform			High, standard and low power											Low and ultra-low power
Codename	Server	Basic						Toronto
		Micro													Kyoto
	Desktop	Performance										Renoir	Cezanne
		Mainstream	Llano	Trinity	Richland	Kaveri	Kaveri Refresh (Godavari)	Carrizo	Bristol Ridge	Raven Ridge	Picasso
		Entry
		Basic													Kabini
	Mobile	Performance										Renoir	Cezanne
		Mainstream	Llano	Trinity	Richland	Kaveri		Carrizo	Bristol Ridge	Raven Ridge	Picasso
		Entry																	Dalí
		Basic												Desna, Ontario, Zacate	Kabini, Temash	Beema, Mullins	Carrizo-L	Stoney Ridge
	Embedded			Trinity		Bald Eagle		Merlin Falcon, Brown Falcon		Great Horned Owl		Grey Hawk		Ontario, Zacate	Kabini	Steppe Eagle, Crowned Eagle, LX-Family		Prairie Falcon	Banded Kestrel
Released			Aug 2011	Oct 2012	Jun 2013	Jan 2014	2015	Jun 2015	Jun 2016	Oct 2017	Jan 2019	Mar 2020	Jan 2021	Jan 2011	May 2013	Apr 2014	May 2015	Feb 2016	Apr 2019
CPU microarchitecture			K10	Piledriver		Steamroller		Excavator	"Excavator+"[1]	Zen	Zen+	Zen 2	Zen 3	Bobcat	Jaguar	Puma	Puma+[2]	"Excavator+"	Zen
ISA			x86-64											x86-64
Socket	Desktop	High-end	N/A											N/A
		Mainstream	N/A					AM4
		Entry	FM1	FM2		FM2+[a]			N/A
		Basic	N/A											N/A	AM1	N/A
	Other		FS1	FS1+, FP2		FP3								FT1	FT3	FT3b
PCI Express version			2.0			3.0								2.0				3.0
Fab. (nm)			GF 32SHP (HKMG SOI)			GF (HKMG bulk)				GF 14LPP (FinFET bulk)	GF (FinFET bulk)	TSMC N7 (FinFET bulk)		TSMC N40 (bulk)	TSMC (HKMG bulk)	GF 28SHP (HKMG bulk)			GF 14LPP (FinFET bulk)
Die area (mm2)			228	246		245		245	250	210[3]		156	180	75 (+ 28 FCH)	107		?	125	149
Min TDP (W)			35	17				12				10		4.5	4	3.95	10	6
Max APU TDP (W)			100			95		65						18	25
Max stock APU base clock (GHz)			3	3.8	4.1	4.1		3.7	3.8	3.6	3.7	3.8	4.0	1.75	2.2	2	2.2	3.2	3.3
Max APUs per node[b]			1											1
Max CPU[c] cores per APU			4									8		2	4			2
Max threads per CPU core			1							2				1					2
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF
IOMMU[d]			N/A
BMI1, AES-NI, CLMUL, and F16C														N/A
MOVBE			N/A
AVIC, BMI2 and RDRAND														N/A
ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, and CLZERO			N/A											N/A
WBNOINVD, CLWB, RDPID, RDPRU, and MCOMMIT			N/A											N/A
FPUs per core			1	0.5						1				1				0.5	1
Pipes per FPU			2											2
FPU pipe width			128-bit									256-bit		80-bit	128-bit
CPU instruction set SIMD level			SSE4a[e]	AVX				AVX2						SSSE3	AVX			AVX2
3DNow!
FMA4, LWP, TBM, and XOP			N/A							N/A				N/A					N/A
FMA3
L1 data cache per core (KiB)			64	16				32						32
L1 data cache associativity (ways)			2	4				8						8
L1 instruction caches per core			1	0.5						1				1				0.5	1
Max APU total L1 instruction cache (KiB)			256	128		192				256		512		64		128		96	128
L1 instruction cache associativity (ways)			2			3				4		8	16	2				3	4
L2 caches per core			1	0.5						1				1				0.5	1
Max APU total L2 cache (MiB)			4					2				4		1	2			1
L2 cache associativity (ways)			16							8				16					8
APU total L3 cache (MiB)			N/A							4		8	16	N/A					4
APU L3 cache associativity (ways)										16									16
L3 cache scheme			Victim			N/A				Victim									Victim
Max stock DRAM support			DDR3-1866		DDR3-2133			DDR3-2133, DDR4-2400	DDR4-2400	DDR4-2933		DDR4-3200, LPDDR4-4266		DDR3L-1333	DDR3L-1600	DDR3L-1866		DDR3-1866, DDR4-2400	DDR4-2400
Max DRAM channels per APU			2											1					2
Max stock DRAM bandwidth (GB/s) per APU			29.866		34.132			38.400		46.932		68.256	?	10.666	12.800	14.933		19.200	38.400
GPU microarchitecture			TeraScale 2 (VLIW5)	TeraScale 3 (VLIW4)		GCN 2nd gen		GCN 3rd gen		GCN 5th gen[4]				TeraScale 2 (VLIW5)	GCN 2nd gen			GCN 3rd gen[4]	GCN 5th gen
GPU instruction set			TeraScale instruction set			GCN instruction set								TeraScale instruction set	GCN instruction set
Max stock GPU base clock (MHz)			600	800	844	866		1108		1250	1400	2100	2100	538	600	?	847	900	1200
Max stock GPU base GFLOPS[f]			480	614.4	648.1	886.7		1134.5		1760	1971.2	2150.4	?	86	?	?	?	345.6	460.8
3D engine[g]			Up to 400:20:8	Up to 384:24:6		Up to 512:32:8				Up to 704:44:16[5]		Up to 512:32:8		80:8:4	128:8:4			Up to 192:?:?	Up to 192:?:?
			IOMMUv1			IOMMUv2								IOMMUv1			?		IOMMUv2
Video decoder			UVD 3.0			UVD 4.2		UVD 6.0		VCN 1.0[6]		VCN 2.1[7]	VCN 2.2[7]	UVD 3.0	UVD 4.0	UVD 4.2	UVD 6.0	UVD 6.3	VCN 1.0
Video encoder			N/A	VCE 1.0		VCE 2.0		VCE 3.1						N/A	VCE 2.0		VCE 3.1
AMD Fluid Motion
GPU power saving			PowerPlay	PowerTune										PowerPlay	PowerTune[8]
TrueAudio			N/A			[9]								N/A
FreeSync						1 2									1 2
HDCP[h]			?			1.4				1.4 2.2				?	1.4				1.4 2.2
PlayReady[h]			N/A							3.0 not yet				N/A					3.0 not yet
Supported displays[i]			2–3	2–4				3		3 (desktop) 4 (mobile, embedded)		4		2				3	4
/drm/radeon[j][11][12]									N/A									N/A
/drm/amdgpu[j][13]			N/A			[14]								N/A	[14]

Graphics API overview[]

The following table shows the graphics and compute APIs support across AMD GPU micro-architectures. Note that this table include micro-architectures not used in the APUs, and a branding series might include older generation chips.

Chip series	Micro­architecture	Fab	Supported APIs					AMD support	Year introduced	Introduced with
			Rendering			Computing / ROCm
			Vulkan[15]	OpenGL[16]	Direct3D	HSA	OpenCL
Wonder	Fixed-pipeline[a]	1000 nm 800 nm	N/A	N/A	N/A	N/A	N/A	Ended	1986
Mach		800 nm 600 nm							1991
3D Rage		500 nm			5.0				1996	3D Rage
Rage Pro		350 nm		1.1	6.0				1997	Rage Pro
Rage 128		250 nm		1.2					1998	Rage 128 GL/VR
R100		180 nm 150 nm		1.3	7.0				2000	Radeon
R200	Programmable pixel & vertex pipelines	150 nm			8.1				2001	Radeon 8500
R300		150 nm 130 nm 110 nm		2.0[b]	9.0 11 (FL 9_2)				2002	Radeon 9700
R420		130 nm 110 nm			9.0b 11 (FL 9_2)				2004	Radeon X800
R520		90 nm 80 nm			9.0c 11 (FL 9_3)				2005	Radeon X1800
R600	TeraScale 1	80 nm 65 nm		3.3	10.0 11 (FL 10_0)		ATI Stream		2007	Radeon HD 2900 XT
RV670		55 nm			10.1 11 (FL 10_1)		ATI Stream APP[17]			Radeon HD 3850/3870
RV770		55 nm 40 nm					1.0		2008	Radeon HD 4850/4870
Evergreen	TeraScale 2	40 nm		4.5 (Linux 4.2) [18][19][20][c]	11 (FL 11_0)		1.2		2009	Radeon HD 5850/5870
Northern Islands	TeraScale 2 TeraScale 3								2010	Radeon HD 6850/6870 Radeon HD 6950/6970
Southern Islands	GCN 1st gen	28 nm	1.0	4.6	11 (FL 11_1) 12 (FL11_1)		1.2 2.0 possible		2012	Radeon HD 7950/7970
Sea Islands	GCN 2nd gen		1.2		11 (FL 12_0) 12 (FL 12_0)		2.0 (1.2 in MacOS, Linux) 2.1 Beta in Linux ROCm 2.2 possible		2013	Radeon HD 7790
Volcanic Islands	GCN 3rd gen								2014	Radeon R9 285
Polaris	GCN 4th gen	14 nm						Current	2016	Radeon RX 480
Vega	GCN 5th gen	14 nm 7 nm			11 (FL 12_1) 12 (FL 12_1)				2017	Radeon Vega Frontier Edition
Navi	RDNA	7 nm							2019	Radeon RX 5700 (XT)
Navi 2X	RDNA 2				11 (FL 12_1) 12 (FL 12_2)				2020	Radeon RX 6800 (XT)

^[21][22][23]

Desktop APUs[]

Lynx: "Llano" (2011)[]

• Socket FM1
• CPU: K10 (or Husky or K10.5) with no L3 cache cores with an upgraded architecture known as Stars
  • L1 Cache: 64 KB Data per core and 64 KB Instructions per core
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
• GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.^[24]
• List of embedded GPU's
• Support for up to four DIMMs of up to DDR3-1866 memory
• Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm², with 1.178 billion transistors^[25][26]
• 5 GT/s UMI
• Integrated PCIe 2.0 controller
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the current Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Model	Released	Fab	Stepping	CPU						GPU				DDR3 Memory support	TDP (W)	Box Number	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
							L1	L2	L3
Sempron X2 198	2012 Q1	32nm	B0	2 (2)	2.5	N/A	64KB inst. 64KB data per core	2× 512KB	N/A	N/A				1600	65	SD198XOJGXBOX	SD198XOJZ22GX
Athlon II X2 221					2.8											AD221XOJGXBOX	AD221XOJZ22GX
Athlon II X4 631 (65 W)	2012			4 (4)	2.6			4× 1MB						1866		AD631XOJGXBOX	AD631XOJZ43GX
Athlon II X4 631 (100 W)	2011 8/15														100	AD631XOJGXBOX	AD631XWNZ43GX
Athlon II X4 638	2012 2/8				2.7										65	AD638XOJGXBOX	AD638XOJZ43GX
Athlon II X4 641					2.8										100	AD641XWNGXBOX	AD641XWNZ43GX
Athlon II X4 651	2011 11/14				3.0											AD651XWNGXBOX	AD651XWNZ43GX
Athlon II X4 651K	2012 Q1															AD651KWNGXBOX	AD651KWNZ43GX
E2-3200	2011 Q4			2 (2)	2.4			2× 512KB		HD 6370D	160:8:4	443	141.7	1600	65	ED3200OJGXBOX	ED3200OJZ22GX ED3200OJZ22HX
A4-3300	2011 9/7				2.5					HD 6410D						AD3300OJGXBOX AD3300OJHXBOX	AD33000OJZ22GX AD33000OJZ22HX
A4-3400					2.7							600	192			AD3400OJGXBOX AD3400OJHXBOX	AD3400OJZ22GX AD3400OJZ22HX
A4-3420	2011 12/20				2.8											N/A	AD3420OJZ22HX
A6-3500	2011 8/17			3 (3)	2.1	2.4		3× 1MB		HD 6530D	320:16:8	443	283.5	1866		AD3500OJGXBOX	AD3500OJZ33GX
A6-3600				4 (4)				4× 1MB								AD3600OJGXBOX	AD3600OJZ43GX
A6-3620	2011 12/20				2.2	2.5										AD3620OJGXBOX	AD3620OJZ43GX
A6-3650	2011 6/30				2.6	N/A									100	AD3650WNZ43GX
A6-3670K[note 1]	2011 12/20				2.7											AD3670WNGXBOX	AD3670WNZ43GX
A8-3800	2011 8/17				2.4	2.7				HD 6550D	400:20:8	600	480		65	AD3800OJZ43GX
A8-3820	2011 12/20				2.5	2.8										AD3820OJGXBOX	AD3820OJZ43GX
A8-3850	2011 6/30				2.9	N/A									100	AD3850WNGXBOX	AD3850WNZ43GX
A8-3870K[note 1]	2011 12/20				3.0											AD3870WNGXBOX	AD3870WNZ43GX

Virgo: "Trinity" (2012)[]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU: Piledriver
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU TeraScale 3 (VLIW4)
• Die Size: 246 mm², 1.303 Billion transistors^[28]
• Support for up to four DIMMs of up to DDR3-1866 memory
• 5 GT/s UMI
• GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
• Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C,^[29] ABM, BMI1, TBM
• Sempron and Athlon models exclude integrated graphics
• Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card.^[30][31] However, it has been found that this does not always improve 3D accelerated graphics performance.^[32][33]

Model number	Released	Fab	Step.	CPU					GPU				DDR3 Mem.	TDP (W)	Box Number	Part number[34]
				[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
							L1	L2 (MB)
Sempron X2 240[35]		32nm	TN-A1	[1]2	2.9	3.3	64KB inst. per module 16KB data per core	1	N/A				1600	65		SD240XOKA23HJ
Athlon X2 340[36]	2012/10				3.2	3.6										AD340XOKA23HJ
Athlon X4 730	2012 10/1			[2]4	2.8	3.2		2× 2MB					1866	65		AD730XOKA44HJ
Athlon X4 740	2012/10				3.2	3.7									AD740XOKHJBOX	AD740XOKA44HJ
Athlon X4 750K					3.4	4.0								100	AD750KWOHJBOX	AD750KWOA44HJ
FirePro A300	2012 8/7				3.4	4.0			FirePro	384:24:8 6 CU	760	583.6		65		AWA300OKA44HJ
FirePro A320					3.8	4.2					800	614.4		100		AWA320WOA44HJ
A4-5300	2012 10/1			[1]2	3.4	3.6		1	HD 7480D	128:8:4 2 CU	723	185	1600	65	AD5300OKHJBOX	AD5300OKA23HJ
A4-5300B	2012/10															AD530BOKA23HJ
A6-5400K	2012 10/1				3.6	3.8			HD 7540D	192:12:4 3 CU	760	291.8	1866		AD540KOKHJBOX	AD540KOKA23HJ
A6-5400B	2012/10															AD540BOKA23HJ
A8-5500	2012 10/1			[2]4	3.2	3.7		2× 2MB	HD 7560D	256:16:8 4 CU	760	389.1	1866	65	AD5500OKHJBOX	AD5500OKA44HJ
A8-5500B	2012/10															AD550BOKA44HJ
A8-5600K	2012 10/1				3.6	3.9								100	AD560KWOHJBOX	AD560KWOA44HJ
A10-5700	2012 10/1				3.4	4.0			HD 7660D	384:24:8 6 CU	760	583.6		65	AD5700OKHJBOX	AD5700OKA44HJ
A10-5800K					3.8	4.2					800	614.4		100	AD580KWOHJBOX	AD580KWOA44HJ
A10-5800B	2012/10															AD580BWOA44HJ

"Richland" (2013)[]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• Two or four CPU cores based on the Piledriver microarchitecture
  • Die Size: 246 mm², 1.303 Billion transistors^[37]
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
• GPU
  • TeraScale 3 architecture
  • HD Media Accelerator, AMD Hybrid Graphics

Model	Released	Fab	Step.	CPU					GPU				DDR3 Mem.	TDP (W)	Box Number	Part number
				[Modules/FPUs] Cores/threads	Freq. (GHz)		Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
					Base	Turbo
							L1	L2 (MB)
Sempron X2 250[35]		32nm	RL-A1	[1]2	3.2	3.6	64KB inst. per module 16KB data per core	1	N/A					65		SD250XOKA23HL
Athlon X2 350[38]					3.5	3.9							1866	65		AD350XOKA23HL
Athlon X2 370K	Jun 2013				4.0	4.2									AD370KOKHLBOX	AD370KOKA23HL
Athlon X4 750	Oct 2013			[2]4	3.4	4.0		2× 2MB						65		AD750XOKA44HL
Athlon X4 760K	Jun 2013				3.8	4.1								100	AD760KWOHLBOX	AD760KWOA44HL
FX-670K[39]	Mar 2014 (OEM)				3.7	4.3								65		FD670KOKA44HL
A4-4000	May 2013			[1]2	3.0	3.2		1	7480D	128:8:4 2 CU	720	184.3	1333	65	AD4000OKHLBOX	AD4000OKA23HL
A4-4020	Jan 2014				3.2	3.4									AD4020OKHLBOX	AD4000OKA23HL
A4-6300	July 2013				3.7	3.9			8370D		760	194.5	1600		AD6300OKHLBOX	AD6300OKA23HL
A4-6300B																AD630BOKA23HL
A4-6320	Dec 2013				3.8	4.0									AD6320OKHLBOX	AD6320OKA23HL
A4-6320B	Mar 2014															AD632BOKA23HL
A4-7300	Aug 2014								8470D	192:12:4 3 CU	800	307.2				AD7300OKA23HL
A4 PRO-7300B																AD730BOKA23HL
A6-6400B	2013 6/4				3.9	4.1							1866			AD640BOKA23HL
A6-6400K															AD640KOKHLBOX	AD640KOKA23HL
A6-6420B	Jan 2014				4.0	4.2										AD642BOKA23HL
A6-6420K															AD642KOKHLBOX	AD642KOKA23HL
A8-6500T	Sep 18, 2013			[2]4	2.1	3.1		2× 2MB	8550D	256:16:8 4 CU	720	368.6	1866	45	AD650TYHHLBOX	AD650TYHA44HL
A8-6500	2013 6/4				3.5	4.1			8570D		800	409.6		65	AD6500OKHLBOX	AD6500OKA44HL
A8-6500B																AD650BOKA44HL
A8-6600K					3.9	4.2					844	432.1		100	AD660KWOHLBOX	AD660KWOA44HL
A10-6700T	Sep 18, 2013				2.5	3.5			8650D	384:24:8 4 CU	720	552.9	1866	45	AD670TYHHLBOX	AD670TYHA44HL
A10-6700	2013 6/4				3.7	4.3			8670D		844	648.1		65	AD6700OKHLBOX	AD6700OKA44HL
A10-6790B	Oct 29, 2013				4.0									100	AD679KWOHLBOX	AD679KWOA44HL
A10-6790K	Oct 28, 2013															AD679BWOA44HL
A10-6800K	2013 6/4				4.1	4.4							2133		AD680KWOHLBOX	AD680KWOA44HL
A10-6800B																AD680BWOA44HL

"Kabini" (2013, SoC)[]

• Fabrication 28 nm by GlobalFoundries
• Socket AM1, aka Socket FS1b (AM1 platform)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
• GPU based on Graphics Core Next (GCN)

Model	Released	Fab	Step.	CPU					GPU				DDR3 Memory support	TDP (W)	Box Number	Part number
				Cores (threads)	Clock (GHz)	Cache[a]			Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)	L3
Athlon X4 530	?	28nm	A1	4 (4)	2	32 KB inst. 32 KB data per core	2	N/A	N/A				?	25		AD530XJAH44HM
Athlon X4 550					2.2											AD550XJAH44HM
Sempron 2650	April 9, 2014			2 (2)	1.45		1		R3 (HD 8240)	128:8:4 2 CU	400	102.4	1333 (Single channel only)		SD2650JAHMBOX	SD2650JAH23HM
Sempron 3850				4 (4)	1.30		2		R3 (HD 8280)		450	115.2	1600 (Single channel only)		SD3850JAHMBOX	SD3850JAH44HM
Athlon 5150					1.60				R3 (HD 8400)		600	153.6			AD5150JAHMBOX	AD5150JAH44HM
Athlon 5350					2.05										AD5350JAHMBOX	AD5350JAH44HM
Athlon 5370	Feb, 2016				2.20											AD5370JAH44HM

"Kaveri" (2014) & "Godavari" (2015)[]

• Fabrication 28 nm by GlobalFoundries.
• Socket FM2+,^[40] support for PCIe 3.0.
• Two or four CPU cores based on the Steamroller microarchitecture.
  • Kaveri refresh models have codename Godavari.^[41]
• Die Size: 245 mm², 2.41 Billion transistors.^[42]
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture;^[43] 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs).
• Heterogeneous System Architecture-enabled zero-copy through pointer passing.
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.^[44]
• Dual-channel (2× 64 Bit) DDR3 memory controller.
• Integrated custom ARM Cortex-A5 co-processor^[45] with TrustZone Security Extensions^[46] in select APU models, except the Performance APU models.^[47]
• Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.^[48]
• Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.^[49]

Model	Release date	Fab	Step.	CPU					GPU				DDR3 Memory support	TDP (W)	Box Number	Part number
				[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
							L1	L2 (MB)
Athlon X2 450[38]	Jul 31, 2014	28nm	KV-A1	[1]2	3.5	3.9	96 KB inst. per module 16 KB data per core	1	N/A				1866	65		AD450XYBI23JA
Athlon X4 830	Q1 2018			[2]4	3.0	3.4		2× 2MB					2133			AD830XYBI44JA
Athlon X4 840[38]	Aug 2014				3.1	3.8									AD840XYBJABOX	AD840XYBI44JA
Athlon X4 850	Q2 2015		GV-A1		3.2											AD835XACI43KA
Athlon X4 860K	Aug 2014		KV-A1		3.7	4.0								95	AD860KXBJABOX AD860KWOHLBOX AD860KXBJASBX	AD860KXBI44JA
Athlon X4 870K	Dec 2015		GV-A1		3.9	4.1									AD870KXBJCSBX	AD870KXBI44JC
Athlon X4 880K	Mar 1, 2016				4.0	4.2									AD880KXBJCSBX
FX-770K[50]	Dec 2014		KV-A1	3.5	3.9	2133	65						FD770KYBI44JA
A4 PRO-7350B	Jul 31, 2014			[1]2	3.4	3.8	1	R5	192:12:8 3 CU	514	197.3	1866	65		AD735BYBI23JA
PRO A4-8350B	Sep 29, 2015				3.5	3.9			256:16:8 4 CU	757	387.5				AD835BYBI23JC
A6-7400K	Jul 31, 2014				3.5	3.9				756	387			AD740KYBJABOX	AD740KYBI23JA
A6 PRO-7400B															AD740BYBI23JA
A6-7470K	Feb 2, 2016		GV-A1		3.7	4.0				800	409.6	2133		AD747KYBJCBOX	AD747KYBI23JC
PRO A6-8550B	Sep 29, 2015														AD855BYBI23JC
A8-7500[51][52]	2014/?		KV-A1	[2]4	3.0	3.7	2× 2MB	R7	384:24:8 6 CU	720	552.9	2133	65		AD7500YBI44JA
A8-7600	Jul 31, 2014				3.1	3.8								AD7600YBJABOX	AD7600YBI44JA
A8 PRO-7600B															AD760BYBI44JA
A8-7650K	Jan 7, 2015				3.3								95	AD765KXBJABOX AD765KXBJASBX	AD765KXBI44JA
A8-7670K	Jul 20, 2015		GV-A1		3.6	3.9				757	581.3			AD767KXBJCSBX AD767KXBJCBOX	AD767KXBI44JC
PRO A8-8650B	Sep 29, 2015				3.2								65		AD865BYBI44JC
A10-7700K	Jan 14, 2014		KV-A1		3.4	3.8				720	552.9		95	AD770KXBJABOX	AD770KXBI44JA
A10-7800	Jul 31, 2014				3.5	3.9			512:32:8 8 CU		737.2		65	AD7800YBJABOX	AD7800YBI44JA
A10 PRO-7800B															AD780BYBI44JA
A10-7850K	Jan 14, 2014				3.7	4.0							95	AD785KXBJABOX	AD785KXBI44JA
A10 PRO-7850B	Jul 31, 2014														AD785BXBI44JA
A10-7860K	Feb 2, 2016		GV-A1		3.6					757	775.1		65	AD786KYBJABOX AD786KYBJCSBX	AD786KYBI44JC
A10-7870K	May 28, 2015				3.9	4.1				866	886.7		95	AD787KXDJCBOX AD787KXDJCSBX	AD787KXDI44JC
A10-7890K	Mar 1, 2016				4.1	4.3								AD789KXDJCHBX	AD789KXDI44JC
PRO A10-8750B	Sep 29, 2015				3.6	4.0				757	775.1		65		AD875BYBI44JC
PRO A10-8850B					3.9	4.1				800	819.2		95		AD885BXBI44JC

"Carrizo" (2016)[]

• Fabrication 28 nm by GlobalFoundries
• Socket FM2+, AM4, support for PCIe 3.0
• Two or four CPU cores based on the Excavator microarchitecture
• Die Size: 250.04 mm², 3.1 Billion transistors^[53]
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Dual-channel DDR3 or DDR4 memory controller
• Third Generation GCN based GPU
• Integrated custom ARM Cortex-A5 co-processor^[45] with TrustZone Security Extensions^[46][47]

Model	Released	Fab	Step.	Socket	CPU					GPU				DDR3 Memory support	TDP (W)	Box Number[a]	Part number
					[Modules/FPUs] Cores/threads	Freq.(GHz)		Cache[b]		Model	Config	Clock (MHz)	GFLOPS[c]
						Base	Turbo
								L1	L2 (MB)
Athlon X4 835	?	28nm	CZ-A1	FM2+	[2]4	3.1		96 KB inst. per module 32 KB data per core	2× 1MB	N/A				2133	65		AD835XACI43KA
Athlon X4 845	Feb 2, 2016					3.5	3.8									AD845XYBJCSBX AD845XACKASBX	AD845XACI43KA
A6-7480[54]	Oct 2018				[1]2				1	R5	384:24:8 6 CU	900	691.2			AD7480ACABBOX	AD7480ACI23AB
A8-7680[55]					[2]4				2× 1MB	R7						AD7680ACABBOX	AD7680ACI43AB
PRO A6-8570E	Oct 2016			AM4	[1]2	3.0	3.4		1	R5	256:16:4 4 CU	800	409.6	2400	35		AD857BAHM23AB
PRO A6-8570						3.5	3.8				384:24:6 6 CU	1029	790.2		65		AD857BAGM23AB
PRO A10-8770E					[2]4	2.8	3.5		2× 1MB	R7		847	650.4		35		AD877BAHM44AB
PRO A10-8770						3.5	3.8					1029	790.2		65		AD877BAGM44AB
PRO A12-8870E						2.9					512:32:8 8 CU	900	921.6		35		AD887BAHM44AB
PRO A12-8870						3.7	4.2					1108	1134.5		65		AD887BAUM44AB

"Bristol Ridge" (2016)[]

• Fabrication 28 nm by GlobalFoundries
• Socket AM4, support for PCIe 3.0
• Two or four "Excavator+" CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
• PCI Express 3.0 x4 as link to optional external chipset
• 4x USB 3.1 Gen 1
• Storage: 2x SATA and 2x NVMe or 2x PCI Express
• Third Generation GCN based GPU^[56] with hybrid VP9 decoding

Model	Released	Fab	Stepping	CPU						GPU				DDR4 Memory support	TDP (W)	Stock Cooler (box)[a]	Box Number[b]	Part number
				[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[c]			Model	Config	Clock (MHz)	Processing power (GFLOPS)[d]
							L1	L2	L3
Athlon X4 940	July 27, 2017	28nm	BR-A1	[2]4	3.2	3.6	96 KB inst. per module 32 KB data per core	2× 1 MB	N/A	N/A				2400	65	Near-Silent 65 W	AD940XAGABBOX	AD940XAGM44AB
Athlon X4 950					3.5	3.8											AD950XAGABBOX	AD950XAGM44AB
Athlon X4 970					3.8	4.0											AD970XAUABBOX	AD970XAUM44AB
A6-9500E	September 5, 2016			[1]2	3.0	3.4		1× 1 MB		R5	256:16:4 4 CU	800	409.6		35	Near-Silent 65 W	AD9500AHABBOX	AD9500AHM23AB
PRO A6-9500E	October 3, 2016															?	?	?
A6-9400	March 16, 2019				3.4	3.7					192:12:4 3 CU	720	276.4		65	Z7LH01R201	AD9400AGABBOX
A6-9500	September 5, 2016				3.5	3.8					384:24:6 6 CU	1029	790.2			Near-Silent 65 W	AD9500AGABBOX	AD9500AGM23AB
PRO A6-9500	October 3, 2016															?	?	?
A6-9550	July 27, 2017				3.8	4.0					256:16:4 4 CU	800	409.6			Near-Silent 65 W	AD9550AGABBOX	D9550AGM23AB
A8-9600	September 5, 2016			[2]4	3.1	3.4		2× 1 MB		R7	384:24:6 6 CU	900	691.2		65	Near-Silent 65 W	AD9600AGABBOX	AD9600AGM44AB
PRO A8-9600	October 3, 2016															?	?	?
A10-9700E	September 5, 2016				3.0	3.5						847	650.4		35	Near-Silent 65 W	AD9700AHABBOX	AD9700AHM44AB
PRO A10-9700E	October 3, 2016															?	?	?
A10-9700	September 5, 2016				3.5	3.8						1029	790.2		65	Near-Silent 65 W	AD9700AGABBOX	D9700AGM44AB
PRO A10-9700	October 3, 2016															?	?	?
A12-9800E	September 5, 2016				3.1	3.8					512:32:8[57] 8 CU	900	921.6		35	Near-Silent 65 W	AD9800AHABBOX	AD9800AUM44AB
PRO A12-9800E	October 3, 2016															?	?	?
A12-9800	September 5, 2016				3.8	4.2						1108	1134.5		65	Near-Silent 65 W	AD9800AUM44AB
PRO A12-9800	October 3, 2016															?	?	?

"Raven Ridge" (2018)[]

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Model	Release Date & Price	Process	CPU						GPU				Socket	PCIe lanes	Memory support	TDP	Stock cooler (box)[a]	Box Number	Part Number
			Cores (threads)	Clock rate (GHz)		Cache[i]			Model	Config[ii]	Clock	Processing power (GFLOPS)[iii]
				Base	Boost	L1	L2	L3
Athlon 200GE[59]	September 6, 2018 US $55	GloFo 14LP	2 (4)	3.2	N/A	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:4 3 CU	1000 MHz	384	AM4	16 (8+4+4)	DDR4-2666 dual-channel	35 W	Basic Stock Cooler	YD200GC6FBBOX	YD200GC6M2OFB YD20GGC6M2OFB
Athlon Pro 200GE[60]	September 6, 2018 OEM																N/A	N/A	YD200BC6M2OFB
Athlon 220GE[61]	December 21, 2018 US $65			3.4													Basic Stock Cooler	YD220GC6FBBOX	YD220GC6M2OFB
Athlon 240GE[62]	December 21, 2018 US $75			3.5														YD240GC6FBBOX	YD240GC6M2OFB
Athlon 3000G[63]	November 19, 2019 US $49										1100 MHz	424.4						YD3000C6FHBOX	YD3000C6M2OFH
Athlon 300GE[64]	July 7, 2019 OEM			3.4													N/A	N/A	YD30GEC6M2OFH
Athlon Silver 3050GE[65]	July 21, 2020 OEM																		YD305GC6M2OFH
Ryzen 3 2200GE[66]	April 19, 2018 OEM		4 (4)	3.2	3.6				Vega 8	512:32:16 8 CU		1126			DDR4-2933 dual-channel				YD2200C6M4MFB
Ryzen 3 Pro 2200GE[67]	May 10, 2018 OEM																		YD220BC6M4MFB
Ryzen 3 2200G	February 12, 2018 US $99			3.5	3.7											45–65 W	Wraith Stealth	YD2200C5FBBOX	YD2200C5M4MFB
Ryzen 3 Pro 2200G[68]	May 10, 2018 OEM																N/A	N/A	YD220BC5M4MFB
Ryzen 5 2400GE[69]	April 19, 2018 OEM		4 (8)	3.2	3.8				RX Vega 11	704:44:16	1250 MHz	1760				35 W			YD2400C6M4MFB
Ryzen 5 Pro 2400GE[70]	May 10, 2018 OEM																		YD240BC6M4MFB
Ryzen 5 2400G[71]	February 12, 2018[72][73] US $169			3.6	3.9											45–65 W	Wraith Stealth	YD2400C5FBBOX	YD2400C5M4MFB
Ryzen 5 Pro 2400G[74]	May 10, 2018 OEM																N/A	N/A	YD240BC5M4MFB

"Picasso" (2019)[]

• Fabrication 12 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Model	Release Date & Price	Fab	CPU						GPU				Socket	PCIe lanes	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Architecture	Config[i]	Clock	Processing power (GFLOPS)[ii]
				Base	Boost	L1	L2	L3
Athlon Pro 300GE[75]	September 30, 2019 OEM	12 nm	2 (4)	3.4	N/A	64 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5th gen	192:12:4 3 CU	1100 MHz	424.4	AM4	16 (8+4+4)	DDR4-2667 dual-channel	35 W
Athlon Silver Pro 3125GE[76]	July 21, 2020 OEM
Athlon Gold 3150GE[77]			4 (4)	3.3	3.8										DDR4-2933 dual-channel
Athlon Gold Pro 3150GE[78]
Athlon Gold 3150G[79]				3.5	3.9											45-65 W
Athlon Gold Pro 3150G[80]
Ryzen 3 3200GE[81]	July 7, 2019 OEM			3.3	3.8					512:32:16 8 CU	1200 MHz	1228.8				35 W
Ryzen 3 Pro 3200GE[82]	September 30, 2019 OEM
Ryzen 3 3200G[83]	July 7, 2019 US $99			3.6	4.0						1250 MHz	1280				45-65 W
Ryzen 3 Pro 3200G[84]	September 30, 2019 OEM
Ryzen 5 3350GE	July 21, 2020 OEM		4 (8)	3.3	3.9					704:44:16 11 CU	1200 MHz					35 W
Ryzen 5 Pro 3350GE[85]
Ryzen 5 3350G				3.6	4.0						1300 MHz	1830.4				45-65 W
Ryzen 5 Pro 3350G[86]
Ryzen 5 3400GE[87]	July 7, 2019 OEM			3.3	4.0											35 W
Ryzen 5 Pro 3400GE[88]	September 30, 2019 OEM
Ryzen 5 3400G[89]	July 7, 2019 US $149			3.7	4.2						1400 MHz	1971.2				45-65 W
Ryzen 5 Pro 3400G[90]	September 30, 2019 OEM

"Renoir" (2020)[]

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 2 CPU cores
• Dual-channel DDR4 memory controller

Model	Release date and price	Fab	CPU							GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Core Config[i]	Clock rate (GHz)		Cache			Architecture	Config[ii]	Clock	Processing power (GFLOPS)[iii]
					Base	Boost	L1	L2	L3
Ryzen 3 4300GE[note 1][91]	July 21, 2020 OEM only	TSMC 7FF	4 (8)	1 × 4	3.5	4.0	32 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5th gen	384:24:8 6 CU	1700 MHz	1305.6	AM4	PCIe 3.0 ×24 16+4+4	DDR4-3200 dual-channel	35 W
Ryzen 3 4300G[note 1][91]					3.8	4.0											65 W
Ryzen 5 4600GE[note 1][91]			6 (12)	2 × 3	3.3	4.2			8 MB 4 MB per CCX		448:28:8 7 CU	1900 MHz	1702.4				35 W
Ryzen 5 4600G[note 1][91]					3.7	4.2											65 W
Ryzen 7 4700GE[note 1][91]			8 (16)	2 × 4	3.1	4.3					512:32:8 8 CU	2000 MHz	2048				35 W
Ryzen 7 4700G[note 1][91]					3.6	4.4						2100 MHz	2150.4				65 W

"Cezanne" (2021)[]

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 3 CPU cores
• Dual-channel DDR4 memory controller

Model	Release date & price	Fab	CPU							GPU				Memory support	TDP
			Cores (threads)	Core config[i]	Clock rate (GHz)		Cache			Architecture	Config[ii]	Clock	Processing power (GFLOPS)[iii]
					Base	Boost	L1	L2	L3
Ryzen 3 5300GE[note 1][92]	13 April 2021[93] OEM	TSMC 7FF	4 (8)	1 × 4	3.6	4.2	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5th gen	384:24:8 6 CU	1700 MHz	1305.6	DDR4-3200 dual-channel	35 W
Ryzen 3 5300G[note 1][94]					4.0										65 W
Ryzen 5 5600GE[note 1][95]			6 (12)	1 × 6	3.4	4.4			16 MB		448:28:8 7 CU	1900 MHz	1702.4		35 W
Ryzen 5 5600G[note 1][96]	13 April 2021[93] OEM 5 August 2021 US $259[97]				3.9										65 W
Ryzen 7 5700GE[note 1][98]	13 April 2021[93] OEM		8 (16)	1 × 8	3.2	4.6					512:32:8 8 CU	2000 MHz	2048		35 W
Ryzen 7 5700G[note 1][99]	13 April 2021[93] OEM 5 August 2021 US $359[97]				3.8										65 W

Server APUs[]

Opteron X2100-series "Kyoto" (2013)[]

• Fabrication 28 nm
• Socket FT3 (BGA)
• 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on GCN (Graphics Core Next) architecture

Model	Released	Fab	Stepp.	CPU				GPU				Memory support	TDP (W)	Part number	Release price (USD)
				Cores (threads)	Clock (GHz)	Cache[b]		Model	Config	Clock (MHz)	Processing power (GFLOPS)[c]
						L1	L2 (MB)
X1150	May 2013	28nm	KB-A1	4 (4)	2.0	32 KB inst. 32 KB data per core	2	N/A				DDR3	9		$64
X2150					1.9			HD 8400	128:8:4	266	28.9		22	OX2150IAJ44HM	$99
X2170	September 2016				2.4					600	153.6	DDR3	25	OX2170IXJ44JB

Opteron X3000-series "Toronto" (2017)[]

• Fabrication 28 nm
• Socket
• Two or Four CPU cores based on the Excavator microarchitecture^[107][108]
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• DDR4 SDRAM
• GPU based on 3rd Generation GCN (Graphics Core Next) architecture

Model	Released	Fab	Step.	CPU					GPU				DDR4 Memory support	TDP (W)	Part number	Release price (USD)
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (GHz)	Processing power (GFLOPS)[b]
							L1	L2 (MB)
X3216	Q2 2017	28nm	01h	2 (2)	1.6	3.0	96 KB inst. per module 32 KB data per core	1	R5	256:16:4 4 CU	0.8	409.6	1600	12- 15	Un­known	OEM for HP
X3418				4 (4)	1.8	3.2		2	R7	384:24:6 6 CU		614.4	2400	12- 35
X3421					2.1	3.4				512:32:8 8 CU		819.2

Mobile APUs[]

Sabine: "Llano" (2011)[]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1
• Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
• L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
• Integrated PCIe 2.0 controller
• GPU: TeraScale 2
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!

Model	Released	Fab	Step.	CPU						GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config	Clock (MHz)	GFLOPS[b]
							L1	L2	L3
E2-3000M	2011 6/14	32nm	B0	2 (2)	1.8	2.4	64 KB inst. 64 KB data per core	2× 512KB	N/A	HD 6380G	160:8:4	400	128	1333	35	EM3000DDX22GX
A4-3300M	2011 6/14				1.9	2.5		2× 1MB		HD 6480G	240:12:4	444	213.1		35	AM3300DDX23GX
A4-3305M	Dec 7, 2011							2× 512KB			160:8:4	593	189.7			AM3305DDX22GX
A4-3310MX	2011 6/14				2.1			2× 1MB			240:12:4	444	213.1		45	AM3310HLX23GX
A4-3320M	Dec 7, 2011				2.0	2.6									35	AM3320DDX23GX
A4-3330MX					2.2										45	AM3330HLX23GX
A4-3330MX					2.3			2× 512KB			160:8:4	593	189.7			AM3330HLX23HX
A6-3400M	2011 6/14			4 (4)	1.4	2.3		4× 1MB		HD 6520G	320:16:8	400	256		35	AM3400DDX43GX
A6-3410MX					1.6									1600	45	AM3410HLX43GX
A6-3420M	Dec 7, 2011				1.5	2.4								1333	35	AM3420DDX43GX
A6-3430MX					1.7									1600	45	AM3430HLX43GX
A8-3500M	2011 6/14				1.5	2.4				HD 6620G	400:20:8	444	355.2	1333	35	AM3500DDX43GX
A8-3510MX					1.8	2.5								1600	45	AM3510HLX43GX
A8-3520M	Dec 7, 2011				1.6									1333	35	AM3520DDX43GX
A8-3530MX	2011 6/14				1.9	2.6								1600	45	AM3530HLX43GX
A8-3550MX	Dec 7, 2011				2.0	2.7										AM3550HLX43GX

Comal: "Trinity" (2012)[]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Based on the Piledriver architecture
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
• 2.5 GT/s UMI
• Transistors: 1.303 billion
• Die size: 246 mm²

Model number	Released	Fab	Step.	Socket	CPU					GPU					DDR3 Memory support	TDP (W)	Part number
					[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Turbo (MHz)	GFLOPS[b]
								L1	L2 (MB)
A4-4355M	Sep 27, 2012	32nm	TN-A1	FP2	[1]2	1.9	2.4	64 KB inst. per module 16 KB data per core	1	HD 7400G	192:12:4 3 CU	327	424	125.5	1333	17	AM4355SHE23HJ
A6-4455M	May 15, 2012					2.1	2.8		2	HD 7500G	256:16:8 4 CU			167.4			AM4455SHE24HJ
A8-4555M	Sep 27, 2012				[2]4	1.6	2.4		2× 2MB	HD 7600G	384:24:8 6 CU	320		245.7		19	AM4555SHE44HJ
A8-4557M[109]	Mar 2013					1.9	2.8			HD 7000	256:16:8 4 CU	497	655	254.4	(L)1600	35	AM4557DFE44HJ
A10-4655M	May 15, 2012					2.0	2.8			HD 7620G	384:24:8 6 CU	360	496	276.4	1333	25	AM4655SIE44HJ
A10-4657M[109]	Mar 2013					2.3	3.2			HD 7000		497	686	381.6	(L)1600	35	AM4657DFE44HJ
A4-4300M	May 15, 2012			FS1	[1]2	2.5	3.0		1	HD 7420G	128:8:4 2 CU	480	655	122.8	1600		AM4300DEC23HJ
A6-4400M						2.7	3.2			HD 7520G	192:12:4 3 CU	496	685	190.4			AM4400DEC23HJ
A8-4500M					[2]4	1.9	2.8		2× 2MB	HD 7640G	256:16:8 4 CU			253.9			AM4500DEC44HJ
A10-4600M						2.3	3.2			HD 7660G	384:24:8 6 CU			380.9			AM4600DEC44HJ

"Richland" (2013)[]

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Elite Performance APU.^[110][111]
• CPU: Piledriver architecture
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

Model number	Released	Fab	Step.	Socket	CPU					GPU					DDR3 Memory support	TDP (W)	Part number
					[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Turbo (MHz)	GFLOPS[b]
								L1	L2 (MB)
A4-5145M	2013/5	32nm	RL-A1	FP2	[1]2	2.0	2.6	64 KB inst. per module 16 KB data per core	1	HD 8310G	128:8:4 2 CU	424	554	108.5	(L)1333	17	AM5145SIE44HL
A6-5345M						2.2	2.8			HD 8410G	192:12:4 3 CU	450	600	172.8			AM5345SIE44HL
A8-5545M					[2]4	1.7	2.7		4	HD 8510G	384:28:8 6 CU		554	345.6		19	AM5545SIE44HL
A10-5745M						2.1	2.9			HD 8610G		533	626	409.3		25	AM5745SIE44HL
A4-5150M	2013 Q1			FS1	[1]2	2.7	3.3		1	HD 8350G	128:8:4 2 CU	533	720	136.4	1600	35	AM5150DEC23HL
A6-5350M						2.9	3.5			HD 8450G	192:12:4 3 CU			204.6			AM5350DEC23HL
A6-5357M	2013/5														(L)1600		AM5357DFE23HL
A8-5550M	2013 Q1				[2]4	2.1	3.1		4	HD 8550G	256:16:8 4 CU	515		263.6	1600		AM5550DEC44HL
A8-5557M	2013/5											554		283.6	(L)1600		AM5557DFE44HL
A10-5750M	2013 Q1					2.5	3.5			HD 8650G	384:24:8 6 CU	533		409.3	1866		AM5750DEC44HL
A10-5757M	2013/5											600		460.8	(L)1600		AM5757DFE44HL

"Kaveri" (2014)[]

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.^[112]
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on Graphics Core Next (GCN)^[43] microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
• AMD Heterogeneous System Architecture (HSA) 2.0
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio^[44]
• Dual-channel (2x64-bit) DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor^[45] with TrustZone Security Extensions^[46]

Model number	Released	Fab	CPU					GPU					DDR3 Memory support	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS[b]
						L1	L2 (MB)
A6-7000	June 2014	28nm	[1]2	2.2	3.0	96 KB inst. per module 16 KB data per core	1	R4	192:12:3 3 CU	494	533	189.6	1333	17	AM7000ECH23JA
A6 Pro-7050B										533	N/A	204.6	1600		AM705BECH23JA
A8-7100			[2]4	1.8	3.0		2× 2 MB	R5	256:16:4 4 CU	450	514	230.4	1600	20	AM7100ECH44JA
A8 Pro-7150B				1.9	3.2					553	N/A	283.1			AM715BECH44JA
A10-7300								R6	384:24:8 6 CU	464	533	356.3			AM7300ECH44JA
A10 Pro-7350B				2.1	3.3					533	N/A	424.7			AM735BECH44JA
FX-7500								R7		498	553	382.4			FM7500ECH44JA
A8-7200P				2.4	3.3			R5	256:16:4 4 CU	553	626	283.1	1866	35	AM740PDGH44JA
A10-7400P				2.5	3.4			R6	384:24:8 6 CU	576	654	442.3			AM740PDGH44JA
FX-7600P				2.7	3.6			R7	512:32:8 8 CU	600	686	614.4	2133		FM760PDGH44JA

"Carrizo" (2015)[]

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2

Model number	Released	Fab	CPU					GPU				DDR Memory support	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
						L1	L2 (MB)
A6-8500P	June 2015	28nm	[1]2	1.6	3.0	96 KB inst. per module 32 KB data per core	1	R5	256:16:4 4 CU	800	409.6	3)1600	12- 35	AM850PAAY23KA
Pro A6-8500B														AM850BAAY23KA
Pro A6-8530B	Q3 2016			2.3	3.2							4)1866		AM853BADY23AB
A8-8600P	June 2015		[2]4	1.6	3.0		2× 1MB	R6	384:24:8 6 CU	720	552.9	3)2133		AM860PAAY43KA
Pro A8-8600B														AM860BAAY43KA
A10-8700P				1.8	3.2					800	614.4			AM870PAAY43KA
Pro A10-8700B														AM870BAAY43KA
Pro A10-8730B	Q3 2016			2.4	3.3			R5		720	552.9	4)1866		AM873BADY44AB
A10-8780P	December 2015			2.0	3.3			R8	512:32:8 8 CU			3)?		AM878PAIY43KA
FX-8800P	June 2015			2.1	3.4			R7		800	819.2	4)2133		FM880PAAY43KA
Pro A12-8800B														FM880BAAY43KA
Pro A12-8830B	Q3 2016			2.5	3.4				384:24:8 6 CU	758	582.1	4)1866		AM883BADY44AB

"Bristol Ridge" (2016)[]

• Fabrication 28 nm
• Socket FP4^[113]
• Two or four "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2 with VP9 decoding

Model number	Released	Fab	CPU					GPU				DDR4 Memory support	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
						L1	L2 (MB)
Pro A6-9500B	October 24, 2016	28nm	[1]2	2.3	3.2	96 KB inst. per module 32 KB data per core	1	R5	256:16:4 4 CU	800	409.6	1866	12- 15
Pro A8-9600B	October 24, 2016		[2]4	2.4	3.3		2× 1 MB	R5	384:24:6 6 CU	720	552.9	1866	12– 15
A10-9600P	June 2016													AM960PADY44AB
A10-9620P[114]	2017 (OEM)			2.5	3.4					758	582.1
Pro A10-9700B	October 24, 2016							R7
A12-9700P	June 2016													AM970PADY44AB
Pro A8-9630B	October 24, 2016			2.6	3.3			R5		800	614.4	2400	25– 45
A10-9630P	June 2016													AM963PAEY44AB
Pro A10-9730B	October 24, 2016			2.8	3.5			R7		900	691.2
A12-9730P	June 2016													AM973PAEY44AB
Pro A12-9800B	October 24, 2016			2.7	3.6			R7	512:32:8 8 CU	758	776.1	1866	12– 15
FX-9800P A12-9720P[115][116]	June 2016 2017 (OEM)													FM980PADY44AB ?
Pro A12-9830B	October 24, 2016			3.0	3.7					900	921.6	2400	25– 45
FX-9830P	June 2016													FM983PAEY44AB

"Raven Ridge" (2017)[]

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Socket FP5
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Fifth generation GCN based GPU

Model	Release date	Fab	CPU						GPU				Socket	PCIe lanes	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config[i]	Clock	Processing power (GFLOPS)[ii]
				Base	Boost	L1	L2	L3
Athlon Pro 200U [117]	2019	GloFo 14LP	2 (4)	2.3	3.2	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 3	192:12:4 3 CU	1000 MHz	384	FP5	12 (8+4)	DDR4-2400 dual-channel	12–25 W
Athlon 300U [118]	January 6, 2019			2.4	3.3
Ryzen 3 2200U [119]	January 8, 2018			2.5	3.4						1100 MHz	422.4
Ryzen 3 3200U [120]	January 6, 2019			2.6	3.5						1200 MHz	460.8
Ryzen 3 2300U [121]	January 8, 2018		4 (4)	2.0	3.4				Vega 6	384:24:8 6 CU	1100 MHz	844.8
Ryzen 3 Pro 2300U [122]	May 15, 2018
Ryzen 5 2500U [123]	October 26, 2017		4 (8)		3.6				Vega 8	512:32:16 8 CU		1126.4
Ryzen 5 Pro 2500U [124]	May 15, 2018
Ryzen 5 2600H [125]	September 10, 2018			3.2											DDR4-3200 dual-channel	35–54 W
Ryzen 7 2700U [126]	October 26, 2017			2.2	3.8				Vega 10	640:40:16 10 CU	1300 MHz	1664			DDR4-2400 dual-channel	12–25 W
Ryzen 7 Pro 2700U [127]	May 15, 2018
Ryzen 7 2800H [128]	September 10, 2018			3.3					Vega 11	704:44:16 11 CU		1830.4			DDR4-3200 dual-channel	35–54 W

"Picasso" (2019)[]

• Fabrication 12 nm by GlobalFoundries
• Socket FP5
• Die size: 210 mm²
• Up to four Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU

Model	Release date	Fab	CPU						GPU				Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config[i]	Clock	Processing power (GFLOPS)[ii]
				Base	Boost	L1	L2	L3
Ryzen 3 3300U[129]	January 6, 2019	GloFo 12LP (14LP+)	4 (4)	2.1	3.5	64 KB inst. 32 KB data per core	512 KB per core	4 MB	Vega 6	384:24:8 6 CU[130]	1200 MHz	921.6	DDR4-2400 dual-channel	15 W
Ryzen 3 PRO 3300U[131]	April 8, 2019
Ryzen 3 3350U[132]	January 6, 2019
Ryzen 5 3450U[133]	June 2020		4 (8)						Vega 8	512:32:16 8 CU[134]		1228.8
Ryzen 5 3500U[135]	January 6, 2019				3.7
Ryzen 5 PRO 3500U[136]	April 8, 2019
Ryzen 5 3500C[137]	September 22, 2020
Ryzen 5 3550H[138]	January 6, 2019													35 W
Ryzen 5 3580U[139]	October 2019								Vega 9	576:36:16 9 CU	1300 MHz	1497.6		15 W
Ryzen 7 3700U[140]	January 6, 2019			2.3	4.0				Vega 10	640:40:16 10 CU[141]	1400 MHz	1792.0
Ryzen 7 PRO 3700U[142]	April 8, 2019
Ryzen 7 3700C[143]	September 22, 2020
Ryzen 7 3750H[144]	January 6, 2019													35 W
Ryzen 7 3780U[145]	October 2019								Vega 11	704:44:16 11 CU		1971.2		15 W

"Renoir" (2020)[]

• Fabrication 7 nm by TSMC^{[146][147][148]}
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7nm monolithic die^[149]
• Up to eight Zen 2 CPU cores
• Fifth generation GCN based GPU (7nm Vega)

Model	Release date	Fab	CPU							GPU				Socket	PCIe lanes	Memory support	TDP
			Cores (threads)	Core config[i]	Clock rate (GHz)		Cache			Architecture	Config[ii]	Clock	Processing power (GFLOPS)[iii]
					Base	Boost	L1	L2	L3
Ryzen 3 4300U[note 1][150][151]	March 16, 2020	TSMC 7FF	4 (4)	1 × 4	2.7	3.7	32 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5th gen	320:20:8 5 CU	1400 MHz	896	FP6	16 (8+4+4)	DDR4-3200 LPDDR4-4266 dual-channel	10–25 W
Ryzen 5 4500U[152][153]			6 (6)	2 × 3	2.3	4.0			8 MB 4 MB per CCX		384:24:8 6 CU	1500 MHz	1152
Ryzen 5 4600U[note 1][154]			6 (12)		2.1
Ryzen 5 4680U[155]	April 13, 2021										448:28:8 7 CU		1344
Ryzen 5 4600HS[156]	March 16, 2020				3.0						384:24:8 6 CU		1152				35 W
Ryzen 5 4600H[157][158]																	35–54 W
Ryzen 7 4700U[note 1][159]			8 (8)	2 × 4	2.0	4.1					448:28:8 7 CU	1600 MHz	1433.6				10–25 W
Ryzen 7 4800U[160]			8 (16)		1.8	4.2					512:32:8 8 CU	1750 MHz	1792
Ryzen 7 4980U[161]	April 13, 2021				2.0	4.4						1950 MHz	1996.8
Ryzen 7 4800HS[162]	March 16, 2020				2.9	4.2					448:28:8 7 CU	1600 MHz	1433.6				35 W
Ryzen 7 4800H[163][164]																	35–54 W
Ryzen 9 4900HS[165]					3	4.3					512:32:8 8 CU	1750 MHz	1792				35 W
Ryzen 9 4900H[166]					3.3	4.4											35–54 W

"Lucienne" (2021)[]

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7nm monolithic die^{[citation needed]}
• Up to eight Zen 2 CPU cores
• Fifth generation GCN based GPU (7nm Vega)

Model	Release date	Fab	CPU							GPU				Socket	PCIe lanes	Memory support	TDP
			Cores (threads)	Core config[i]	Clock rate (GHz)		Cache			Architecture	Config[ii]	Clock	Processing power (GFLOPS)[iii]
					Base	Boost	L1	L2	L3
Ryzen 3 5300U[170]	January 12, 2021	TSMC 7FF	4 (8)	1 × 4	2.6	3.8	32 KB inst. 32 KB data per core	512 KB per core	4 MB	GCN 5th gen	384:24:8 6 CU	1500 MHz	1152	FP6	16 (8+4+4)	DDR4-3200 LPDDR4-4266 dual-channel	10–25 W
Ryzen 5 5500U[171][172]			6 (12)	2 × 3	2.1	4.0			8 MB 4 MB per CCX		448:28:8 7 CU	1800 MHz	1612.8
Ryzen 7 5700U[173]			8 (16)	2 × 4	1.8	4.3					512:32:8 8 CU	1900 MHz	1945.6

"Cezanne" (2021)[]

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• Fifth generation GCN based GPU (7nm Vega)

Model	Release date	Fab	CPU							GPU				Socket	PCIe lanes	Memory support	TDP
			Cores (threads)	Core config[i]	Clock rate (GHz)		Cache			Architecture	Config[ii]	Clock	Processing power (GFLOPS)[iii]
					Base	Boost	L1	L2	L3
Ryzen 3 5400U[note 1][174][175]	January 12, 2021	TSMC 7FF	4 (8)	1 × 4	2.6	4.0	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5th gen	320:20:8 6 CU	1600 MHz	1228.8	FP6	16 (8+4+4) PCIe 3.0	DDR4-3200 LPDDR4-4266 dual-channel	10–25 W
Ryzen 5 5500U (zen2)			6 (12)	1 × 6	2.1						448:28:8 7 CU	1800 MHz	1612.8
Ryzen 5 5600U[note 1][176]					2.3	4.2			16 MB								10-25 W
Ryzen 5 5600H[177][178]					3.3												35–54 W
Ryzen 5 5600HS[179]					3.0												35 W
Ryzen 7 5800U[note 1][180]			8 (16)	1 × 8	1.9	4.4					512:32:8 8 CU	2000 MHz	2048				10–25 W
Ryzen 7 5800H[181][182]					3.2												35–54 W
Ryzen 7 5800HS[183]					2.8												35 W
Ryzen 9 5900HS[184]					3.0	4.6						2100 MHz	2150.4
Ryzen 9 5900HX[185]					3.3												35–54 W
Ryzen 9 5980HS[186]					3.0	4.8											35 W
Ryzen 9 5980HX[187]					3.3												35–54 W

Ultra-mobile APUs[]

Brazos: "Desna", "Ontario", "Zacate" (2011)[]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[191]
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics with UVD 3.0
• Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU					GPU					DDR3 Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS[b]
							L1	L2
Z-01	Jun 1, 2011	40nm	B0	2 (2)	1.0	N/A	32KB inst. 32KB data per core	2× 512KB	HD 6250	80:8:4	276	N/A	44.1	1066	5.9	XMZ01AFVB22GV
C-30	Jan 4, 2011			1 (1)	1.2			512KB							9	CMC30AFPB12GT
C-50				2 (2)	1.0			2× 512KB								CMC50AFPB22GT
C-60	Aug 22, 2011		C0			1.33			HD 6290			400				CMC60AFPB22GV
E-240	Jan 4, 2011		B0	1 (1)	1.5	N/A		512KB	HD 6310		500	N/A	80	1066	18	EME240GBB12GT
E-300	Aug 22, 2011			2 (2)	1.3			2× 512KB			488		78			EME300GBB22GV
E-350	Jan 4, 2011				1.6						492		78.7			EME350GBB22GT
E-450	Aug 22, 2011		B0 C0		1.65				HD 6320		508	600	81.2	1333		EME450GBB22GV

Brazos 2.0: "Ontario", "Zacate" (2012)[]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[191]
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU						GPU					DDR3 Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS[b]
							L1	L2	L3
C-70	Sep 15, 2012	40nm	C0	2 (2)	1.0	1.33	32 KB inst. 32 KB data per core	2× 512KB	N/A	HD 7290	80:8:4	276	400	44.1	1066	9	CMC70AFPB22GV
E1-1200	Jun 6, 2012		C0		1.4	N/A				HD 7310		500	N/A	80	1066	18	EM1200GBB22GV
E1-1500	Jan 7, 2013				1.48							529		84.6
E2-1800	Jun 6, 2012				1.7					HD 7340		523	680	83.6	1333		EM1800GBB22GV
E2-2000	Jan 7, 2013				1.75							538	700	86

Brazos-T: "Hondo" (2012)[]

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture^[191]
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• Found in tablet computers
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
						L1	L2
Z-60	Oct 9, 2012	40nm	C0	2 (2)	1.0	32KB inst. 32KB data per core	2× 512 KB	HD 6250	80:8:4	276	44.1	1066	4.5	XMZ60AFVB22GV

"Kabini", "Temash" (2013)[]

• Fabrication 28 nm by TSMC
• Socket FT3 (BGA)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on Graphics Core Next (GCN)
• AMD Eyefinity multi-monitor for up to two displays

Temash, Elite Mobility APU[]

Model	Released	Fab	Step.	CPU					GPU				DDR3L Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)
A4-1200	May 23, 2013	28nm	KB-A1	2 (2)	1.0	N/A	32 KB inst. 32 KB data per core	1	HD 8180	128:8:4 2 CU	225	N/A	1066	4	AT1200IFJ23HM
A4-1250									HD 8210		300		1333	8	AT1250IDJ23HM
A4-1350				4 (4)				2					1066		AT1350IDJ44HM
A6-1450						1.4			HD 8250			400			AT1450IDJ44HM

Kabini, Mainstream APU[]

Model	Released	Fab	Step.	CPU					GPU			DDR3L Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Cache[a]			Model	Config	Clock (MHz)
						L1	L2 (MB)	L3
E1-2100	May 2013	28nm	KB-A1	2 (2)	1.0	32KB inst. 32KB data per core	1	N/A	HD 8210	128:8:4 2 CU	300	1333	9	EM2100ICJ23HM
E1-2200	Feb 2014				1.05									EM2200ICJ23HM
E1-2500	May 2013				1.4				HD 8240		400		15	EM2500IBJ23HM
E2-3000					1.65				HD 8280		450	1600		EM3000IBJ23HM
E2-3800	Feb 2014			4	1.3		2							EM3800IBJ44HM
A4-5000	May 2013				1.5				HD 8330		497			AM5000IBJ44HM
A4-5100	Feb 2014				1.55									AM5100IBJ44HM
A6-5200	May 2013				2.0				HD 8400		600		25	AM5200IAJ44HM
A4 Pro-3340B	Nov 2014				2.2				HD 8240		400			AM334BIAJ44HM

"Beema", "Mullins" (2014)[]

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA)
• CPU: 2 to 4 (Puma cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

Mullins, Tablet/2-in-1 APU[]

Model	Released	Fab	Step.	CPU						GPU				DDR3L Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)	L3
E1 Micro-6200T	Q2 2014	28nm	ML-A1	2 (2)	1.0	1.4	32 KB inst. 32 KB data per core	1	N/A	R2	128:8:4 2 CU	300	600	1066	3.95	EM620TIWJ23JB
A4 Micro-6400T				4 (4)		1.6		2		R3		350	686	1333	4.5	AM640TIVJ44JB
A10 Micro-6700T					1.2	2.2				R6		500	N/A			AM670TIVJ44JB

Beema, Notebook APU[]

Model	Released	Fab	Step.	CPU						GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)	L3
E1-6010	Q2 2014	28nm	ML-A1	2 (2)	1.35	N/A	32 KB inst. 32 KB data per core	1	N/A	R2	128:8:4 2 CU	300	600	(L)1333	10	EM6010IUJ23JB
E1-6015[192]	Q2 2015				1.4
E2-6110	Q2 2014			4 (4)	1.5			2						(L)1600	15	EM6110ITJ44JB
A4-6210					1.8					R3		350	686			AM6210ITJ44JB
A4-6250J[193]					2.0										25
A6-6310					1.8	2.4				R4		300	800	(L)1866	15	AM6310ITJ44JB
A8-6410					2.0					R5						AM6410ITJ44JB

"Carrizo-L" (2015)[]

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA), FP4 (µBGA)^[194]
• CPU: 2 to 4 (Puma+ cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
• All models except A8-7410 available in both laptop and all-in-one desktop versions

Model	Released	Fab	Step.	CPU					GPU				DDR3L Memory support	TDP (W)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock	Turbo (MHz)
							L1	L2 (MB)
E1-7010	May 2015	28nm	ML-A1	2	1.5	N/A	32 KB inst. 32 KB data per core	1	R2	128:8:4 2 CU		400	1333	10	EM7010IUJ23JB EM7010JCY23JB EM7010JCY23JBD
E2-7110				4	1.8			2	R2			600	1600	12– 25	EM7110ITJ44JB EM7110JBY44JB EM7110JBY44JBD
A4-7210						2.2			R3			686			AM7210ITJ44JB AM7210JBY44JBD
A6-7310					2.0	2.4			R4			800	1866		AM7310ITJ44JB AM7310JBY44JB AM7310JBY44JBD
A8-7410					2.2	2.5			R5			847		15	AM7410JBY44JB

"Stoney Ridge" (2016)[]

• Fabrication 28 nm by GlobalFoundries
• Socket FP4^[113] / FT4
• 2 "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• Single-channel DDR4 memory controller
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 3rd Generation with VP9 decoding

Model number	Released	Fab	CPU					GPU				DDR4 Memory support	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config	Clock (MHz)	GFLOPS[b]
						L1	L2 (MB)
E2-9000e	November 2016	28nm	[1]2	1.5	2.0	96 KB inst. per module 32 KB data per core	1	R2	128:8:4 2 CU	600	153.6	1866	6	EM900EANN23AC
E2-9000	June 2016			1.8	2.2								10	EM9000AKN23AC
E2-9010				2.0	2.2								10–15	EM9010AVY23AC
A4-9120	Q2 2017			2.2	2.5			R3		655	167.6	2133	10–15	AM9120AYN23AC
A4-9125	Q2 2018			2.3	2.6					686	175.6			AM9125AYN23AC
A4-9120C	January 6, 2019			1.6	2.4			R4	192:12:8 3 CU	600	230.4	1866	6	AM912CANN23AC
A6-9200e	November 2016			1.8	2.7							2133		AM920EANN23AC
A6-9200				2.0	2.8								10	AM9200AKN23AC
A6-9210	June 2016			2.4	2.8								10–15	AM9210AVY23AC
A6-9220	Q2 2017			2.5	2.9					655	251.5		10–15	AM9220AYN23AC
A6-9225	Q2 2018			2.6	3.0					686	263.4			AM9225AYN23AC
A6-9220C	January 6, 2019			1.8	2.7			R5		720	276.4	1866	6	AM922CANN23AC
A9-9400	November 2016			2.4	3.2					800	307.2	2133	10	AM9400AKN23AC
A9-9410	June 2016			2.9	3.5								10–25	AM9410AFY23AC
A9-9420	Q2 2017			3.0	3.6					847	325.2			AM9420AYN23AC
A9-9425	Q2 2018			3.1	3.7					900	345.6			AM9425AYN23AC
A9-9430[195]	Q2 2017			3.2	3.5					847	325.2	2400	25	AD9430AJN23AC
Pro A4-4350B	Q1 2018			2.5	2.9					655	251.5	2133	15
Pro A4-5350B	Q1 2020			3.0	3.6					847	325.2
Pro A6-7350B	Q1 2018
Pro A6-8350B	Q1 2020			3.1	3.7					900	345.6

"Dalí", "Pollock" (2020)[]

• Fabrication 14 nm by GlobalFoundries
• Socket FP5 / FT5
• Two Zen CPU cores
• Over 30% die size reduction over predecessor (Raven Ridge)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

Model	Release date	Fab	CPU						GPU				Socket	PCIe lanes	Memory support	TDP	Part number
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config[a]	Clock	Processing power (GFLOPS)[b]
				Base	Boost	L1	L2	L3
AMD 3015e[196]	July 6, 2020	14 nm	2 (4)	1.2	2.3	64 KB inst. 32 KB data per core	512 KB per core	4 MB	AMD Radeon(TM) Graphics (Vega)	3 CU	600 MHz		FT5	12 (8+4)	DDR4-1600 single-channel	6 W	AM3015BRP2OFJ
AMD 3015Ce[197]	April 29, 2021																AM301CBRP2OFJ
AMD 3020e[198]	January 6, 2020		2 (2)	1.2	2.6					192:12:4 3 CU	1000 MHz	384	FP5		DDR4-2400 dual-channel		YM3020C7T2OFG
Athlon Silver 3050e[199]			2 (4)	1.4	2.8												YM3050C7T2OFG
Athlon PRO 3045B	Q1 2021		2 (2)	2.3	3.2					128:8:4 2 CU	1100 MHz	281.6				12-25 W	YM3045C4T2OFG
Athlon Silver 3050U[200]	January 6, 2020																YM3050C4T2OFG
Athlon Silver 3050C[201]	September 22, 2020																YM305CC4T2OFG
Athlon PRO 3145B	Q1 2021		2 (4)	2.6	3.3					192:12:4 3 CU	1000 MHz	384					YM3145C4T2OFG
Athlon Gold 3150U[202]	January 6, 2020																YM3150C4T2OFG
Athlon Gold 3150C[203]	September 22, 2020																YM315CC4T2OFG
Ryzen 3 3250U[204]	January 6, 2020			2.6	3.5						1200 MHz	460.8					YM3250C4T2OFG
Ryzen 3 3250C[205]	September 22, 2020																YM325CC4T2OFG

Embedded APUs[]

G-Series[]

Brazos: "Ontario" and "Zacate" (2011)[]

• Fabrication 40 nm
• Socket FT1 (BGA-413)
• CPU microarchitecture: Bobcat^[206]
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
• Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
• 5 GT/s UMI

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads)	Clock (GHz)	Cache[a]		Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2
G-Series T24L	Mar 1, 2011 May 23, 2011	40nm	B0	1 (1)	0.8 1.0	32 KB inst. 32 KB data per core	512 KB	N/A				1066	5	GET24LFPB12GTE GET24LFQB12GVE
G-Series T30L	Mar 1, 2011 May 23, 2011				1.4								18	GET30LGBB12GTE GET30LGBB12GVE
G-Series T48L	Mar 1, 2011 May 23, 2011			2 (2)			2 × 512 KB							GET48LGBB22GTE GET48LGBB22GVE
G-Series T16R	Jun 25, 2012		B0	1 (1)	0.615		512 KB	HD 6250	80:8:4	276	44.1	(L)1066	4.5	GET16RFWB12GVE
G-Series T40R	May 23, 2011				1.0					280	44.8	1066	5.5	GET40RFQB12GVE
G-Series T40E				2 (2)			2 × 512 KB						6.4	GET40EFQB22GVE
G-Series T40N	Jan 19, 2011 May 23, 2011							HD 6250 HD 6290					9	GET40NFPB22GTE GET40NFPB22GVE
G-Series T40R	May 23, 2011			1 (1)			512 KB	HD 6250					5.5	GET40RFSB12GVE
G-Series T44R	Jan 19, 2011 May 23, 2011				1.2								9	GET44RFPB12GTE GET44RFPB12GVE
G-Series T48E	Jun 25, 2012			2 (2)	1.4		2 × 512 KB						18	GET48EGBB22GVE
G-Series T48N	Jan 19, 2011 May 23, 2011							HD 6310		500 520	80 83.2			GET48NGBB22GTE GET48NGBB22GVE
G-Series T52R	Jan 19, 2011 May 23, 2011			1 (1)	1.5		512 KB			500	80	1066 1333		GET52RGBB12GTE GET52RGBB12GVE
G-Series T56E	Jun 25, 2012			2 (2)	1.65		2 × 512 KB	HD 6250		275	44	1333		GET56EGBB22GVE
G-Series T56N	Jan 19, 2011 May 23, 2011				1.6 1.65			HD 6310 HD 6320		500	80	1066 1333		GET56NGBB22GTE GET56NGBB22GVE

"Kabini" (2013, SoC)[]

• Fabrication 28 nm
• Socket FT3 (769-BGA)^[207]
• CPU microarchitecture: Jaguar
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module (TPM) 1.2 support
• GPU microarchitecture: Graphics Core Next (GCN) with Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.)
• Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
• Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0 (except GX-210JA)

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memory support	TDP (W)	Junction temperature (°C)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Cache[a]		Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)
GX-210UA	Un­known	28nm	B0	2 (2) [1]	1.0	32 KB inst. 32 KB data per core	1	N/A				1333	8.5	0-90	GE210UIGJ23HM
GX-210JA	Jul 30, 2013							HD 8180E	128:8:4 2 CU	225	57.6	1066	6		GE210JIHJ23HM
GX-209HA	Un­known							HD 8400E		600	153.6		9	-40-105	GE209HISJ23HM
GX-210HA	Jun 1, 2013							HD 8210E		300	76.8	1333		0-90	GE210HICJ23HM
GX-217GA					1.65			HD 8280E		450	115.2	1600	15		GE217GIBJ23HM
GX-411GA	Un­known			4 (4) [2]	1.1		2	HD 8210E		300	76.8	1066		-40-105	GE411GIRJ44HM
GX-415GA	Jun 1, 2013				1.5			HD 8330E		500	128	1600		0-90	GE415GIBJ44HM
GX-416RA					1.6			N/A							GE416RIBJ44HM
GX-420CA					2.0			HD 8400E	128:8:4 2 CU	600	153.6		25		GE420CIAJ44HM

"Steppe Eagle" (2014, SoC)[]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memory support	TDP (W)	Junction temperature (°C)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Cache[a]		Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)
GX-210JC	June 4, 2014	28nm	ML-A1	2 (2) [1]	1.0	32 KB inst. 32 KB data per core	1	R1E	128:8:4 2 CU	267	68.3	1600	6	-40-105	GE210JIZJ23JB
GX-212JC					1.2			R2E		300	76.8	1333		0-90	GE212JIYJ23JB
GX-216HC					1.6			R4E				1066	10	-40-105	GE216HHBJ23JB
GX-222GC					2.2			R5E		655	167.6	1600	15	0-90	GE222GITJ23JB
GX-412HC				4 (4) [2]	1.2		2	R3E		300	76.8	1333	7		GE412HIYJ44JB
GX-424CC					2.4			R5E		497	127.2	1866	25		GE424CIXJ44JB

"Crowned Eagle" (2014, SoC)[]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• no GPU

Model	Released	Fab	CPU				GPU	DDR3 Memory support	TDP (W)	Junction temperature (°C)	Part number
			Cores (threads) [FPUs]	Clock (GHz)	Cache[a]
					L1	L2 (MB)
GX-224PC	June 4, 2014	28nm	2 (2) [1]	2.4	32 KB inst. 32 KB data per core	1	N/A	1866	25	0-90	GE224PIXJ23JB
GX-410VC			4 (4) [2]	1.0		2		1066	7	-40-105	GE410VIZJ44JB
GX-412TC				1.2				1600	6	0-90	GE412TIYJ44JB
GX-420MC				2.0					17.5		GE420MIXJ44JB

LX-Family (2016, SoC)[]

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• 2 Puma x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
• Single channel 64-bit DDR3 memory with ECC
• Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Cache[a]		Model	Config	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)
GX-208JL	Feb 23, 2016	28nm	ML-A1	2	0.8	32 KB inst. 32 KB data per core	1	R1E	64:4:1 1 CU	267	34.1	1333	6	GE208JIVJ23JB
GX-210HL	2017				1.0							1066	7	GE208HIZJ23JB
GX-210JL	Feb 23, 2016											1333	6	GE210JIVJ23JB
GX-210KL	2017												4.5	GE210KIVJ23JB
GX-215GL	Feb 23, 2016				1.5					497	63.6	1600	15	GE215GITJ23JB
GX-218GL					1.8									GE218GITJ23JB

I-Family: "Brown Falcon" (2016, SoC)[]

• Fabrication 28 nm
• Socket FP4^[208]
• 2 or 4 Excavator x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• 4K × 2K H.265 decode capability and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	CPU					GPU				Memory support	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)
GX-217GI	Feb 23, 2016	28nm	[1] 2	1.7	2.0	96 KB inst. per module 32 KB data per core	1	R6E	256:16:4 4 CU	758	388	DDR3/DDR4-1600	15	GE217GAAY23KA
GX-420GI[209][210]	2016		[2] 4	2.0	2.2		2	R6E R7E	256:16:4 4 CU 384:24:4 6 CU	758 626	388 480.7	DDR4-1866	16.1	GE420GAAY43KA

J-Family: "Prairie Falcon" (2016, SoC)[]

• Fabrication 28 nm
• Socket FP4^[211]
• 2 "Excavator+" x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
• Single channel 64-bit DDR4 or DDR3 memory
• 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	CPU					GPU					Memory support	TDP (W)	Junction temperature (°C)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Turbo	Processing power (GFLOPS)[b]
						L1	L2 (MB)
GX-212JJ	2018	28nm	[1] 2	1.2	1.6	96 KB inst. per module 32 KB data per core	1	R1E	64:4:1 1 CU	600	N/A	76.8	DDR3-1333 DDR4-1600	6– 10	0-90	GE212JAWY23AC
GX-215JJ	2017			1.5	2.0			R2E	128:8:2 2 CU			153.6	DDR3-1600 DDR4-1866			GE215JAWY23AC
GX-220IJ	2018			2.0	2.2									10– 15		GE220IAVY23AC
GX-224IJ	2017			2.4	2.8			R4E	192:12:3 3 CU			230.4	DDR3-1866 DDR4-2133			GE224IAVY23AC

R-Series[]

Comal: "Trinity" (2012)[]

• Fabrication 32 nm
• Socket FP2 (BGA-827), FS1r2
• CPU microarchitecture: Piledriver
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,^[29] ABM, BMI1, TBM
• GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
• Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
• 2.5 GT/s UMI
• Die size: 246 mm²; Transistors: 1.303 billion
• OpenCL 1.1 and OpenGL 4.2 support

Model	Released	Fab	Step.	CPU					GPU					DDR3 Memory support	TDP (W)	Part number
				[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Turbo (MHz)	Processing power (GFLOPS)[b]
							L1	L2 (MB)
R-252F	May 21, 2012	32nm	B0	[1] 2	1.9	2.4	64 KB inst. per module 16 KB data per core	1	HD 7400G	192:12:4 3 CU	333	417	127.8	1333	17	RE252FSHE23HJE
R-260H					2.1	2.6		2?	HD 7500G	256:16:8 4 CU	327	424	167.4			RE260HSHE24HJE
R-268D					2.5	3.0		1	HD 7420G	192:12:4 3 CU	470	640	180.4	1600	35	RE268DDEC23HJE
R-272F					2.7	3.2			HD 7520G		497	686	190.8			RE272FDEC23HJE
R-452L				[2] 4	1.6	2.4		2 × 2 MB	HD 7600G	256:16:8 4 CU	327	424	167.4		19	RE452LSHE44HJE
R-460H					1.9	2.8			HD 7640G		497	655	254.4		35	RE460HDEC44HJE
R-460L					2.0				HD 7620G	384:24:8 6 CU	360	497	276.4	1333	25	RE460LSIE44HJE
R-464L					2.3	3.2			HD 7660G		497	686	381.6	1600	35	RE464LDEC44HJE

"Bald Eagle" (2014)[]

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 cores^[212]
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,^[29] ABM, BMI1, TBM
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
• Dual channel DDR3 memory with ECC
• Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

Model	Released	Fab	CPU					GPU					DDR3 Memory support	TDP (W)	Junction temperature (°C)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]		Model	Config[note 1]	Clock (MHz)	Turbo (MHz)	Processing power (GFLOPS)[b]
						L1	L2 (MB)
RX-219NB	May 20, 2014	28nm	[1] 2	2.2	3.0	96 KB inst. per module 16 KB data per core	1	N/A					1600	15- 17	0-100	RE219NECH23JA
RX-225FB								R4	192:12:4 3 CU	464	533	178.1				RE225FECH23JA
RX-425BB			[2] 4	2.5	3.4		4	R6	384:24:8 6 CU	576	654	442.3	1866	30- 35		RE425BDGH44JA
RX-427BB				2.7	3.6			R7	512:32:8 8 CU	600	686	614.4	2133	30- 35		RE427BDGH44JA
RX-427NB								N/A								RE427NDGH44JA

"Merlin Falcon" (2015, SoC)[]

• Fabrication 28 nm
• Socket
• Up to 4 Excavator x86 cores^[213]
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
• Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
• Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

Model	Released	Fab	Stepping	CPU						GPU					Memory support	TDP (W)	Junction temperature (°C)	Part number
				[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache[a]			Model	Config[note 1]	Clock (GHz)	Turbo	Processing power (GFLOPS)[b]
							L1	L2 (MB)	L3
RX-216TD	October 21, 2015	28nm		[1] 2	1.6	3.0	96 KB inst. per module 32 KB data per core	1	N/A	N/A					DDR3/DDR4-1600	12- 15	0-90	RE216TAAY23KA
RX-216GD										R5	256:?:? 4 CU	0.8	N/A	409.6				RE216GAAY23KA
RX-416GD				[2] 4		2.4		2		R6	384:?:? 6 CU	0.72		552.9		15	-40-105	RE416GATY43KA
RX-418GD	October 21, 2015				1.8	3.2					384:?:? 6 CU	0.8		614.4	DDR3-2133 DDR4-2400	12- 35	0-90	RE418GAAY43KA
RX-421BD					2.1	3.4				R7	512:?:? 8 CU			819.2				RE421BAAY43KA
RX-421ND										N/A								RE421NAAY43KA

1000-Series[]

V1000-Family: "Great Horned Owl" (2018, SoC)[]

• Fabrication 14 nm by GlobalFoundries
• Up to 4 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

Model	Release date	Fab	CPU						GPU				DDR4 Memory support	Ethernet	TDP	Junction temperature (°C)
			Cores (threads)	Clock rate (GHz)		Cache			Model	Config[i]	Clock (GHz)	Processing power (GFLOPS)[ii]
				Base	Boost	L1	L2	L3
V1500B[214]	December 2018	GloFo 14LP	4 (8)	2.2	N/A	64 KB inst. 32 KB data per core	512 KB per core	4 MB	N/A				2400 dual-channel	2× 10GbE	12–25 W	0–105
V1780B[214]				3.35	3.6								3200 dual-channel		35–54 W
V1202B[214]	February 2018		2 (4)	2.3	3.2				RX Vega 3	192:12:16 3 CU	1.0	384	2400 dual-channel		12–25 W
V1404I[214]	December 2018		4 (8)	2.0	3.6				RX Vega 8	512:32:16 8 CU	1.1	1126.4				−40 – 105
V1605B[214]	February 2018															0–105
V1756B[214]				3.25							1.3	1331.2	3200 dual-channel		35–54 W
V1807B[214]				3.35	3.8				RX Vega 11	704:44:16 11 CU		1830.4

R1000-Family: "Banded Kestrel" (2019, SoC)[]

• Fabrication 14 nm by GlobalFoundries
• Up to 2 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

Model	Release date	Fab	CPU							GPU				Memory support	TDP
			Cores (threads)	Clock rate (GHz)			Cache			Model	Config[i]	Clock (GHz)	Processing power (GFLOPS)[ii]
				Base	Boost	XFR	L1	L2	L3
R1102G [215]	February 25, 2020	GloFo 14LP	2 (2)	1.2	2.6	Un­known	64 KB inst. 32 KB data per core	512 KB per core	4 MB	RX Vega 3	192:12:4 3 CU	1.0	384	DDR4-2400 single-channel	6 W
R1305G[215]			2 (4)	1.5	2.8	Un­known								DDR4-2400 dual-channel	8-10 W
R1505G[215]	April 16, 2019			2.4	3.3	Un­known									12–25 W
R1606G[215]				2.6	3.5	Un­known						1.2	460.8

2000-Series[]

V2000-Family: "Grey Hawk" (2020, SoC)[]

• Fabrication 7 nm by TSMC
• Up to 8 Zen 2 cores
• Fifth generation GCN based GPU

Model	Release date	Fab	CPU						GPU				Socket	PCIe support	Memory support	TDP
			Cores (threads)	Clock rate (GHz)		Cache			Architecture	Config[i]	Clock (GHz)	Processing power (GFLOPS)[ii]
				Base	Boost	L1	L2	L3
V2516[216][217]	November 10, 2020[218]	TSMC 7FF	6 (12)	2.1	3.95	32 KB inst. 32 KB data per core	512 KB per core	8 MB	GCN 5th gen	384:24:8 6 CU	1.5	1152	FP6	PCIe 3.0 ×20 8+4+4+4	DDR4-3200 dual-channel LPDDR4X-4266 quad-channel	10-25 W
V2546[216][217]				3.0	3.95											35-54 W
V2718[216][217]			8 (16)	1.7	4.15					448:28:8 7 CU	1.6	1433.6				10-25 W
V2748[216][217]				2.9	4.25											35-54 W

Custom APUs[]

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit.^[219] Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.^[220] So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

Chip (device)	Release date	Fab	Die area (mm2)	CPU				GPU							Memory			Storage	API support	Special features
				Archi- tecture	Cores	Clock (GHz)	L2 cache	Archi- tecture	Core config[a]	Clock (MHz)	GFLOPS [b]	Pixel fillrate (GP/s) [c]	Texture fillrate (GT/s) [d]	Other	Size	Bus type & width	Band- width (GB/s)			Audio	Other
Liverpool (PS4)	Nov 2013	28 nm	348	Jaguar	8 cores	1.6	2× 2 MiB	GCN 2	1152:72:32 18 CU	800	1843	25.6	57.6	8 ACEs	8 GiB	GDDR5 256-bit	176	3DBD/DVD 1× 2.5" SATA hard drive Easily replaceable hard drive USB 3.0	OpenGL 4.2, GNM, GNMX and PSSL	Dolby Atmos (BD) S/PDIF	PS VR PS4 additional modules HDR10 (except discs)[e] CEC Optional IR sensor
Durango (Xbox One)	Nov 2013		363			1.75			768:48:16 12 CU	853	1310	13.6	40.9	2 ACEs	32 MiB	ESRAM[f]	204	3DBD/DVD/CD 1× 2.5" SATA hard drive USB 3.0	Direct3D 11.2 and 12	Fully Dolby Atmos, DTS:X, and Windows Sonic S/PDIF	Xbox One additional modules FreeSync (1) HDMI 1.4 through IR sensor and IR out port Kensington lock
															8 GiB	DDR3 256-bit	68
Edmonton (Xbox One S) [221]	Jun 2016	16 nm	240							914	1404	14.6	43.9	2 ACEs	32 MiB	ESRAM	219	4KBD/3DBD/DVD/CD[g] 1× 2.5" SATA hard drive USB 3.0		Fully Dolby Atmos, DTS:X, and Windows Sonic S/PDIF	Xbox One S additional modules Fully HDR10 Dolby Vision (streaming) FreeSync (1&2) HDMI 1.4 through IR sensor and IR out port Kensington lock
															8 GiB	DDR3 256-bit	68
(PS4 Slim)	Sep 2016		208			1.6			1152:72:32 18 CU	800	1843	25.6	57.6	8 ACEs	8 GiB	GDDR5 256-bit	176	3DBD/DVD 1× 2.5" SATA hard drive Easily replaceable hard drive USB 3.0	OpenGL 4.2, GNM, GNMX and PSSL	Dolby Atmos (BD)	PS VR PS4 Slim additional modules HDR10 (except discs) CEC Optional IR sensor
Neo (PS4 Pro) [222][223][224]	Nov 2016		325			2.13		GCN 4 Polaris [225]	2304:144:32 36 CU	911	4198	58.3	131.2	4 ACEs and 2 HWS Double-rate FP16[h] checkerboard rendering	8 GiB [226]	GDDR5 256-bit	218	3DBD/DVD 1× 2.5" SATA hard drive Easily replaceable hard drive USB 3.0	OpenGL 4.2 (4.5), GNM, GNMX and PSSL	Dolby Atmos (BD) S/PDIF	PS VR PS4 Pro additional modules HDR10 (except discs) Up to 4K@60 Hz CEC Optional IR sensor
															1 GiB	DDR3[i]	?
Scorpio (Xbox One X) [227][228][229]	Nov 2017		359	Customized Jaguar		2.3			2560:160:32 40 CU	1172	6001	37.5	187.5	4 ACEs and 2 HWS	12 GiB	GDDR5 384-bit	326	4KBD/3DBD/DVD/CD 1× 2.5" SATA hard drive USB 3.0	Direct3D 11.2 and 12	Fully Dolby Atmos, DTS:X, and Windows Sonic S/PDIF	Xbox One X additional modules Fully HDR10 Dolby Vision (streaming) FreeSync (1&2) Up to 4K@60 Hz HDMI 1.4b through IR sensor and IR out port
Fenghuang () [230][231][232]	cancelled [233]	14 nm [234]	397	Zen	4 cores 8 threads	3.0		GCN 5 Vega	1536:96:32 24 CU	1300	3994	41.6	124.8	Double-rate FP16	8 GiB	GDDR5 256-bit	154	1× 2.5" SATA SSD 1× 2.5" SATA hard drive Easily replaceable drives USB 3.0	Vulkan 1.1, Direct3D 12.1	S/PDIF	Subor Z Plus additional modules Windows 10 Enterprise LTSC
Oberon (PS5) [235]	Nov 2020	7 nm	308	Zen 2	8 cores 16 threads	3.5 (variable)		RDNA 2 Big Navi	2304:144:64 36 CU	2233 (variable)	10290 (variable)	142.9	321.6	Double-rate FP16 Real-time ray tracing Primitive shaders Custom 3D audio blocks	16 GiB	GDDR6 256-bit	448	4KBD Custom 5.5 GB/s PCIe 4.0 x4 NVMe SSD PCIe 4.0 M.2 slot Easily replaceable M.2 SSD USB (except PS5 games)	Vulkan 1.2	PS5 TEMPEST 3D AudioTech	PS VR Dedicated DMA controller and I/O coprocessors Custom coherency engines and cache scrubbers Custom decompression block HDR Up to 4K@120 Hz Up to 8K@30 Hz
Anaconda (Xbox Series X)	Nov 2020		360			3.6 (3.8 w/o SMT)			3328:208:64 52 CU	1825	12147	116.8	379.6	Double-rate FP16 Real-time ray tracing Mesh shaders Variable rate shading ANN acceleration	10 GiB	GDDR6 320-bit	560	4KBD Custom 2.4 GB/s NVMe SSD Custom expansion card USB 3.1 (except XSX games)	DirectX 12 Ultimate	Custom spatial audio block MS Project Acoustics Fully Dolby Atmos, DTS:X, and Windows Sonic	Custom decompression block HDR VRR Up to 4K@120 Hz Up to 8K@30 Hz CEC
															6 GiB	GDDR6 192-bit[j]	336
Lockhart (Xbox Series S)			197			3.4 (3.6 w/o SMT)			1280:80:32 20 CU	1565	4006	50.1	125.2		8 GiB	GDDR6 128-bit	224
															2 GiB	GDDR6 32-bit	56
Mero (Steam Deck)[236]	Dec 2021				4 cores 8 threads	2.4-3.5		RDNA 2	512:32:?? 8 CU	1000-1600	1000-1600		32-51.2	Double-rate FP16 Real-time ray tracing Variable rate shading	16 GiB	LPDDR5 128-bit	88	64 GB eMMC (PCIe Gen 2 x1) 256 GB NVMe SSD (PCIe Gen 3 x4) 512 GB NVMe SSD (PCIe Gen 3 x4) microSD card slot

See also[]

• AMD Accelerated Processing Unit
• List of AMD chipsets
• List of AMD FX microprocessors
• List of AMD graphics processing units
• Ryzen

Notes[]

References[]

External links[]

• AMD Accelerated Processing Units official website
• Technical specification AMD products
• AMD products and technologies