List of AMD accelerated processing units

From Wikipedia, the free encyclopedia

This is a list of microprocessors designed by Advanced Micro Devices, under the AMD Accelerated Processing Unit product series.

Features overview[]

The following table shows features of AMD's APUs

Platform High, standard and low power Low and ultra-low power
Codename Server Basic Toronto
Micro Kyoto
Desktop Performance Renoir Cezanne
Mainstream Llano Trinity Richland Kaveri Kaveri Refresh (Godavari) Carrizo Bristol Ridge Raven Ridge Picasso
Entry
Basic Kabini
Mobile Performance Renoir Cezanne
Mainstream Llano Trinity Richland Kaveri Carrizo Bristol Ridge Raven Ridge Picasso
Entry Dalí
Basic Desna, Ontario, Zacate Kabini, Temash Beema, Mullins Carrizo-L Stoney Ridge
Embedded Trinity Bald Eagle Merlin Falcon,
Brown Falcon
Great Horned Owl Grey Hawk Ontario, Zacate Kabini Steppe Eagle, Crowned Eagle,
LX-Family
Prairie Falcon Banded Kestrel
Released Aug 2011 Oct 2012 Jun 2013 Jan 2014 2015 Jun 2015 Jun 2016 Oct 2017 Jan 2019 Mar 2020 Jan 2021 Jan 2011 May 2013 Apr 2014 May 2015 Feb 2016 Apr 2019
CPU microarchitecture K10 Piledriver Steamroller Excavator "Excavator+"[1] Zen Zen+ Zen 2 Zen 3 Bobcat Jaguar Puma Puma+[2] "Excavator+" Zen
ISA x86-64 x86-64
Socket Desktop High-end N/A N/A
Mainstream N/A AM4
Entry FM1 FM2 FM2+[a] N/A
Basic N/A N/A AM1 N/A
Other FS1 FS1+, FP2 FP3 FT1 FT3 FT3b
PCI Express version 2.0 3.0 2.0 3.0
Fab. (nm) GF 32SHP
(HKMG SOI)
GF
(HKMG bulk)
GF 14LPP
(FinFET bulk)
GF
(FinFET bulk)
TSMC N7
(FinFET bulk)
TSMC N40
(bulk)
TSMC
(HKMG bulk)
GF 28SHP
(HKMG bulk)
GF 14LPP
(FinFET bulk)
Die area (mm2) 228 246 245 245 250 210[3] 156 180 75 (+ 28 FCH) 107 ? 125 149
Min TDP (W) 35 17 12 10 4.5 4 3.95 10 6
Max APU TDP (W) 100 95 65 18 25
Max stock APU base clock (GHz) 3 3.8 4.1 4.1 3.7 3.8 3.6 3.7 3.8 4.0 1.75 2.2 2 2.2 3.2 3.3
Max APUs per node[b] 1 1
Max CPU[c] cores per APU 4 8 2 4 2
Max threads per CPU core 1 2 1 2
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF Yes Yes
IOMMU[d] N/A Yes
BMI1, AES-NI, CLMUL, and F16C N/A Yes
MOVBE N/A Yes
AVIC, BMI2 and RDRAND N/A Yes
ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, and CLZERO N/A Yes N/A Yes
WBNOINVD, CLWB, RDPID, RDPRU, and MCOMMIT N/A Yes N/A
FPUs per core 1 0.5 1 1 0.5 1
Pipes per FPU 2 2
FPU pipe width 128-bit 256-bit 80-bit 128-bit
CPU instruction set SIMD level SSE4a[e] AVX AVX2 SSSE3 AVX AVX2
3DNow! Yes Yes
FMA4, LWP, TBM, and XOP N/A Yes N/A N/A Yes N/A
FMA3 Yes Yes
L1 data cache per core (KiB) 64 16 32 32
L1 data cache associativity (ways) 2 4 8 8
L1 instruction caches per core 1 0.5 1 1 0.5 1
Max APU total L1 instruction cache (KiB) 256 128 192 256 512 64 128 96 128
L1 instruction cache associativity (ways) 2 3 4 8 16 2 3 4
L2 caches per core 1 0.5 1 1 0.5 1
Max APU total L2 cache (MiB) 4 2 4 1 2 1
L2 cache associativity (ways) 16 8 16 8
APU total L3 cache (MiB) N/A 4 8 16 N/A 4
APU L3 cache associativity (ways) 16 16
L3 cache scheme Victim N/A Victim Victim
Max stock DRAM support DDR3-1866 DDR3-2133 DDR3-2133, DDR4-2400 DDR4-2400 DDR4-2933 DDR4-3200, LPDDR4-4266 DDR3L-1333 DDR3L-1600 DDR3L-1866 DDR3-1866, DDR4-2400 DDR4-2400
Max DRAM channels per APU 2 1 2
Max stock DRAM bandwidth (GB/s) per APU 29.866 34.132 38.400 46.932 68.256 ? 10.666 12.800 14.933 19.200 38.400
GPU microarchitecture TeraScale 2 (VLIW5) TeraScale 3 (VLIW4) GCN 2nd gen GCN 3rd gen GCN 5th gen[4] TeraScale 2 (VLIW5) GCN 2nd gen GCN 3rd gen[4] GCN 5th gen
GPU instruction set TeraScale instruction set GCN instruction set TeraScale instruction set GCN instruction set
Max stock GPU base clock (MHz) 600 800 844 866 1108 1250 1400 2100 2100 538 600 ? 847 900 1200
Max stock GPU base GFLOPS[f] 480 614.4 648.1 886.7 1134.5 1760 1971.2 2150.4 ? 86 ? ? ? 345.6 460.8
3D engine[g] Up to 400:20:8 Up to 384:24:6 Up to 512:32:8 Up to 704:44:16[5] Up to 512:32:8 80:8:4 128:8:4 Up to 192:?:? Up to 192:?:?
IOMMUv1 IOMMUv2 IOMMUv1 ? IOMMUv2
Video decoder UVD 3.0 UVD 4.2 UVD 6.0 VCN 1.0[6] VCN 2.1[7] VCN 2.2[7] UVD 3.0 UVD 4.0 UVD 4.2 UVD 6.0 UVD 6.3 VCN 1.0
Video encoder N/A VCE 1.0 VCE 2.0 VCE 3.1 N/A VCE 2.0 VCE 3.1
AMD Fluid Motion No Yes No No Yes No
GPU power saving PowerPlay PowerTune PowerPlay PowerTune[8]
TrueAudio N/A Yes[9] N/A Yes
FreeSync 1
2
1
2
HDCP[h] ? 1.4 1.4
2.2
? 1.4 1.4
2.2
PlayReady[h] N/A 3.0 not yet N/A 3.0 not yet
Supported displays[i] 2–3 2–4 3 3 (desktop)
4 (mobile, embedded)
4 2 3 4
/drm/radeon[j][11][12] Yes N/A Yes N/A
/drm/amdgpu[j][13] N/A Yes[14] Yes N/A Yes[14] Yes
  1. ^ For FM2+ Excavator models: A8-7680, A6-7480 & Athlon X4 845.
  2. ^ A PC would be one node.
  3. ^ An APU combines a CPU and a GPU. Both have cores.
  4. ^ Requires firmware support.
  5. ^ No SSE4. No SSSE3.
  6. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  7. ^ Unified shaders : texture mapping units : render output units
  8. ^ a b To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup.
  9. ^ To feed more than two displays, the additional panels must have native DisplayPort support.[10] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed.
  10. ^ a b DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version.

Graphics API overview[]

The following table shows the graphics and compute APIs support across AMD GPU micro-architectures. Note that this table include micro-architectures not used in the APUs, and a branding series might include older generation chips.

Chip series Micro­architecture Fab Supported APIs AMD support Year introduced Introduced with
Rendering Computing / ROCm
Vulkan[15] OpenGL[16] Direct3D HSA OpenCL
Wonder Fixed-pipeline[a] 1000 nm
800 nm
N/A N/A N/A N/A N/A Ended 1986
Mach 800 nm
600 nm
1991
3D Rage 500 nm 5.0 1996 3D Rage
Rage Pro 350 nm 1.1 6.0 1997 Rage Pro
Rage 128 250 nm 1.2 1998 Rage 128 GL/VR
R100 180 nm
150 nm
1.3 7.0 2000 Radeon
R200 Programmable
pixel & vertex
pipelines
150 nm 8.1 2001 Radeon 8500
R300 150 nm
130 nm
110 nm
2.0[b] 9.0
11 (FL 9_2)
2002 Radeon 9700
R420 130 nm
110 nm
9.0b
11 (FL 9_2)
2004 Radeon X800
R520 90 nm
80 nm
9.0c
11 (FL 9_3)
2005 Radeon X1800
R600 TeraScale 1 80 nm
65 nm
3.3 10.0
11 (FL 10_0)
ATI Stream 2007 Radeon HD 2900 XT
RV670 55 nm 10.1
11 (FL 10_1)
ATI Stream APP[17] Radeon HD 3850/3870
RV770 55 nm
40 nm
1.0 2008 Radeon HD 4850/4870
Evergreen TeraScale 2 40 nm 4.5
(Linux 4.2)
[18][19][20][c]
11 (FL 11_0) 1.2 2009 Radeon HD 5850/5870
Northern Islands TeraScale 2
TeraScale 3
2010 Radeon HD 6850/6870
Radeon HD 6950/6970
Southern Islands GCN 1st gen 28 nm 1.0 4.6 11 (FL 11_1)
12 (FL11_1)
Yes 1.2
2.0 possible
2012 Radeon HD 7950/7970
Sea Islands GCN 2nd gen 1.2 11 (FL 12_0)
12 (FL 12_0)
2.0
(1.2 in MacOS, Linux)
2.1 Beta in Linux ROCm
2.2 possible
2013 Radeon HD 7790
Volcanic Islands GCN 3rd gen 2014 Radeon R9 285
Polaris GCN 4th gen 14 nm Current 2016 Radeon RX 480
Vega GCN 5th gen 14 nm
7 nm
11 (FL 12_1)
12 (FL 12_1)
2017 Radeon Vega Frontier Edition
Navi RDNA 7 nm 2019 Radeon RX 5700 (XT)
Navi 2X RDNA 2 11 (FL 12_1)
12 (FL 12_2)
2020 Radeon RX 6800 (XT)
  1. ^ Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders.
  2. ^ These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures.
  3. ^ OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware.

[21][22][23]

Desktop APUs[]

Lynx: "Llano" (2011)[]

  • Socket FM1
  • CPU: K10 (or Husky or K10.5) with no L3 cache cores with an upgraded architecture known as Stars
    • L1 Cache: 64 KB Data per core and 64 KB Instructions per core
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
  • GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.[24]
  • List of embedded GPU's
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors[25][26]
  • 5 GT/s UMI
  • Integrated PCIe 2.0 controller
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the current Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series
Model Released Fab Stepping CPU GPU DDR3

Memory
support

TDP

(W)

Box Number Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2 L3
Sempron X2 198 2012 Q1 32nm B0 2 (2) 2.5 N/A 64KB inst.
64KB data

per core
2× 512KB N/A N/A 1600 65 SD198XOJGXBOX SD198XOJZ22GX
Athlon II X2 221 2.8 AD221XOJGXBOX AD221XOJZ22GX
Athlon II X4 631 (65 W) 2012 4 (4) 2.6 4× 1MB 1866 AD631XOJGXBOX AD631XOJZ43GX
Athlon II X4 631 (100 W) 2011

8/15

100 AD631XOJGXBOX AD631XWNZ43GX
Athlon II X4 638 2012

2/8

2.7 65 AD638XOJGXBOX AD638XOJZ43GX
Athlon II X4 641 2.8 100 AD641XWNGXBOX AD641XWNZ43GX
Athlon II X4 651 2011

11/14

3.0 AD651XWNGXBOX AD651XWNZ43GX
Athlon II X4 651K 2012 Q1 AD651KWNGXBOX AD651KWNZ43GX
E2-3200 2011 Q4 2 (2) 2.4 2× 512KB HD 6370D 160:8:4 443 141.7 1600 65 ED3200OJGXBOX ED3200OJZ22GX
ED3200OJZ22HX
A4-3300 2011

9/7

2.5 HD 6410D AD3300OJGXBOX
AD3300OJHXBOX
AD33000OJZ22GX
AD33000OJZ22HX
A4-3400 2.7 600 192 AD3400OJGXBOX
AD3400OJHXBOX
AD3400OJZ22GX
AD3400OJZ22HX
A4-3420 2011

12/20

2.8 N/A AD3420OJZ22HX
A6-3500 2011

8/17

3 (3) 2.1 2.4 3× 1MB HD 6530D 320:16:8 443 283.5 1866 AD3500OJGXBOX AD3500OJZ33GX
A6-3600 4 (4) 4× 1MB AD3600OJGXBOX AD3600OJZ43GX
A6-3620 2011

12/20

2.2 2.5 AD3620OJGXBOX AD3620OJZ43GX
A6-3650 2011

6/30

2.6 N/A 100 AD3650WNZ43GX
A6-3670K[note 1] 2011

12/20

2.7 AD3670WNGXBOX AD3670WNZ43GX
A8-3800 2011

8/17

2.4 2.7 HD 6550D 400:20:8 600 480 65 AD3800OJZ43GX
A8-3820 2011

12/20

2.5 2.8 AD3820OJGXBOX AD3820OJZ43GX
A8-3850 2011

6/30

2.9 N/A 100 AD3850WNGXBOX AD3850WNZ43GX
A8-3870K[note 1] 2011

12/20

3.0 AD3870WNGXBOX AD3870WNZ43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b K models feature an unlocked multiplier and overclockable GPU.

Virgo: "Trinity" (2012)[]

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FM2
  • CPU: Piledriver
    • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • GPU TeraScale 3 (VLIW4)
  • Die Size: 246 mm2, 1.303 Billion transistors[28]
  • Support for up to four DIMMs of up to DDR3-1866 memory
  • 5 GT/s UMI
  • GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
  • Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C,[29] ABM, BMI1, TBM
  • Sempron and Athlon models exclude integrated graphics
  • Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card.[30][31] However, it has been found that this does not always improve 3D accelerated graphics performance.[32][33]
Model number Released Fab Step. CPU GPU DDR3

Mem.

TDP

(W)

Box Number Part number[34]
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

Sempron X2 240[35] 32nm TN-A1 [1]2 2.9 3.3 64KB inst.
per module

16KB data
per core
1 N/A 1600 65 SD240XOKA23HJ
Athlon X2 340[36] 2012/10 3.2 3.6 AD340XOKA23HJ
Athlon X4 730 2012

10/1

[2]4 2.8 3.2 2× 2MB 1866 65 AD730XOKA44HJ
Athlon X4 740 2012/10 3.2 3.7 AD740XOKHJBOX AD740XOKA44HJ
Athlon X4 750K 3.4 4.0 100 AD750KWOHJBOX AD750KWOA44HJ
FirePro A300 2012

8/7

3.4 4.0 FirePro 384:24:8
6 CU
760 583.6 65 AWA300OKA44HJ
FirePro A320 3.8 4.2 800 614.4 100 AWA320WOA44HJ
A4-5300 2012

10/1

[1]2 3.4 3.6 1 HD 7480D 128:8:4
2 CU
723 185 1600 65 AD5300OKHJBOX AD5300OKA23HJ
A4-5300B 2012/10 AD530BOKA23HJ
A6-5400K 2012

10/1

3.6 3.8 HD 7540D 192:12:4
3 CU
760 291.8 1866 AD540KOKHJBOX AD540KOKA23HJ
A6-5400B 2012/10 AD540BOKA23HJ
A8-5500 2012

10/1

[2]4 3.2 3.7 2× 2MB HD 7560D 256:16:8
4 CU
760 389.1 1866 65 AD5500OKHJBOX AD5500OKA44HJ
A8-5500B 2012/10 AD550BOKA44HJ
A8-5600K 2012

10/1

3.6 3.9 100 AD560KWOHJBOX AD560KWOA44HJ
A10-5700 2012

10/1

3.4 4.0 HD 7660D 384:24:8
6 CU
760 583.6 65 AD5700OKHJBOX AD5700OKA44HJ
A10-5800K 3.8 4.2 800 614.4 100 AD580KWOHJBOX AD580KWOA44HJ
A10-5800B 2012/10 AD580BWOA44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Richland" (2013)[]

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FM2
  • Two or four CPU cores based on the Piledriver microarchitecture
    • Die Size: 246 mm2, 1.303 Billion transistors[37]
    • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
    • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
  • GPU
Model Released Fab Step. CPU GPU DDR3

Mem.

TDP

(W)

Box Number Part number
[Modules/FPUs]

Cores/threads

Freq. (GHz) Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
Base Turbo
L1 L2

(MB)

Sempron X2 250[35] 32nm RL-A1 [1]2 3.2 3.6 64KB inst.
per module

16KB data
per core
1 N/A 65 SD250XOKA23HL
Athlon X2 350[38] 3.5 3.9 1866 65 AD350XOKA23HL
Athlon X2 370K Jun 2013 4.0 4.2 AD370KOKHLBOX AD370KOKA23HL
Athlon X4 750 Oct 2013 [2]4 3.4 4.0 2× 2MB 65 AD750XOKA44HL
Athlon X4 760K Jun 2013 3.8 4.1 100 AD760KWOHLBOX AD760KWOA44HL
FX-670K[39] Mar 2014 (OEM) 3.7 4.3 65 FD670KOKA44HL
A4-4000 May 2013 [1]2 3.0 3.2 1 7480D 128:8:4
2 CU
720 184.3 1333 65 AD4000OKHLBOX AD4000OKA23HL
A4-4020 Jan 2014 3.2 3.4 AD4020OKHLBOX AD4000OKA23HL
A4-6300 July 2013 3.7 3.9 8370D 760 194.5 1600 AD6300OKHLBOX AD6300OKA23HL
A4-6300B AD630BOKA23HL
A4-6320 Dec 2013 3.8 4.0 AD6320OKHLBOX AD6320OKA23HL
A4-6320B Mar 2014 AD632BOKA23HL
A4-7300 Aug 2014 8470D 192:12:4
3 CU
800 307.2 AD7300OKA23HL
A4 PRO-7300B AD730BOKA23HL
A6-6400B 2013

6/4

3.9 4.1 1866 AD640BOKA23HL
A6-6400K AD640KOKHLBOX AD640KOKA23HL
A6-6420B Jan 2014 4.0 4.2 AD642BOKA23HL
A6-6420K AD642KOKHLBOX AD642KOKA23HL
A8-6500T Sep 18, 2013 [2]4 2.1 3.1

2MB

8550D 256:16:8
4 CU
720 368.6 1866 45 AD650TYHHLBOX AD650TYHA44HL
A8-6500 2013

6/4

3.5 4.1 8570D 800 409.6 65 AD6500OKHLBOX AD6500OKA44HL
A8-6500B AD650BOKA44HL
A8-6600K 3.9 4.2 844 432.1 100 AD660KWOHLBOX AD660KWOA44HL
A10-6700T Sep 18, 2013 2.5 3.5 8650D 384:24:8
4 CU
720 552.9 1866 45 AD670TYHHLBOX AD670TYHA44HL
A10-6700 2013

6/4

3.7 4.3 8670D 844 648.1 65 AD6700OKHLBOX AD6700OKA44HL
A10-6790B Oct 29, 2013 4.0 100 AD679KWOHLBOX AD679KWOA44HL
A10-6790K Oct 28, 2013 AD679BWOA44HL
A10-6800K 2013

6/4

4.1 4.4 2133 AD680KWOHLBOX AD680KWOA44HL
A10-6800B AD680BWOA44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini" (2013, SoC)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket AM1, aka Socket FS1b (AM1 platform)
  • 2 to 4 CPU Cores (Jaguar (microarchitecture))
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
  • GPU based on Graphics Core Next (GCN)
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Box Number Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

L3
Athlon X4 530 ? 28nm A1 4 (4) 2 32 KB inst.
32 KB data

per core
2 N/A N/A ? 25 AD530XJAH44HM
Athlon X4 550 2.2 AD550XJAH44HM
Sempron 2650 April 9, 2014 2 (2) 1.45 1 R3 (HD 8240) 128:8:4
2 CU
400 102.4 1333 (Single channel only) SD2650JAHMBOX SD2650JAH23HM
Sempron 3850 4 (4) 1.30 2 R3 (HD 8280) 450 115.2 1600 (Single channel only) SD3850JAHMBOX SD3850JAH44HM
Athlon 5150 1.60 R3 (HD 8400) 600 153.6 AD5150JAHMBOX AD5150JAH44HM
Athlon 5350 2.05 AD5350JAHMBOX AD5350JAH44HM
Athlon 5370 Feb, 2016 2.20 AD5370JAH44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kaveri" (2014) & "Godavari" (2015)[]

  • Fabrication 28 nm by GlobalFoundries.
  • Socket FM2+,[40] support for PCIe 3.0.
  • Two or four CPU cores based on the Steamroller microarchitecture.
    • Kaveri refresh models have codename Godavari.[41]
  • Die Size: 245 mm2, 2.41 Billion transistors.[42]
  • L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
  • Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture;[43] 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs).
  • Heterogeneous System Architecture-enabled zero-copy through pointer passing.
  • SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.[44]
  • Dual-channel (2× 64 Bit) DDR3 memory controller.
  • Integrated custom ARM Cortex-A5 co-processor[45] with TrustZone Security Extensions[46] in select APU models, except the Performance APU models.[47]
  • Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.[48]
  • Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.[49]
Model Release
date
Fab Step. CPU GPU DDR3

Memory support

TDP

(W)

Box Number Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

Athlon X2 450[38] Jul 31, 2014 28nm KV-A1 [1]2 3.5 3.9 96 KB inst.
per module

16 KB data
per core
1 N/A 1866 65 AD450XYBI23JA
Athlon X4 830 Q1 2018 [2]4 3.0 3.4
2MB
2133 AD830XYBI44JA
Athlon X4 840[38] Aug 2014 3.1 3.8 AD840XYBJABOX AD840XYBI44JA
Athlon X4 850 Q2 2015 GV-A1 3.2 AD835XACI43KA
Athlon X4 860K Aug 2014 KV-A1 3.7 4.0 95 AD860KXBJABOX
AD860KWOHLBOX
AD860KXBJASBX
AD860KXBI44JA
Athlon X4 870K Dec 2015 GV-A1 3.9 4.1 AD870KXBJCSBX AD870KXBI44JC
Athlon X4 880K Mar 1, 2016 4.0 4.2 AD880KXBJCSBX
FX-770K[50] Dec 2014 KV-A1 3.5 3.9 2133 65 FD770KYBI44JA
A4 PRO-7350B Jul 31, 2014 [1]2 3.4 3.8 1 R5 192:12:8
3 CU
514 197.3 1866 65 AD735BYBI23JA
PRO A4-8350B Sep 29, 2015 3.5 3.9 256:16:8
4 CU
757 387.5 AD835BYBI23JC
A6-7400K Jul 31, 2014 3.5 3.9 756 387 AD740KYBJABOX AD740KYBI23JA
A6 PRO-7400B AD740BYBI23JA
A6-7470K Feb 2, 2016 GV-A1 3.7 4.0 800 409.6 2133 AD747KYBJCBOX AD747KYBI23JC
PRO A6-8550B Sep 29, 2015 AD855BYBI23JC
A8-7500[51][52] 2014/? KV-A1 [2]4 3.0 3.7
2MB
R7 384:24:8
6 CU
720 552.9 2133 65 AD7500YBI44JA
A8-7600 Jul 31, 2014 3.1 3.8 AD7600YBJABOX AD7600YBI44JA
A8 PRO-7600B AD760BYBI44JA
A8-7650K Jan 7, 2015 3.3 95 AD765KXBJABOX
AD765KXBJASBX
AD765KXBI44JA
A8-7670K Jul 20, 2015 GV-A1 3.6 3.9 757 581.3 AD767KXBJCSBX
AD767KXBJCBOX
AD767KXBI44JC
PRO A8-8650B Sep 29, 2015 3.2 65 AD865BYBI44JC
A10-7700K Jan 14, 2014 KV-A1 3.4 3.8 720 552.9 95 AD770KXBJABOX AD770KXBI44JA
A10-7800 Jul 31, 2014 3.5 3.9 512:32:8
8 CU
737.2 65 AD7800YBJABOX AD7800YBI44JA
A10 PRO-7800B AD780BYBI44JA
A10-7850K Jan 14, 2014 3.7 4.0 95 AD785KXBJABOX AD785KXBI44JA
A10 PRO-7850B Jul 31, 2014 AD785BXBI44JA
A10-7860K Feb 2, 2016 GV-A1 3.6 757 775.1 65 AD786KYBJABOX
AD786KYBJCSBX
AD786KYBI44JC
A10-7870K May 28, 2015 3.9 4.1 866 886.7 95 AD787KXDJCBOX
AD787KXDJCSBX
AD787KXDI44JC
A10-7890K Mar 1, 2016 4.1 4.3 AD789KXDJCHBX AD789KXDI44JC
PRO A10-8750B Sep 29, 2015 3.6 4.0 757 775.1 65 AD875BYBI44JC
PRO A10-8850B 3.9 4.1 800 819.2 95 AD885BXBI44JC
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2016)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket FM2+, AM4, support for PCIe 3.0
  • Two or four CPU cores based on the Excavator microarchitecture
  • Die Size: 250.04 mm2, 3.1 Billion transistors[53]
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • Dual-channel DDR3 or DDR4 memory controller
  • Third Generation GCN based GPU
  • Integrated custom ARM Cortex-A5 co-processor[45] with TrustZone Security Extensions[46][47]
Model Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Box Number[a] Part number
[Modules/FPUs]

Cores/threads

Freq.(GHz) Cache[b] Model Config Clock

(MHz)

GFLOPS[c]
Base Turbo
L1 L2

(MB)

Athlon X4 835 ? 28nm CZ-A1 FM2+ [2]4 3.1 96 KB inst.
per module

32 KB data
per core

1MB

N/A 2133 65 AD835XACI43KA
Athlon X4 845 Feb 2, 2016 3.5 3.8 AD845XYBJCSBX
AD845XACKASBX
AD845XACI43KA
A6-7480[54] Oct 2018 [1]2 1 R5 384:24:8
6 CU
900 691.2 AD7480ACABBOX AD7480ACI23AB
A8-7680[55] [2]4

1MB

R7 AD7680ACABBOX AD7680ACI43AB
PRO A6-8570E Oct 2016 AM4 [1]2 3.0 3.4 1 R5 256:16:4
4 CU
800 409.6 2400 35 AD857BAHM23AB
PRO A6-8570 3.5 3.8 384:24:6
6 CU
1029 790.2 65 AD857BAGM23AB
PRO A10-8770E [2]4 2.8 3.5

1MB

R7 847 650.4 35 AD877BAHM44AB
PRO A10-8770 3.5 3.8 1029 790.2 65 AD877BAGM44AB
PRO A12-8870E 2.9 512:32:8
8 CU
900 921.6 35 AD887BAHM44AB
PRO A12-8870 3.7 4.2 1108 1134.5 65 AD887BAUM44AB
  1. ^ With cooler if available.
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket AM4, support for PCIe 3.0
  • Two or four "Excavator+" CPU cores
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
  • PCI Express 3.0 x4 as link to optional external chipset
  • 4x USB 3.1 Gen 1
  • Storage: 2x SATA and 2x NVMe or 2x PCI Express
  • Third Generation GCN based GPU[56] with hybrid VP9 decoding
Model Released Fab Stepping CPU GPU DDR4

Memory
support

TDP

(W)

Stock Cooler (box)[a] Box Number[b] Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[c] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[d]
L1 L2 L3
Athlon X4 940 July 27, 2017 28nm BR-A1 [2]4 3.2 3.6 96 KB inst.
per module

32 KB data
per core
2× 1 MB N/A N/A 2400 65 Near-Silent 65 W AD940XAGABBOX AD940XAGM44AB
Athlon X4 950 3.5 3.8 AD950XAGABBOX AD950XAGM44AB
Athlon X4 970 3.8 4.0 AD970XAUABBOX AD970XAUM44AB
A6-9500E September 5, 2016 [1]2 3.0 3.4 1× 1 MB R5 256:16:4
4 CU
800 409.6 35 Near-Silent 65 W AD9500AHABBOX AD9500AHM23AB
PRO A6-9500E October 3, 2016 ? ? ?
A6-9400 March 16, 2019 3.4 3.7 192:12:4
3 CU
720 276.4 65 Z7LH01R201 AD9400AGABBOX
A6-9500 September 5, 2016 3.5 3.8 384:24:6
6 CU
1029 790.2 Near-Silent 65 W AD9500AGABBOX AD9500AGM23AB
PRO A6-9500 October 3, 2016 ? ? ?
A6-9550 July 27, 2017 3.8 4.0 256:16:4
4 CU
800 409.6 Near-Silent 65 W AD9550AGABBOX D9550AGM23AB
A8-9600 September 5, 2016 [2]4 3.1 3.4 2× 1 MB R7 384:24:6
6 CU
900 691.2 65 Near-Silent 65 W AD9600AGABBOX AD9600AGM44AB
PRO A8-9600 October 3, 2016 ? ? ?
A10-9700E September 5, 2016 3.0 3.5 847 650.4 35 Near-Silent 65 W AD9700AHABBOX AD9700AHM44AB
PRO A10-9700E October 3, 2016 ? ? ?
A10-9700 September 5, 2016 3.5 3.8 1029 790.2 65 Near-Silent 65 W AD9700AGABBOX D9700AGM44AB
PRO A10-9700 October 3, 2016 ? ? ?
A12-9800E September 5, 2016 3.1 3.8 512:32:8[57]
8 CU
900 921.6 35 Near-Silent 65 W AD9800AHABBOX AD9800AUM44AB
PRO A12-9800E October 3, 2016 ? ? ?
A12-9800 September 5, 2016 3.8 4.2 1108 1134.5 65 Near-Silent 65 W AD9800AUM44AB
PRO A12-9800 October 3, 2016 ? ? ?
  1. ^ A box without cooler might also be available (WOF).
  2. ^ With cooler if available.
  3. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  4. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2018)[]

  • Fabrication 14 nm by GlobalFoundries
  • Transistors: 4.94 billion
  • Die size: 210 mm²
  • Socket AM4
  • Zen CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • Fifth generation GCN based GPU
  • Video Core Next (VCN) 1.0
Model Release Date
& Price
Process CPU GPU Socket PCIe lanes Memory
support
TDP Stock cooler (box)[a] Box Number Part Number
Cores
(threads)
Clock rate (GHz) Cache[i] Model Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Athlon 200GE[59] September 6, 2018
US $55
GloFo
14LP
2 (4) 3.2 N/A 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:4
3 CU
1000 MHz 384 AM4 16 (8+4+4) DDR4-2666
dual-channel
35 W Basic Stock Cooler YD200GC6FBBOX YD200GC6M2OFB

YD20GGC6M2OFB

Athlon Pro 200GE[60] September 6, 2018
OEM
N/A N/A YD200BC6M2OFB
Athlon 220GE[61] December 21, 2018
US $65
3.4 Basic Stock Cooler YD220GC6FBBOX YD220GC6M2OFB
Athlon 240GE[62] December 21, 2018
US $75
3.5 YD240GC6FBBOX YD240GC6M2OFB
Athlon 3000G[63] November 19, 2019

US $49

1100 MHz 424.4 YD3000C6FHBOX YD3000C6M2OFH
Athlon 300GE[64] July 7, 2019

OEM

3.4 N/A N/A YD30GEC6M2OFH
Athlon Silver 3050GE[65] July 21, 2020

OEM

YD305GC6M2OFH
Ryzen 3 2200GE[66] April 19, 2018
OEM
4 (4) 3.2 3.6 Vega 8 512:32:16
8 CU
1126 DDR4-2933
dual-channel
YD2200C6M4MFB
Ryzen 3 Pro 2200GE[67] May 10, 2018
OEM
YD220BC6M4MFB
Ryzen 3 2200G February 12, 2018
US $99
3.5 3.7 45–65 W Wraith Stealth YD2200C5FBBOX YD2200C5M4MFB
Ryzen 3 Pro 2200G[68] May 10, 2018
OEM
N/A N/A YD220BC5M4MFB
Ryzen 5 2400GE[69] April 19, 2018
OEM
4 (8) 3.2 3.8 RX Vega 11 704:44:16 1250 MHz 1760 35 W YD2400C6M4MFB
Ryzen 5 Pro 2400GE[70] May 10, 2018
OEM
YD240BC6M4MFB
Ryzen 5 2400G[71] February 12, 2018[72][73]
US $169
3.6 3.9 45–65 W Wraith Stealth YD2400C5FBBOX YD2400C5M4MFB
Ryzen 5 Pro 2400G[74] May 10, 2018
OEM
N/A N/A YD240BC5M4MFB
  1. ^ AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.[58]
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)[]

  • Fabrication 12 nm by GlobalFoundries
  • Transistors: 4.94 billion
  • Die size: 210 mm²
  • Socket AM4
  • Zen+ CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • Fifth generation GCN based GPU
  • Video Core Next (VCN) 1.0
Model Release Date
& Price
Fab CPU GPU Socket PCIe lanes Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Architecture Config[i] Clock Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 300GE[75] September 30, 2019
OEM
12 nm 2 (4) 3.4 N/A 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB GCN 5th gen 192:12:4
3 CU
1100 MHz 424.4 AM4 16 (8+4+4) DDR4-2667
dual-channel
35 W
Athlon Silver Pro 3125GE[76] July 21, 2020
OEM
Athlon Gold 3150GE[77] 4 (4) 3.3 3.8 DDR4-2933
dual-channel
Athlon Gold Pro 3150GE[78]
Athlon Gold 3150G[79] 3.5 3.9 45-65 W
Athlon Gold Pro 3150G[80]
Ryzen 3 3200GE[81] July 7, 2019
OEM
3.3 3.8 512:32:16
8 CU
1200 MHz 1228.8 35 W
Ryzen 3 Pro 3200GE[82] September 30, 2019
OEM
Ryzen 3 3200G[83] July 7, 2019
US $99
3.6 4.0 1250 MHz 1280 45-65 W
Ryzen 3 Pro 3200G[84] September 30, 2019
OEM
Ryzen 5 3350GE July 21, 2020
OEM
4 (8) 3.3 3.9 704:44:16
11 CU
1200 MHz 35 W
Ryzen 5 Pro 3350GE[85]
Ryzen 5 3350G 3.6 4.0 1300 MHz 1830.4 45-65 W
Ryzen 5 Pro 3350G[86]
Ryzen 5 3400GE[87] July 7, 2019
OEM
3.3 4.0 35 W
Ryzen 5 Pro 3400GE[88] September 30, 2019
OEM
Ryzen 5 3400G[89] July 7, 2019
US $149
3.7 4.2 1400 MHz 1971.2 45-65 W
Ryzen 5 Pro 3400G[90] September 30, 2019
OEM
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


"Renoir" (2020)[]

  • Fabrication 7 nm by TSMC
  • Socket AM4
  • Up to eight Zen 2 CPU cores
  • Dual-channel DDR4 memory controller
Model Release date
and price
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Core Config[i] Clock rate (GHz) Cache Architecture Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 4300GE[note 1][91] July 21, 2020
OEM only
TSMC
7FF
4 (8) 1 × 4 3.5 4.0 32 KB inst.
32 KB data
per core
512 KB
per core
4 MB GCN 5th gen 384:24:8
6 CU
1700 MHz 1305.6 AM4 PCIe 3.0 ×24
16+4+4
DDR4-3200
dual-channel
35 W
Ryzen 3 4300G[note 1][91] 3.8 4.0 65 W
Ryzen 5 4600GE[note 1][91] 6 (12) 2 × 3 3.3 4.2 8 MB
4 MB per CCX
448:28:8
7 CU
1900 MHz 1702.4 35 W
Ryzen 5 4600G[note 1][91] 3.7 4.2 65 W
Ryzen 7 4700GE[note 1][91] 8 (16) 2 × 4 3.1 4.3 512:32:8
8 CU
2000 MHz 2048 35 W
Ryzen 7 4700G[note 1][91] 3.6 4.4 2100 MHz 2150.4 65 W
  1. ^ Core complexes (CCXs) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version[91].


"Cezanne" (2021)[]

  • Fabrication 7 nm by TSMC
  • Socket AM4
  • Up to eight Zen 3 CPU cores
  • Dual-channel DDR4 memory controller
Model Release date
& price
Fab CPU GPU Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Architecture Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 5300GE[note 1][92] 13 April 2021[93]
OEM
TSMC
7FF
4 (8) 1 × 4 3.6 4.2 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5th gen 384:24:8
6 CU
1700 MHz 1305.6 DDR4-3200
dual-channel
35 W
Ryzen 3 5300G[note 1][94] 4.0 65 W
Ryzen 5 5600GE[note 1][95] 6 (12) 1 × 6 3.4 4.4 16 MB 448:28:8
7 CU
1900 MHz 1702.4 35 W
Ryzen 5 5600G[note 1][96] 13 April 2021[93]
OEM
5 August 2021
US $259[97]
3.9 65 W
Ryzen 7 5700GE[note 1][98] 13 April 2021[93]
OEM
8 (16) 1 × 8 3.2 4.6 512:32:8
8 CU
2000 MHz 2048 35 W
Ryzen 7 5700G[note 1][99] 13 April 2021[93]
OEM
5 August 2021
US $359[97]
3.8 65 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f Model also available as PRO version[100][101][102][103][104][105], released 1 June 2021[106].


Server APUs[]

Opteron X2100-series "Kyoto" (2013)[]

  • Fabrication 28 nm
  • Socket FT3 (BGA)
  • 4 CPU Cores (Jaguar (microarchitecture))
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • Turbo Dock Technology, C6 and CC6 low power states
  • GPU based on GCN (Graphics Core Next) architecture
Model Released Fab Stepp. CPU GPU Memory
support
TDP

(W)

Part number Release
price

(USD)

Cores
(threads)
Clock

(GHz)

Cache[b] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[c]
L1 L2

(MB)

X1150 May 2013 28nm KB-A1 4 (4) 2.0 32 KB inst.
32 KB data

per core
2 N/A DDR3 9 $64
X2150 1.9 HD 8400 128:8:4 266 28.9 22 OX2150IAJ44HM $99
X2170 September 2016 2.4 600 153.6 DDR3 25 OX2170IXJ44JB
  1. ^ A box without cooler might also be available (WOF).
  2. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  3. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Opteron X3000-series "Toronto" (2017)[]

  • Fabrication 28 nm
  • Socket
  • Two or Four CPU cores based on the Excavator microarchitecture[107][108]
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
  • DDR4 SDRAM
  • GPU based on 3rd Generation GCN (Graphics Core Next) architecture
Model Released Fab Step. CPU GPU DDR4

Memory
support

TDP

(W)

Part number Release
price (USD)
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(GHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

X3216 Q2 2017 28nm 01h 2 (2) 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
0.8 409.6 1600 12-

15

Un­known OEM for HP
X3418 4 (4) 1.8 3.2 2 R7 384:24:6
6 CU
614.4 2400 12-

35

X3421 2.1 3.4 512:32:8
8 CU
819.2
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile APUs[]

Sabine: "Llano" (2011)[]

  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1
  • Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
  • L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
  • Integrated PCIe 2.0 controller
  • GPU: TeraScale 2
  • Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
  • Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
  • 2.5 GT/s UMI
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2 L3
E2-3000M 2011

6/14

32nm B0 2 (2) 1.8 2.4 64 KB inst.
64 KB data

per core
2× 512KB N/A HD 6380G 160:8:4 400 128 1333 35 EM3000DDX22GX
A4-3300M 2011

6/14

1.9 2.5 2× 1MB HD 6480G 240:12:4 444 213.1 35 AM3300DDX23GX
A4-3305M Dec 7, 2011 2× 512KB 160:8:4 593 189.7 AM3305DDX22GX
A4-3310MX 2011

6/14

2.1 2× 1MB 240:12:4 444 213.1 45 AM3310HLX23GX
A4-3320M Dec 7, 2011 2.0 2.6 35 AM3320DDX23GX
A4-3330MX 2.2 45 AM3330HLX23GX
A4-3330MX 2.3 2× 512KB 160:8:4 593 189.7 AM3330HLX23HX
A6-3400M 2011

6/14

4 (4) 1.4 2.3 4× 1MB HD 6520G 320:16:8 400 256 35 AM3400DDX43GX
A6-3410MX 1.6 1600 45 AM3410HLX43GX
A6-3420M Dec 7, 2011 1.5 2.4 1333 35 AM3420DDX43GX
A6-3430MX 1.7 1600 45 AM3430HLX43GX
A8-3500M 2011

6/14

1.5 2.4 HD 6620G 400:20:8 444 355.2 1333 35 AM3500DDX43GX
A8-3510MX 1.8 2.5 1600 45 AM3510HLX43GX
A8-3520M Dec 7, 2011 1.6 1333 35 AM3520DDX43GX
A8-3530MX 2011

6/14

1.9 2.6 1600 45 AM3530HLX43GX
A8-3550MX Dec 7, 2011 2.0 2.7 AM3550HLX43GX
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Comal: "Trinity" (2012)[]

An AMD A10-4600M APU
  • Fabrication 32 nm on GlobalFoundries SOI process
  • Socket FS1r2, FP2
  • Based on the Piledriver architecture
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • GPU: TeraScale 3 (VLIW4)
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI
  • Transistors: 1.303 billion
  • Die size: 246 mm²
Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-4355M Sep 27, 2012 32nm TN-A1 FP2 [1]2 1.9 2.4 64 KB inst.
per module

16 KB data
per core
1 HD 7400G 192:12:4
3 CU
327 424 125.5 1333 17 AM4355SHE23HJ
A6-4455M May 15, 2012 2.1 2.8 2 HD 7500G 256:16:8
4 CU
167.4 AM4455SHE24HJ
A8-4555M Sep 27, 2012 [2]4 1.6 2.4

2MB

HD 7600G 384:24:8
6 CU
320 245.7 19 AM4555SHE44HJ
A8-4557M[109] Mar

2013

1.9 2.8 HD 7000 256:16:8
4 CU
497 655 254.4 (L)1600 35 AM4557DFE44HJ
A10-4655M May 15, 2012 2.0 2.8 HD 7620G 384:24:8
6 CU
360 496 276.4 1333 25 AM4655SIE44HJ
A10-4657M[109] Mar

2013

2.3 3.2 HD 7000 497 686 381.6 (L)1600 35 AM4657DFE44HJ
A4-4300M May 15, 2012 FS1 [1]2 2.5 3.0 1 HD 7420G 128:8:4
2 CU
480 655 122.8 1600 AM4300DEC23HJ
A6-4400M 2.7 3.2 HD 7520G 192:12:4
3 CU
496 685 190.4 AM4400DEC23HJ
A8-4500M [2]4 1.9 2.8

2MB

HD 7640G 256:16:8
4 CU
253.9 AM4500DEC44HJ
A10-4600M 2.3 3.2 HD 7660G 384:24:8
6 CU
380.9 AM4600DEC44HJ
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Richland" (2013)[]

Model number Released Fab Step. Socket CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A4-5145M 2013/5 32nm RL-A1 FP2 [1]2 2.0 2.6 64 KB inst.
per module

16 KB data
per core
1 HD 8310G 128:8:4
2 CU
424 554 108.5 (L)1333 17 AM5145SIE44HL
A6-5345M 2.2 2.8 HD 8410G 192:12:4
3 CU
450 600 172.8 AM5345SIE44HL
A8-5545M [2]4 1.7 2.7 4 HD 8510G 384:28:8
6 CU
554 345.6 19 AM5545SIE44HL
A10-5745M 2.1 2.9 HD 8610G 533 626 409.3 25 AM5745SIE44HL
A4-5150M 2013 Q1 FS1 [1]2 2.7 3.3 1 HD 8350G 128:8:4
2 CU
533 720 136.4 1600 35 AM5150DEC23HL
A6-5350M 2.9 3.5 HD 8450G 192:12:4
3 CU
204.6 AM5350DEC23HL
A6-5357M 2013/5 (L)1600 AM5357DFE23HL
A8-5550M 2013 Q1 [2]4 2.1 3.1 4 HD 8550G 256:16:8
4 CU
515 263.6 1600 AM5550DEC44HL
A8-5557M 2013/5 554 283.6 (L)1600 AM5557DFE44HL
A10-5750M 2013 Q1 2.5 3.5 HD 8650G 384:24:8
6 CU
533 409.3 1866 AM5750DEC44HL
A10-5757M 2013/5 600 460.8 (L)1600 AM5757DFE44HL
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

"Kaveri" (2014)[]

Model number Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-7000 June 2014 28nm [1]2 2.2 3.0 96 KB inst.
per module

16 KB data
per core
1 R4 192:12:3
3 CU
494 533 189.6 1333 17 AM7000ECH23JA
A6 Pro-7050B 533 N/A 204.6 1600 AM705BECH23JA
A8-7100 [2]4 1.8 3.0 2× 2 MB R5 256:16:4
4 CU
450 514 230.4 1600 20 AM7100ECH44JA
A8 Pro-7150B 1.9 3.2 553 N/A 283.1 AM715BECH44JA
A10-7300 R6 384:24:8
6 CU
464 533 356.3 AM7300ECH44JA
A10 Pro-7350B 2.1 3.3 533 N/A 424.7 AM735BECH44JA
FX-7500 R7 498 553 382.4 FM7500ECH44JA
A8-7200P 2.4 3.3 R5 256:16:4
4 CU
553 626 283.1 1866 35 AM740PDGH44JA
A10-7400P 2.5 3.4 R6 384:24:8
6 CU
576 654 442.3 AM740PDGH44JA
FX-7600P 2.7 3.6 R7 512:32:8
8 CU
600 686 614.4 2133 FM760PDGH44JA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Carrizo" (2015)[]

  • Fabrication 28 nm
  • Socket FP4
  • Up to 4 Excavator x86 CPU cores
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • GPU based on Graphics Core Next 1.2
Model number Released Fab CPU GPU DDR

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

A6-8500P June 2015 28nm [1]2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 3)1600 12-

35

AM850PAAY23KA
Pro A6-8500B AM850BAAY23KA
Pro A6-8530B Q3 2016 2.3 3.2 4)1866 AM853BADY23AB
A8-8600P June 2015 [2]4 1.6 3.0

1MB

R6 384:24:8
6 CU
720 552.9 3)2133 AM860PAAY43KA
Pro A8-8600B AM860BAAY43KA
A10-8700P 1.8 3.2 800 614.4 AM870PAAY43KA
Pro A10-8700B AM870BAAY43KA
Pro A10-8730B Q3 2016 2.4 3.3 R5 720 552.9 4)1866 AM873BADY44AB
A10-8780P December 2015 2.0 3.3 R8 512:32:8
8 CU
3)? AM878PAIY43KA
FX-8800P June 2015 2.1 3.4 R7 800 819.2 4)2133 FM880PAAY43KA
Pro A12-8800B FM880BAAY43KA
Pro A12-8830B Q3 2016 2.5 3.4 384:24:8
6 CU
758 582.1 4)1866 AM883BADY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bristol Ridge" (2016)[]

  • Fabrication 28 nm
  • Socket FP4[113]
  • Two or four "Excavator+" x86 CPU cores
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • GPU based on Graphics Core Next 1.2 with VP9 decoding
Model number Released Fab CPU GPU DDR4

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

Pro A6-9500B October 24, 2016 28nm [1]2 2.3 3.2 96 KB inst.
per module

32 KB data
per core
1 R5 256:16:4
4 CU
800 409.6 1866 12-

15

Pro A8-9600B October 24, 2016 [2]4 2.4 3.3 2× 1 MB R5 384:24:6
6 CU
720 552.9 1866 12–

15

A10-9600P June 2016 AM960PADY44AB
A10-9620P[114] 2017 (OEM) 2.5 3.4 758 582.1
Pro A10-9700B October 24, 2016 R7
A12-9700P June 2016 AM970PADY44AB
Pro A8-9630B October 24, 2016 2.6 3.3 R5 800 614.4 2400 25–

45

A10-9630P June 2016 AM963PAEY44AB
Pro A10-9730B October 24, 2016 2.8 3.5 R7 900 691.2
A12-9730P June 2016 AM973PAEY44AB
Pro A12-9800B October 24, 2016 2.7 3.6 R7 512:32:8
8 CU
758 776.1 1866 12–

15

FX-9800P
A12-9720P[115][116]
June 2016
2017 (OEM)
FM980PADY44AB
?
Pro A12-9830B October 24, 2016 3.0 3.7 900 921.6 2400 25–

45

FX-9830P June 2016 FM983PAEY44AB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Raven Ridge" (2017)[]

  • Fabrication 14 nm by GlobalFoundries
  • Transistors: 4.94 billion
  • Socket FP5
  • Die size: 210 mm²
  • Zen CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Fifth generation GCN based GPU
Model Release
date
Fab CPU GPU Socket PCIe lanes Memory support TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Athlon Pro 200U [117] 2019 GloFo
14LP
2 (4) 2.3 3.2 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 3 192:12:4
3 CU
1000 MHz 384 FP5 12 (8+4) DDR4-2400
dual-channel
12–25 W
Athlon 300U [118] January 6, 2019 2.4 3.3
Ryzen 3 2200U [119] January 8, 2018 2.5 3.4 1100 MHz 422.4
Ryzen 3 3200U [120] January 6, 2019 2.6 3.5 1200 MHz 460.8
Ryzen 3 2300U [121] January 8, 2018 4 (4) 2.0 3.4 Vega 6 384:24:8
6 CU
1100 MHz 844.8
Ryzen 3 Pro 2300U [122] May 15, 2018
Ryzen 5 2500U [123] October 26, 2017 4 (8) 3.6 Vega 8 512:32:16
8 CU
1126.4
Ryzen 5 Pro 2500U [124] May 15, 2018
Ryzen 5 2600H [125] September 10, 2018 3.2 DDR4-3200
dual-channel
35–54 W
Ryzen 7 2700U [126] October 26, 2017 2.2 3.8 Vega 10 640:40:16
10 CU
1300 MHz 1664 DDR4-2400
dual-channel
12–25 W
Ryzen 7 Pro 2700U [127] May 15, 2018
Ryzen 7 2800H [128] September 10, 2018 3.3 Vega 11 704:44:16
11 CU
1830.4 DDR4-3200
dual-channel
35–54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


"Picasso" (2019)[]

  • Fabrication 12 nm by GlobalFoundries
  • Socket FP5
  • Die size: 210 mm²
  • Up to four Zen+ CPU cores
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual-channel DDR4 memory controller
  • Fifth generation GCN based GPU
Model Release
date
Fab CPU GPU Memory support TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
Ryzen 3 3300U[129] January 6, 2019 GloFo
12LP (14LP+)
4 (4) 2.1 3.5 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB Vega 6 384:24:8
6 CU[130]
1200 MHz 921.6 DDR4-2400
dual-channel
15 W
Ryzen 3 PRO 3300U[131] April 8, 2019
Ryzen 3 3350U[132] January 6, 2019
Ryzen 5 3450U[133] June 2020 4 (8) Vega 8 512:32:16
8 CU[134]
1228.8
Ryzen 5 3500U[135] January 6, 2019 3.7
Ryzen 5 PRO 3500U[136] April 8, 2019
Ryzen 5 3500C[137] September 22, 2020
Ryzen 5 3550H[138] January 6, 2019 35 W
Ryzen 5 3580U[139] October 2019 Vega 9 576:36:16
9 CU
1300 MHz 1497.6 15 W
Ryzen 7 3700U[140] January 6, 2019 2.3 4.0 Vega 10 640:40:16
10 CU[141]
1400 MHz 1792.0
Ryzen 7 PRO 3700U[142] April 8, 2019
Ryzen 7 3700C[143] September 22, 2020
Ryzen 7 3750H[144] January 6, 2019 35 W
Ryzen 7 3780U[145] October 2019 Vega 11 704:44:16
11 CU
1971.2 15 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


"Renoir" (2020)[]

  • Fabrication 7 nm by TSMC[146][147][148]
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7nm monolithic die[149]
  • Up to eight Zen 2 CPU cores
  • Fifth generation GCN based GPU (7nm Vega)
Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Architecture Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 4300U[note 1][150][151] March 16, 2020 TSMC
7FF
4 (4) 1 × 4 2.7 3.7 32 KB inst.
32 KB data
per core
512 KB
per core
4 MB GCN 5th gen 320:20:8
5 CU
1400 MHz 896 FP6 16 (8+4+4) DDR4-3200
LPDDR4-4266
dual-channel
10–25 W
Ryzen 5 4500U[152][153] 6 (6) 2 × 3 2.3 4.0 8 MB
4 MB per CCX
384:24:8
6 CU
1500 MHz 1152
Ryzen 5 4600U[note 1][154] 6 (12) 2.1
Ryzen 5 4680U[155] April 13, 2021 448:28:8
7 CU
1344
Ryzen 5 4600HS[156] March 16, 2020 3.0 384:24:8
6 CU
1152 35 W
Ryzen 5 4600H[157][158] 35–54 W
Ryzen 7 4700U[note 1][159] 8 (8) 2 × 4 2.0 4.1 448:28:8
7 CU
1600 MHz 1433.6 10–25 W
Ryzen 7 4800U[160] 8 (16) 1.8 4.2 512:32:8
8 CU
1750 MHz 1792
Ryzen 7 4980U[161] April 13, 2021 2.0 4.4 1950 MHz 1996.8
Ryzen 7 4800HS[162] March 16, 2020 2.9 4.2 448:28:8
7 CU
1600 MHz 1433.6 35 W
Ryzen 7 4800H[163][164] 35–54 W
Ryzen 9 4900HS[165] 3 4.3 512:32:8
8 CU
1750 MHz 1792 35 W
Ryzen 9 4900H[166] 3.3 4.4 35–54 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[167][168][169], released May 7, 2020.


"Lucienne" (2021)[]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 156 mm²
  • 9.8 billion transistors on one single 7nm monolithic die[citation needed]
  • Up to eight Zen 2 CPU cores
  • Fifth generation GCN based GPU (7nm Vega)
Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Architecture Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 5300U[170] January 12, 2021 TSMC
7FF
4 (8) 1 × 4 2.6 3.8 32 KB inst.
32 KB data
per core
512 KB
per core
4 MB GCN 5th gen 384:24:8
6 CU
1500 MHz 1152 FP6 16
(8+4+4)
DDR4-3200
LPDDR4-4266
dual-channel
10–25 W
Ryzen 5 5500U[171][172] 6 (12) 2 × 3 2.1 4.0 8 MB
4 MB per CCX
448:28:8
7 CU
1800 MHz 1612.8
Ryzen 7 5700U[173] 8 (16) 2 × 4 1.8 4.3 512:32:8
8 CU
1900 MHz 1945.6
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


"Cezanne" (2021)[]

  • Fabrication 7 nm by TSMC
  • Socket FP6
  • Die size: 180 mm²
  • Up to eight Zen 3 CPU cores
  • Fifth generation GCN based GPU (7nm Vega)
Model Release
date
Fab CPU GPU Socket PCIe
lanes
Memory support TDP
Cores
(threads)
Core config[i] Clock rate (GHz) Cache Architecture Config[ii] Clock Processing
power
(GFLOPS)[iii]
Base Boost L1 L2 L3
Ryzen 3 5400U[note 1][174][175] January 12, 2021 TSMC
7FF
4 (8) 1 × 4 2.6 4.0 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5th gen 320:20:8
6 CU
1600 MHz 1228.8 FP6 16 (8+4+4)
PCIe 3.0
DDR4-3200
LPDDR4-4266
dual-channel
10–25 W
Ryzen 5 5500U (zen2) 6 (12) 1 × 6 2.1 448:28:8
7 CU
1800 MHz 1612.8
Ryzen 5 5600U[note 1][176] 2.3 4.2 16 MB 10-25 W
Ryzen 5 5600H[177][178] 3.3 35–54 W
Ryzen 5 5600HS[179] 3.0 35 W
Ryzen 7 5800U[note 1][180] 8 (16) 1 × 8 1.9 4.4 512:32:8
8 CU
2000 MHz 2048 10–25 W
Ryzen 7 5800H[181][182] 3.2 35–54 W
Ryzen 7 5800HS[183] 2.8 35 W
Ryzen 9 5900HS[184] 3.0 4.6 2100 MHz 2150.4
Ryzen 9 5900HX[185] 3.3 35–54 W
Ryzen 9 5980HS[186] 3.0 4.8 35 W
Ryzen 9 5980HX[187] 3.3 35–54 W
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[188][189][190], released on March 16, 2021.


Ultra-mobile APUs[]

Brazos: "Desna", "Ontario", "Zacate" (2011)[]

  • Fabrication 40 nm by TSMC
  • Socket FT1 (BGA-413)
  • Based on the Bobcat microarchitecture[191]
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
  • DirectX 11 integrated graphics with UVD 3.0
  • Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
  • 2.50 GT/s UMI (PCIe 1.0 ×4)
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2
Z-01 Jun 1, 2011 40nm B0 2 (2) 1.0 N/A 32KB inst.
32KB data

per core
2× 512KB HD 6250 80:8:4 276 N/A 44.1 1066 5.9 XMZ01AFVB22GV
C-30 Jan 4, 2011 1 (1) 1.2 512KB 9 CMC30AFPB12GT
C-50 2 (2) 1.0 2× 512KB CMC50AFPB22GT
C-60 Aug 22, 2011 C0 1.33 HD 6290 400 CMC60AFPB22GV
E-240 Jan 4, 2011 B0 1 (1) 1.5 N/A 512KB HD 6310 500 N/A 80 1066 18 EME240GBB12GT
E-300 Aug 22, 2011 2 (2) 1.3

512KB

488 78 EME300GBB22GV
E-350 Jan 4, 2011 1.6 492 78.7 EME350GBB22GT
E-450 Aug 22, 2011 B0
C0
1.65 HD 6320 508 600 81.2 1333 EME450GBB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos 2.0: "Ontario", "Zacate" (2012)[]

  • Fabrication 40 nm by TSMC
  • Socket FT1 (BGA-413)
  • Based on the Bobcat microarchitecture[191]
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
  • DirectX 11 integrated graphics
  • C-series denote Ontario; and the E-series denotes Zacate
  • 2.50 GT/s UMI (PCIe 1.0 ×4)
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

GFLOPS[b]
L1 L2 L3
C-70 Sep 15, 2012 40nm C0 2 (2) 1.0 1.33 32 KB inst.
32 KB data

per core
2× 512KB N/A HD 7290 80:8:4 276 400 44.1 1066 9 CMC70AFPB22GV
E1-1200 Jun 6, 2012 C0 1.4 N/A HD 7310 500 N/A 80 1066 18 EM1200GBB22GV
E1-1500 Jan 7, 2013 1.48 529 84.6
E2-1800 Jun 6, 2012 1.7 HD 7340 523 680 83.6 1333 EM1800GBB22GV
E2-2000 Jan 7, 2013 1.75 538 700 86
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Brazos-T: "Hondo" (2012)[]

  • Fabrication 40 nm by TSMC
  • Socket FT1 (BGA-413)
  • Based on the Bobcat microarchitecture[191]
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • Found in tablet computers
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • PowerNow!
  • DirectX 11 integrated graphics
  • 2.50 GT/s UMI (PCIe 1.0 ×4)
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2
Z-60 Oct 9, 2012 40nm C0 2 (2) 1.0 32KB inst.
32KB data

per core
2× 512 KB HD 6250 80:8:4 276 44.1 1066 4.5 XMZ60AFVB22GV
  1. ^ AMD in its technical documentation uses KB, which it defines as "kilobyte" and as equal to 1024 B (i.e., 1 KiB), and MB, which it defines as "megabyte" and as equal to 1024 KB (1 MiB).[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini", "Temash" (2013)[]

  • Fabrication 28 nm by TSMC
  • Socket FT3 (BGA)
  • 2 to 4 CPU Cores (Jaguar (microarchitecture))
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • Turbo Dock Technology, C6 and CC6 low power states
  • GPU based on Graphics Core Next (GCN)
  • AMD Eyefinity multi-monitor for up to two displays

Temash, Elite Mobility APU[]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

A4-1200 May 23, 2013 28nm KB-A1 2 (2) 1.0 N/A 32 KB inst.
32 KB data

per core
1 HD 8180 128:8:4
2 CU
225 N/A 1066 4 AT1200IFJ23HM
A4-1250 HD 8210 300 1333 8 AT1250IDJ23HM
A4-1350 4 (4) 2 1066 AT1350IDJ44HM
A6-1450 1.4 HD 8250 400 AT1450IDJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Kabini, Mainstream APU[]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

L1 L2

(MB)

L3
E1-2100 May 2013 28nm KB-A1 2 (2) 1.0 32KB inst.
32KB data

per core
1 N/A HD 8210 128:8:4
2 CU
300 1333 9 EM2100ICJ23HM
E1-2200 Feb 2014 1.05 EM2200ICJ23HM
E1-2500 May 2013 1.4 HD 8240 400 15 EM2500IBJ23HM
E2-3000 1.65 HD 8280 450 1600 EM3000IBJ23HM
E2-3800 Feb 2014 4 1.3 2 EM3800IBJ44HM
A4-5000 May 2013 1.5 HD 8330 497 AM5000IBJ44HM
A4-5100 Feb 2014 1.55 AM5100IBJ44HM
A6-5200 May 2013 2.0 HD 8400 600 25 AM5200IAJ44HM
A4 Pro-3340B Nov 2014 2.2 HD 8240 400 AM334BIAJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Beema", "Mullins" (2014)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket FT3b (BGA)
  • CPU: 2 to 4 (Puma cores)
    • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • GPU based on Graphics Core Next (GCN)
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • Intelligent Turbo Boost
  • Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

Mullins, Tablet/2-in-1 APU[]

Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

L3
E1 Micro-6200T Q2 2014 28nm ML-A1 2 (2) 1.0 1.4 32 KB inst.
32 KB data

per core
1 N/A R2 128:8:4
2 CU
300 600 1066 3.95 EM620TIWJ23JB
A4 Micro-6400T 4 (4) 1.6 2 R3 350 686 1333 4.5 AM640TIVJ44JB
A10 Micro-6700T 1.2 2.2 R6 500 N/A AM670TIVJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

Beema, Notebook APU[]

Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

Turbo

(MHz)

L1 L2

(MB)

L3
E1-6010 Q2 2014 28nm ML-A1 2 (2) 1.35 N/A 32 KB inst.
32 KB data

per core
1 N/A R2 128:8:4
2 CU
300 600 (L)1333 10 EM6010IUJ23JB
E1-6015[192] Q2 2015 1.4
E2-6110 Q2 2014 4 (4) 1.5 2 (L)1600 15 EM6110ITJ44JB
A4-6210 1.8 R3 350 686 AM6210ITJ44JB
A4-6250J[193] 2.0 25
A6-6310 1.8 2.4 R4 300 800 (L)1866 15 AM6310ITJ44JB
A8-6410 2.0 R5

AM6410ITJ44JB

  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Carrizo-L" (2015)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket FT3b (BGA), FP4 (µBGA)[194]
  • CPU: 2 to 4 (Puma+ cores)
    • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • GPU based on Graphics Core Next (GCN)
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • Intelligent Turbo Boost
  • Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
  • All models except A8-7410 available in both laptop and all-in-one desktop versions
Model Released Fab Step. CPU GPU DDR3L

Memory
support

TDP

(W)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock Turbo

(MHz)

L1 L2

(MB)

E1-7010 May 2015 28nm ML-A1 2 1.5 N/A 32 KB inst.
32 KB data

per core
1 R2 128:8:4
2 CU
400 1333 10 EM7010IUJ23JB
EM7010JCY23JB
EM7010JCY23JBD
E2-7110 4 1.8 2 R2 600 1600 12–

25

EM7110ITJ44JB
EM7110JBY44JB
EM7110JBY44JBD
A4-7210 2.2 R3 686 AM7210ITJ44JB
AM7210JBY44JBD
A6-7310 2.0 2.4 R4 800 1866 AM7310ITJ44JB
AM7310JBY44JB
AM7310JBY44JBD
A8-7410 2.2 2.5 R5 847 15 AM7410JBY44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

"Stoney Ridge" (2016)[]

  • Fabrication 28 nm by GlobalFoundries
  • Socket FP4[113] / FT4
  • 2 "Excavator+" x86 CPU cores
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • Single-channel DDR4 memory controller
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
  • GPU based on Graphics Core Next 3rd Generation with VP9 decoding
Model number Released Fab CPU GPU DDR4

Memory
support

TDP

(W)

Part number
[Modules/FPUs]

Cores/threads

Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config Clock

(MHz)

GFLOPS[b]
L1 L2

(MB)

E2-9000e November 2016 28nm [1]2 1.5 2.0 96 KB inst.
per module

32 KB data
per core
1 R2 128:8:4
2 CU
600 153.6 1866 6 EM900EANN23AC
E2-9000 June 2016 1.8 2.2 10 EM9000AKN23AC
E2-9010 2.0 2.2 10–15 EM9010AVY23AC
A4-9120 Q2 2017 2.2 2.5 R3 655 167.6 2133 10–15 AM9120AYN23AC
A4-9125 Q2 2018 2.3 2.6 686 175.6 AM9125AYN23AC
A4-9120C January 6, 2019 1.6 2.4 R4 192:12:8
3 CU
600 230.4 1866 6 AM912CANN23AC
A6-9200e November 2016 1.8 2.7 2133 AM920EANN23AC
A6-9200 2.0 2.8 10 AM9200AKN23AC
A6-9210 June 2016 2.4 2.8 10–15 AM9210AVY23AC
A6-9220 Q2 2017 2.5 2.9 655 251.5 10–15 AM9220AYN23AC
A6-9225 Q2 2018 2.6 3.0 686 263.4 AM9225AYN23AC
A6-9220C January 6, 2019 1.8 2.7 R5 720 276.4 1866 6 AM922CANN23AC
A9-9400 November 2016 2.4 3.2 800 307.2 2133 10 AM9400AKN23AC
A9-9410 June 2016 2.9 3.5 10–25 AM9410AFY23AC
A9-9420 Q2 2017 3.0 3.6 847 325.2 AM9420AYN23AC
A9-9425 Q2 2018 3.1 3.7 900 345.6 AM9425AYN23AC
A9-9430[195] Q2 2017 3.2 3.5 847 325.2 2400 25 AD9430AJN23AC
Pro A4-4350B Q1 2018 2.5 2.9 655 251.5 2133 15
Pro A4-5350B Q1 2020 3.0 3.6 847 325.2
Pro A6-7350B Q1 2018
Pro A6-8350B Q1 2020 3.1 3.7 900 345.6
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Dalí", "Pollock" (2020)[]

  • Fabrication 14 nm by GlobalFoundries
  • Socket FP5 / FT5
  • Two Zen CPU cores
  • Over 30% die size reduction over predecessor (Raven Ridge)
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core


Model Release
date
Fab CPU GPU Socket PCIe lanes Memory support TDP Part number
Cores
(threads)
Clock rate (GHz) Cache Model Config[a] Clock Processing
power
(GFLOPS)[b]
Base Boost L1 L2 L3
AMD 3015e[196] July 6, 2020 14 nm 2 (4) 1.2 2.3 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB AMD Radeon(TM)

Graphics (Vega)

3 CU 600 MHz FT5 12 (8+4) DDR4-1600
single-channel
6 W AM3015BRP2OFJ
AMD 3015Ce[197] April 29, 2021 AM301CBRP2OFJ
AMD 3020e[198] January 6, 2020 2 (2) 1.2 2.6 192:12:4
3 CU
1000 MHz 384 FP5 DDR4-2400
dual-channel
YM3020C7T2OFG
Athlon Silver 3050e[199] 2 (4) 1.4 2.8 YM3050C7T2OFG
Athlon PRO 3045B Q1 2021 2 (2) 2.3 3.2 128:8:4
2 CU
1100 MHz 281.6 12-25 W YM3045C4T2OFG
Athlon Silver 3050U[200] January 6, 2020 YM3050C4T2OFG
Athlon Silver 3050C[201] September 22, 2020 YM305CC4T2OFG
Athlon PRO 3145B Q1 2021 2 (4) 2.6 3.3 192:12:4
3 CU
1000 MHz 384 YM3145C4T2OFG
Athlon Gold 3150U[202] January 6, 2020 YM3150C4T2OFG
Athlon Gold 3150C[203] September 22, 2020 YM315CC4T2OFG
Ryzen 3 3250U[204] January 6, 2020 2.6 3.5 1200 MHz 460.8 YM3250C4T2OFG
Ryzen 3 3250C[205] September 22, 2020 YM325CC4T2OFG
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Embedded APUs[]

G-Series[]

Brazos: "Ontario" and "Zacate" (2011)[]

  • Fabrication 40 nm
  • Socket FT1 (BGA-413)
  • CPU microarchitecture: Bobcat[206]
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
  • GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
  • Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
  • 5 GT/s UMI
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2
G-Series T24L Mar 1, 2011
May 23, 2011
40nm B0 1 (1) 0.8
1.0
32 KB inst.
32 KB data

per core
512 KB N/A 1066 5 GET24LFPB12GTE
GET24LFQB12GVE
G-Series T30L Mar 1, 2011
May 23, 2011
1.4 18 GET30LGBB12GTE
GET30LGBB12GVE
G-Series T48L Mar 1, 2011
May 23, 2011
2 (2) 2 × 512 KB GET48LGBB22GTE
GET48LGBB22GVE
G-Series T16R Jun 25, 2012 B0 1 (1) 0.615 512 KB HD 6250 80:8:4 276 44.1 (L)1066 4.5 GET16RFWB12GVE
G-Series T40R May 23, 2011 1.0 280 44.8 1066 5.5 GET40RFQB12GVE
G-Series T40E 2 (2) 2 × 512 KB 6.4 GET40EFQB22GVE
G-Series T40N Jan 19, 2011
May 23, 2011
HD 6250
HD 6290
9 GET40NFPB22GTE
GET40NFPB22GVE
G-Series T40R May 23, 2011 1 (1) 512 KB HD 6250 5.5 GET40RFSB12GVE
G-Series T44R Jan 19, 2011
May 23, 2011
1.2 9 GET44RFPB12GTE
GET44RFPB12GVE
G-Series T48E Jun 25, 2012 2 (2) 1.4 2 × 512 KB 18 GET48EGBB22GVE
G-Series T48N Jan 19, 2011
May 23, 2011
HD 6310 500
520
80
83.2
GET48NGBB22GTE
GET48NGBB22GVE
G-Series T52R Jan 19, 2011
May 23, 2011
1 (1) 1.5 512 KB 500 80 1066
1333
GET52RGBB12GTE
GET52RGBB12GVE
G-Series T56E Jun 25, 2012 2 (2) 1.65 2 × 512 KB HD 6250 275 44 1333 GET56EGBB22GVE
G-Series T56N Jan 19, 2011
May 23, 2011
1.6
1.65
HD 6310
HD 6320
500 80 1066
1333
GET56NGBB22GTE
GET56NGBB22GVE
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Kabini" (2013, SoC)[]

  • Fabrication 28 nm
  • Socket FT3 (769-BGA)[207]
  • CPU microarchitecture: Jaguar
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module (TPM) 1.2 support
  • GPU microarchitecture: Graphics Core Next (GCN) with Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.)
  • Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
  • Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0 (except GX-210JA)
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-210UA Un­known 28nm B0 2 (2) [1] 1.0 32 KB inst.
32 KB data

per core
1 N/A 1333 8.5 0-90 GE210UIGJ23HM
GX-210JA Jul 30, 2013 HD 8180E 128:8:4
2 CU
225 57.6 1066 6 GE210JIHJ23HM
GX-209HA Un­known HD 8400E 600 153.6 9 -40-105 GE209HISJ23HM
GX-210HA Jun 1, 2013 HD 8210E 300 76.8 1333 0-90 GE210HICJ23HM
GX-217GA 1.65 HD 8280E 450 115.2 1600 15 GE217GIBJ23HM
GX-411GA Un­known 4 (4) [2] 1.1 2 HD 8210E 300 76.8 1066 -40-105 GE411GIRJ44HM
GX-415GA Jun 1, 2013 1.5 HD 8330E 500 128 1600 0-90 GE415GIBJ44HM
GX-416RA 1.6 N/A GE416RIBJ44HM
GX-420CA 2.0 HD 8400E 128:8:4
2 CU
600 153.6 25 GE420CIAJ44HM
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Steppe Eagle" (2014, SoC)[]

  • Fabrication 28 nm
  • Socket FT3b (769-BGA)
  • CPU microarchitecture: Puma
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-210JC June 4, 2014 28nm ML-A1 2 (2) [1] 1.0 32 KB inst.
32 KB data

per core
1 R1E 128:8:4
2 CU
267 68.3 1600 6 -40-105 GE210JIZJ23JB
GX-212JC 1.2 R2E 300 76.8 1333 0-90 GE212JIYJ23JB
GX-216HC 1.6 R4E 1066 10 -40-105 GE216HHBJ23JB
GX-222GC 2.2 R5E 655 167.6 1600 15 0-90 GE222GITJ23JB
GX-412HC 4 (4) [2] 1.2 2 R3E 300 76.8 1333 7 GE412HIYJ44JB
GX-424CC 2.4 R5E 497 127.2 1866 25 GE424CIXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Crowned Eagle" (2014, SoC)[]

  • Fabrication 28 nm
  • Socket FT3b (769-BGA)
  • CPU microarchitecture: Puma
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • no GPU
Model Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Junction

temperature

(°C)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a]
L1 L2

(MB)

GX-224PC June 4, 2014 28nm 2 (2) [1] 2.4 32 KB inst.
32 KB data

per core
1 N/A 1866 25 0-90 GE224PIXJ23JB
GX-410VC 4 (4) [2] 1.0 2 1066 7 -40-105 GE410VIZJ44JB
GX-412TC 1.2 1600 6 0-90 GE412TIYJ44JB
GX-420MC 2.0 17.5 GE420MIXJ44JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]

LX-Family (2016, SoC)[]

  • Fabrication 28 nm
  • Socket FT3b (769-BGA)
  • 2 Puma x86 cores with 1MB shared L2 cache
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
  • GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
  • Single channel 64-bit DDR3 memory with ECC
  • Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
Cores
(threads)
[FPUs]
Clock

(GHz)

Cache[a] Model Config Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-208JL Feb 23, 2016 28nm ML-A1 2 0.8 32 KB inst.
32 KB data

per core
1 R1E 64:4:1
1 CU
267 34.1 1333 6 GE208JIVJ23JB
GX-210HL 2017 1.0 1066 7 GE208HIZJ23JB
GX-210JL Feb 23, 2016 1333 6 GE210JIVJ23JB
GX-210KL 2017 4.5 GE210KIVJ23JB
GX-215GL Feb 23, 2016 1.5 497 63.6 1600 15 GE215GITJ23JB
GX-218GL 1.8 GE218GITJ23JB
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

I-Family: "Brown Falcon" (2016, SoC)[]

  • Fabrication 28 nm
  • Socket FP4[208]
  • 2 or 4 Excavator x86 cores with 1MB shared L2 cache
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
  • GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
  • Dual channel 64-bit DDR4 or DDR3 memory with ECC
  • 4K × 2K H.265 decode capability and multi format encode and decode
  • Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports
Model Released Fab CPU GPU Memory
support
TDP

(W)

Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-217GI Feb 23, 2016 28nm [1] 2 1.7 2.0 96 KB inst.
per module

32 KB data
per core
1 R6E 256:16:4
4 CU
758 388 DDR3/DDR4-1600 15 GE217GAAY23KA
GX-420GI[209][210] 2016 [2] 4 2.0 2.2 2 R6E


R7E
256:16:4
4 CU

384:24:4
6 CU
758


626
388


480.7
DDR4-1866 16.1 GE420GAAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

J-Family: "Prairie Falcon" (2016, SoC)[]

  • Fabrication 28 nm
  • Socket FP4[211]
  • 2 "Excavator+" x86 cores with 1MB shared L2 cache
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
  • GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
  • Single channel 64-bit DDR4 or DDR3 memory
  • 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
  • Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports
Model Released Fab CPU GPU Memory
support
TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo Processing
power
(GFLOPS)[b]
L1 L2

(MB)

GX-212JJ 2018 28nm [1] 2 1.2 1.6 96 KB inst.
per module

32 KB data
per core
1 R1E 64:4:1
1 CU
600 N/A 76.8 DDR3-1333
DDR4-1600
6–

10

0-90 GE212JAWY23AC
GX-215JJ 2017 1.5 2.0 R2E 128:8:2
2 CU
153.6 DDR3-1600
DDR4-1866
GE215JAWY23AC
GX-220IJ 2018 2.0 2.2 10–

15

GE220IAVY23AC
GX-224IJ 2017 2.4 2.8 R4E 192:12:3
3 CU
230.4 DDR3-1866
DDR4-2133
GE224IAVY23AC
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

R-Series[]

Comal: "Trinity" (2012)[]

  • Fabrication 32 nm
  • Socket FP2 (BGA-827), FS1r2
  • CPU microarchitecture: Piledriver
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,[29] ABM, BMI1, TBM
  • GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
  • Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
  • 2.5 GT/s UMI
  • Die size: 246 mm²; Transistors: 1.303 billion
  • OpenCL 1.1 and OpenGL 4.2 support
Model Released Fab Step. CPU GPU DDR3

Memory
support

TDP

(W)

Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

R-252F May 21, 2012 32nm B0 [1] 2 1.9 2.4 64 KB inst.
per module

16 KB data
per core
1 HD 7400G 192:12:4
3 CU
333 417 127.8 1333 17 RE252FSHE23HJE
R-260H 2.1 2.6 2? HD 7500G 256:16:8
4 CU
327 424 167.4 RE260HSHE24HJE
R-268D 2.5 3.0 1 HD 7420G 192:12:4
3 CU
470 640 180.4 1600 35 RE268DDEC23HJE
R-272F 2.7 3.2 HD 7520G 497 686 190.8 RE272FDEC23HJE
R-452L [2] 4 1.6 2.4 2 × 2 MB HD 7600G 256:16:8
4 CU
327 424 167.4 19 RE452LSHE44HJE
R-460H 1.9 2.8 HD 7640G 497 655 254.4 35 RE460HDEC44HJE
R-460L 2.0 HD 7620G 384:24:8
6 CU
360 497 276.4 1333 25 RE460LSIE44HJE
R-464L 2.3 3.2 HD 7660G 497 686 381.6 1600 35 RE464LDEC44HJE
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Bald Eagle" (2014)[]

  • Fabrication 28 nm
  • Socket FP3
  • Up to 4 Steamroller x86 cores[212]
  • L1 Cache: 16 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,[29] ABM, BMI1, TBM
  • GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
  • Dual channel DDR3 memory with ECC
  • Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0
Model Released Fab CPU GPU DDR3

Memory
support

TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(MHz)

Turbo

(MHz)

Processing
power
(GFLOPS)[b]
L1 L2

(MB)

RX-219NB May 20, 2014 28nm [1] 2 2.2 3.0 96 KB inst.
per module

16 KB data
per core
1 N/A 1600 15-

17

0-100 RE219NECH23JA
RX-225FB R4 192:12:4
3 CU
464 533 178.1 RE225FECH23JA
RX-425BB [2] 4 2.5 3.4 4 R6 384:24:8
6 CU
576 654 442.3 1866 30-

35

RE425BDGH44JA
RX-427BB 2.7 3.6 R7 512:32:8
8 CU
600 686 614.4 2133 30-

35

RE427BDGH44JA
RX-427NB N/A RE427NDGH44JA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Merlin Falcon" (2015, SoC)[]

  • Fabrication 28 nm
  • Socket
  • Up to 4 Excavator x86 cores[213]
  • L1 Cache: 32 KB Data per core and 96 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
  • GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
  • Dual channel 64-bit DDR4 or DDR3 memory with ECC
  • Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
  • Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
  • Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART
Model Released Fab Stepping CPU GPU Memory
support
TDP

(W)

Junction temperature (°C) Part number
[Modules/FPUs]
Cores/threads
Clock

(GHz)

Turbo

(GHz)

Cache[a] Model Config[note 1] Clock

(GHz)

Turbo Processing
power
(GFLOPS)[b]
L1 L2

(MB)

L3
RX-216TD October 21, 2015 28nm [1] 2 1.6 3.0 96 KB inst.
per module

32 KB data
per core
1 N/A N/A DDR3/DDR4-1600 12-

15

0-90 RE216TAAY23KA
RX-216GD R5 256:?:?
4 CU
0.8 N/A 409.6 RE216GAAY23KA
RX-416GD [2] 4 2.4 2 R6 384:?:?
6 CU
0.72 552.9 15 -40-105 RE416GATY43KA
RX-418GD October 21, 2015 1.8 3.2 384:?:?
6 CU
0.8 614.4 DDR3-2133
DDR4-2400
12-

35

0-90 RE418GAAY43KA
RX-421BD 2.1 3.4 R7 512:?:?
8 CU
819.2 RE421BAAY43KA
RX-421ND N/A RE421NAAY43KA
  1. ^ AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27]
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

1000-Series[]

V1000-Family: "Great Horned Owl" (2018, SoC)[]

  • Fabrication 14 nm by GlobalFoundries
  • Up to 4 Zen cores
  • Socket FP5
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual channel DDR4 memory with ECC
  • Fifth generation GCN based GPU
Model Release
date
Fab CPU GPU DDR4
Memory
support
Ethernet TDP Junction
temperature
(°C)
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
V1500B[214] December 2018 GloFo
14LP
4 (8) 2.2 N/A 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB N/A 2400
dual-channel
2× 10GbE 12–25 W 0–105
V1780B[214] 3.35 3.6 3200
dual-channel
35–54 W
V1202B[214] February 2018 2 (4) 2.3 3.2 RX Vega 3 192:12:16
3 CU
1.0 384 2400
dual-channel
12–25 W
V1404I[214] December 2018 4 (8) 2.0 3.6 RX Vega 8 512:32:16
8 CU
1.1 1126.4 −40 – 105
V1605B[214] February 2018 0–105
V1756B[214] 3.25 1.3 1331.2 3200
dual-channel
35–54 W
V1807B[214] 3.35 3.8 RX Vega 11 704:44:16
11 CU
1830.4
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


R1000-Family: "Banded Kestrel" (2019, SoC)[]

  • Fabrication 14 nm by GlobalFoundries
  • Up to 2 Zen cores
  • Socket FP5
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
  • Dual channel DDR4 memory with ECC
  • Fifth generation GCN based GPU
Model Release
date
Fab CPU GPU Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Model Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost XFR L1 L2 L3
R1102G [215] February 25, 2020 GloFo
14LP
2 (2) 1.2 2.6 Un­known 64 KB inst.
32 KB data
per core
512 KB
per core
4 MB RX Vega 3 192:12:4
3 CU
1.0 384 DDR4-2400
single-channel
6 W
R1305G[215] 2 (4) 1.5 2.8 Un­known DDR4-2400
dual-channel
8-10 W
R1505G[215] April 16, 2019 2.4 3.3 Un­known 12–25 W
R1606G[215] 2.6 3.5 Un­known 1.2 460.8
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


2000-Series[]

V2000-Family: "Grey Hawk" (2020, SoC)[]

  • Fabrication 7 nm by TSMC
  • Up to 8 Zen 2 cores
  • Fifth generation GCN based GPU
Model Release
date
Fab CPU GPU Socket PCIe
support
Memory
support
TDP
Cores
(threads)
Clock rate (GHz) Cache Architecture Config[i] Clock
(GHz)
Processing
power
(GFLOPS)[ii]
Base Boost L1 L2 L3
V2516[216][217] November 10, 2020[218] TSMC
7FF
6 (12) 2.1 3.95 32 KB inst.
32 KB data
per core
512 KB
per core
8 MB GCN 5th gen 384:24:8
6 CU
1.5 1152 FP6 PCIe 3.0 ×20
8+4+4+4
DDR4-3200
dual-channel

LPDDR4X-4266
quad-channel
10-25 W
V2546[216][217] 3.0 3.95 35-54 W
V2718[216][217] 8 (16) 1.7 4.15 448:28:8
7 CU
1.6 1433.6 10-25 W
V2748[216][217] 2.9 4.25 35-54 W
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  2. ^ Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.


Custom APUs[]

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit.[219] Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.[220] So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

Chip
(device)
Release date Fab Die area (mm2) CPU GPU Memory Storage API support Special features
Archi-
tecture
Cores Clock (GHz) L2 cache Archi-
tecture
Core config[a] Clock (MHz) GFLOPS [b] Pixel fillrate (GP/s) [c] Texture fillrate (GT/s) [d] Other Size Bus type & width Band-
width (GB/s)
Audio Other
Liverpool
(PS4)
Nov 2013 28 nm 348 Jaguar 8 cores 1.6 2× 2 MiB GCN 2 1152:72:32
18 CU
800 1843 25.6 57.6 8 ACEs 8 GiB GDDR5
256-bit
176 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2, GNM, GNMX and PSSL Dolby Atmos (BD)
S/PDIF
PS VR
PS4 additional modules
HDR10 (except discs)[e]
CEC
Optional IR sensor
Durango
(Xbox One)
Nov 2013 363 1.75 768:48:16
12 CU
853 1310 13.6 40.9 2 ACEs 32 MiB ESRAM[f] 204 3DBD/DVD/CD
1× 2.5" SATA hard drive
USB 3.0
Direct3D 11.2 and 12 Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One additional modules
FreeSync (1)
HDMI 1.4 through
IR sensor and IR out port
Kensington lock
8 GiB DDR3
256-bit
68
Edmonton
(Xbox One S) [221]
Jun 2016 16 nm 240 914 1404 14.6 43.9 2 ACEs 32 MiB ESRAM 219 4KBD/3DBD/DVD/CD[g]
1× 2.5" SATA hard drive
USB 3.0
Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One S additional modules
Fully HDR10
Dolby Vision (streaming)
FreeSync (1&2)
HDMI 1.4 through
IR sensor and IR out port
Kensington lock
8 GiB DDR3
256-bit
68
(PS4 Slim) Sep 2016 208 1.6 1152:72:32
18 CU
800 1843 25.6 57.6 8 ACEs 8 GiB GDDR5
256-bit
176 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2, GNM, GNMX and PSSL Dolby Atmos (BD) PS VR
PS4 Slim additional modules
HDR10 (except discs)
CEC
Optional IR sensor
Neo
(PS4 Pro) [222][223][224]
Nov 2016 325 2.13 GCN 4
Polaris
[225]
2304:144:32
36 CU
911 4198 58.3 131.2 4 ACEs and 2 HWS
Double-rate FP16[h]
checkerboard rendering
8 GiB
[226]
GDDR5
256-bit
218 3DBD/DVD
1× 2.5" SATA hard drive
Easily replaceable hard drive
USB 3.0
OpenGL 4.2 (4.5), GNM, GNMX and PSSL Dolby Atmos (BD)
S/PDIF
PS VR
PS4 Pro additional modules
HDR10 (except discs)
Up to 4K@60 Hz
CEC
Optional IR sensor
1 GiB DDR3[i] ?
Scorpio
(Xbox One X) [227][228][229]
Nov 2017 359 Customized
Jaguar
2.3 2560:160:32
40 CU
1172 6001 37.5 187.5 4 ACEs and 2 HWS 12 GiB GDDR5
384-bit
326 4KBD/3DBD/DVD/CD
1× 2.5" SATA hard drive
USB 3.0
Direct3D 11.2 and 12 Fully Dolby Atmos, DTS:X, and Windows Sonic
S/PDIF
Xbox One X additional modules
Fully HDR10
Dolby Vision (streaming)
FreeSync (1&2)
Up to 4K@60 Hz
HDMI 1.4b through
IR sensor and IR out port
Fenghuang
() [230][231][232]
cancelled [233] 14 nm [234] 397 Zen 4 cores
8 threads
3.0 GCN 5
Vega
1536:96:32
24 CU
1300 3994 41.6 124.8 Double-rate FP16 8 GiB GDDR5
256-bit
154 1× 2.5" SATA SSD
1× 2.5" SATA hard drive
Easily replaceable drives
USB 3.0
Vulkan 1.1, Direct3D 12.1 S/PDIF Subor Z Plus additional modules
Windows 10 Enterprise LTSC
Oberon
(PS5) [235]
Nov 2020 7 nm 308 Zen 2 8 cores
16 threads
3.5 (variable) RDNA 2
Big Navi
2304:144:64
36 CU
2233 (variable) 10290 (variable) 142.9 321.6 Double-rate FP16
Real-time ray tracing
Primitive shaders
Custom 3D audio blocks
16 GiB GDDR6
256-bit
448 4KBD
Custom 5.5 GB/s PCIe 4.0 x4 NVMe SSD
PCIe 4.0 M.2 slot
Easily replaceable M.2 SSD
USB (except PS5 games)
Vulkan 1.2 PS5 TEMPEST 3D AudioTech PS VR
Dedicated DMA controller and I/O coprocessors
Custom coherency engines and cache scrubbers
Custom decompression block
HDR
Up to 4K@120 Hz
Up to 8K@30 Hz
Anaconda
(Xbox Series X)
Nov 2020 360 3.6
(3.8 w/o SMT)
3328:208:64
52 CU
1825 12147 116.8 379.6 Double-rate FP16
Real-time ray tracing
Mesh shaders
Variable rate shading
ANN acceleration
10 GiB GDDR6
320-bit
560 4KBD
Custom 2.4 GB/s NVMe SSD
Custom expansion card
USB 3.1 (except XSX games)
DirectX 12 Ultimate Custom spatial audio block
MS Project Acoustics
Fully Dolby Atmos, DTS:X, and Windows Sonic
Custom decompression block
HDR
VRR
Up to 4K@120 Hz
Up to 8K@30 Hz
CEC
6 GiB GDDR6
192-bit[j]
336
Lockhart
(Xbox Series S)
197 3.4
(3.6 w/o SMT)
1280:80:32
20 CU
1565 4006 50.1 125.2 8 GiB GDDR6
128-bit
224
2 GiB GDDR6
32-bit
56

Mero (Steam Deck)[236]
Dec 2021 4 cores
8 threads
2.4-3.5 RDNA 2 512:32:??
8 CU
1000-1600 1000-1600 32-51.2 Double-rate FP16
Real-time ray tracing
Variable rate shading
16 GiB LPDDR5
128-bit
88 64 GB eMMC (PCIe Gen 2 x1)
256 GB NVMe SSD (PCIe Gen 3 x4)
512 GB NVMe SSD (PCIe Gen 3 x4)
microSD card slot
  1. ^ Unified Shaders : Texture Mapping Units : Render Output Units
  2. ^ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed.
  4. ^ Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed.
  5. ^ UHD BD is the only video disc format supporting HDR.
  6. ^ Cache
  7. ^ "Digital" version does not have an optical drive.
  8. ^ Feature preview of Rapid Packed Math, introduced in GCN 5 Vega.
  9. ^ Swap
  10. ^ A plain 320-bit 20GiB version could be made by just replacing four 1 GiB GDDR6 chips by 2 GiB ones.

See also[]

Notes[]

  1. ^ a b c d e Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs

References[]

  1. ^ "AMD Announces the 7th Generation APU: Excavator mk2 in Bristol Ridge and Stoney Ridge for Notebooks". 31 May 2016. Retrieved 3 January 2020.
  2. ^ "AMD Mobile "Carrizo" Family of APUs Designed to Deliver Significant Leap in Performance, Energy Efficiency in 2015" (Press release). 20 November 2014. Retrieved 16 February 2015.
  3. ^ "The Mobile CPU Comparison Guide Rev. 13.0 Page 5 : AMD Mobile CPU Full List". TechARP.com. Retrieved 13 December 2017.
  4. ^ a b "AMD VEGA10 and VEGA11 GPUs spotted in OpenCL driver". VideoCardz.com. Retrieved 6 June 2017.
  5. ^ Cutress, Ian (1 February 2018). "Zen Cores and Vega: Ryzen APUs for AM4 – AMD Tech Day at CES: 2018 Roadmap Revealed, with Ryzen APUs, Zen+ on 12nm, Vega on 7nm". Anandtech. Retrieved 7 February 2018.
  6. ^ Larabel, Michael (17 November 2017). "Radeon VCN Encode Support Lands in Mesa 17.4 Git". Phoronix. Retrieved 20 November 2017.
  7. ^ a b "AMD Ryzen 5000G 'Cezanne' APU Gets First High-Res Die Shots, 10.7 Billion Transistors In A 180mm2 Package". wccftech. Aug 12, 2021. Retrieved August 25, 2021.{{cite web}}: CS1 maint: url-status (link)
  8. ^ Tony Chen; Jason Greaves, "AMD's Graphics Core Next (GCN) Architecture" (PDF), AMD, retrieved 13 August 2016
  9. ^ "A technical look at AMD's Kaveri architecture". Semi Accurate. Retrieved 6 July 2014.
  10. ^ "How do I connect three or More Monitors to an AMD Radeon™ HD 5000, HD 6000, and HD 7000 Series Graphics Card?". AMD. Retrieved 8 December 2014.
  11. ^ Airlie, David (26 November 2009). "DisplayPort supported by KMS driver mainlined into Linux kernel 2.6.33". Retrieved 16 January 2016.
  12. ^ "Radeon feature matrix". freedesktop.org. Retrieved 10 January 2016.
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